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OPA234UAG4

Texas Instruments

OPA234UAG4 by Texas Instruments

OPA234UAG4 by Texas Instruments is an Operational Amplifier with a low input offset voltage of 500 uV and micropower consumption of 0.35 mA. Ideal for automotive applications, it offers a high common mode rejection ratio of 106 dB and operates within a wide temperature range from -40 to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,768 parts In-Stock

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8,768

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Digiode

USA . 193 parts In-Stock

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193

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,242 parts In-Stock

1+ parts

$6.061

100+ parts

-

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$6.838

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2,242

$6.061

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$6.838

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DigiPath Technology Company

USA . 1,932 parts In-Stock

1+ parts

$6.674

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1,932

$6.674

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ChromeModa Solutions

Germany . 4,248 parts In-Stock

1+ parts

$6.810

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$5.584

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4,248

$6.810

$5.584

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IDEA Electronic Components Group

UK . 2,059 parts In-Stock

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$6.810

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$6.129

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2,059

$6.810

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$6.129

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One Stop Electronics

USA . 805 parts In-Stock

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$8.410

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805

$8.410

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AZTECH Wire

Italy . 318 parts In-Stock

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$13.690

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318

$13.690

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Corphita

USA . 1,605 parts In-Stock

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Microchip USA

USA . 108 parts In-Stock

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Overview

Enhance your electronic projects with the OPA234UAG4 by Texas Instruments, a high-quality operational amplifier designed to deliver precision and reliability. Manufactured by industry leader Texas Instruments, this Op Amp is perfect for a wide range of applications, from audio amplification to sensor signal conditioning. With its low-offset, micropower design and advanced technology, the OPA234UAG4 offers exceptional performance and efficiency, making it a valuable addition to any project. Experience superior quality and unmatched value with the OPA234UAG4 from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product suitable for various applications.

Maximum Input Offset Voltage: 500 uV

Low input offset voltage ensures accuracy in signal processing and minimizes errors.

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and reducing assembly time.

Nominal Common Mode Reject Ratio: 106 dB

High common mode rejection ratio helps in reducing noise and interference from the input signal.

Nominal Supply Voltage/Vsup (V): 15

Operates efficiently at a nominal supply voltage of 15V, suitable for many electronic systems.

Technology: BIPOLAR

Bipolar technology offers good performance in terms of accuracy, linearity, and stability.

Nominal Unity Gain Bandwidth: 350 kHz

High unity gain bandwidth allows for efficient amplification of signals across a wide range of frequencies.

Nominal Slow Rate: 0.2 V/us

Low slow rate helps in preventing oscillations and ensuring stability in signal amplification.

Technical Specifications

Operational Amplifiers (Op Amps) OPA234UAG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±1.35/±18/2.7/36 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Offset:

Yes

Micropower:

Yes

Performance Specifications

Nominal Unity Gain Bandwidth:

350 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

106 dB

Input Offset Voltage Limit:

500 uV

Minimum Voltage Gain:

19950

Nominal Slew Rate:

0.2 V/us

Peak Bias Current:

-50 nA

Maximum Bias Current (IIB) @25 °C:

50 nA

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Supply Voltage:

18 V

Maximum Negative Supply Voltage:

-15 V

Minimum Negative Supply Voltage:

-18 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

350 μA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

OPA234UAG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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