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OPA2683IDGSR

Texas Instruments

OPA2683IDGSR by Texas Instruments

OPA2683IDGSR by Texas Instruments is a dual operational amplifier with 10 terminals in a small outline, thin profile package. It features bipolar technology, nickel palladium gold terminal finish, and operates at industrial temperature grade. Ideal for applications requiring precise signal amplification in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,801 parts In-Stock

1+ parts

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5,801

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Digiode

USA . 3,889 parts In-Stock

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3,889

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,697 parts In-Stock

1+ parts

$1.935

100+ parts

-

1k+ parts

$2.469

10k+ parts

-

1,697

$1.935

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$2.469

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DigiPath Technology Company

USA . 698 parts In-Stock

1+ parts

$2.131

100+ parts

$1.960

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-

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698

$2.131

$1.960

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ChromeModa Solutions

Germany . 4,315 parts In-Stock

1+ parts

$2.174

100+ parts

$1.783

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4,315

$2.174

$1.783

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IDEA Electronic Components Group

UK . 936 parts In-Stock

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$2.174

100+ parts

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$1.957

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936

$2.174

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$1.957

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One Stop Electronics

USA . 835 parts In-Stock

1+ parts

$5.410

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835

$5.410

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Ampacity Inc.

Singapore . 181 parts In-Stock

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$9.410

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181

$9.410

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AZTECH Wire

Italy . 329 parts In-Stock

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$12.023

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329

$12.023

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QUARKTWIN TECHNOLOGY LTD

USA . 21,242 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,977 parts In-Stock

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4,977

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Corphita

USA . 4,026 parts In-Stock

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4,026

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Microchip USA

USA . 3,838 parts In-Stock

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Aranea Global

USA . 50 parts In-Stock

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50

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Overview

Unleash the power of precision with the OPA2683IDGSR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unparalleled quality in their operational amplifiers. This versatile component is perfect for a wide range of applications, offering exceptional performance and reliability. Elevate your projects with the OPA2683IDGSR and experience the value it brings to your designs. Choose Texas Instruments for superior products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides good insulation and protection, making the product durable and reliable.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during production.

No. of Functions: 2

Having multiple functions in one component increases versatility and functionality, making it suitable for various applications.

Package Shape: SQUARE

Square package shape facilitates neater and more compact PCB designs, optimizing space utilization.

No. of Terminals: 10

Having a sufficient number of terminals allows for multiple connection options, enhancing flexibility in circuit configurations.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides excellent conductivity and corrosion resistance, ensuring long-term performance and reliability.

Maximum Seated Height: 1.1 mm

Low seated height enables the product to be used in compact systems or applications with limited space.

Width: 3 mm

Compact width dimensions make the product suitable for miniaturized designs without sacrificing performance.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance allows for reliable soldering and assembly processes, ensuring quality production.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the product can operate in harsh environmental conditions typically found in industrial applications.

Technology: BIPOLAR

Bipolar technology offers stable and high-performance characteristics, making the product suitable for precision applications.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifier type provides amplification and signal processing capabilities, making the product ideal for various electronic circuits.

Terminal Pitch: 0.5 mm

Small terminal pitch allows for high-density mounting and space-efficient PCB designs, enhancing overall system integration.

Moisture Sensitivity Level (MSL): 2

MSL 2 indicates moderate moisture sensitivity, ensuring the product's reliability and performance in varying humidity conditions.

Technical Specifications

Operational Amplifiers (Op Amps) OPA2683IDGSR attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

BIPOLAR

Total Functions:

2

Sub-Category:

Operational Amplifiers

Operational Characteristics

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

10

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

2

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PDSO-G10

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Trade Compliance

OPA2683IDGSR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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