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OPA2682U

Texas Instruments

OPA2682U by Texas Instruments

OPA2682U by Texas Instruments is a dual-buffer amplifier with a bandwidth of 330MHz, ideal for industrial applications. It operates at temperatures ranging from -40 to 85°C and has a max supply voltage of ±6.5V. With a small outline package style and gull wing terminal form, it offers high slew rates of up to 2100V/μs for precise signal amplification in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,477 parts In-Stock

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5,477

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Digiode

USA . 1,349 parts In-Stock

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1,349

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Semtec, LLC

USA . 636 parts In-Stock

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636

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ComSIT Distribution GmbH

Germany . 300 parts In-Stock

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300

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ComSIT USA

USA . 300 parts In-Stock

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300

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Cyclops Electronics Ltd

UK . 10 parts In-Stock

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10

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Distributors (Availability)

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One Stop Electronics

USA . 1,943 parts In-Stock

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$4.410

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$4.410

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Parana Technologies

USA . 2,141 parts In-Stock

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$6.149

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$6.919

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2,141

$6.149

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$6.919

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ChromeModa Solutions

Germany . 2,419 parts In-Stock

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$6.909

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$5.665

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$6.909

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IDEA Electronic Components Group

UK . 1,003 parts In-Stock

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$6.909

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$6.218

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1,003

$6.909

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$6.218

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AZTECH Wire

Italy . 234 parts In-Stock

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$18.177

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Component Stockers USA

USA . 350 parts In-Stock

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$99.990

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350

$99.990

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Corphita

USA . 2,286 parts In-Stock

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2,286

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DigiPath Technology Company

USA . 2,177 parts In-Stock

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$6.229

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$6.229

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Overview

Elevate your electronics with the OPA2682U by Texas Instruments! As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality buffer amplifiers that are essential for a wide range of applications. With a compact design and high-performance capabilities, this dual-function amplifier offers exceptional value and benefits to customers looking for reliable and efficient solutions. Take your projects to the next level with the OPA2682U and experience the advantages of Texas Instruments' cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and lightweight, suitable for various applications.

Maximum Input Offset Voltage: 7500 uV

Low input offset voltage ensures minimal error in signal amplification, resulting in accurate output.

Surface Mount: YES

Surface mount design allows for easy and convenient installation on PCBs, saving space and reducing assembly costs.

Nominal Supply Voltage / Vsup (V): 5

Stable nominal supply voltage of 5V ensures reliable performance of the buffer amplifier.

Minimum Slew Rate: 1200 V/us

Fast minimum slew rate of 1200V/us enables quick response to input signal changes, ideal for high-speed applications.

Maximum Operating Temperature: 85 °C

Wide operating temperature range of -40 to 85°C allows for use in harsh environments.

Technology: BIPOLAR

Bipolar technology offers high precision and low noise performance, making it suitable for demanding applications.

Amplifier Type: BUFFER

Buffer amplifier type ensures isolation between input and output, preventing signal distortion and maintaining signal integrity.

Technical Specifications

Buffer Amplifiers OPA2682U attributes and parameters. Explore more Buffer Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

Bipolar

Power Supply:

5/±5 V

Total Functions:

2

Sub-Category:

Buffer Amplifiers

Performance Specifications

Nominal Bandwidth (3dB):

330 MHz

Minimum Slew Rate:

1200 V/us

Nominal Slew Rate:

2100 V/us

Input Offset Voltage Limit:

7.5 mV

Maximum Bias Current (IIB) @25 °C:

55 uA

Operational Characteristics

Maximum Supply Current:

13.2 mA

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

6.5 V

Nominal Negative Supply Voltage (Vsup):

-5 V

Maximum Negative Supply Voltage:

-6.5 V

Lowest Output Current:

80 mA

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Style:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

OPA2682U Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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