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OPA2348TDB1

Texas Instruments

OPA2348TDB1 by Texas Instruments

OPA2348TDB1 by Texas Instruments is an Operational Amplifier with 5000uV Max Input Offset Voltage, 1000kHz Nominal Unity Gain Bandwidth, and 0.065mA Max Supply Current. Ideal for precision signal conditioning in applications requiring low bias current and high common mode rejection ratio.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,755 parts In-Stock

1+ parts

-

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4,755

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Vyrian

USA . 3,506 parts In-Stock

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3,506

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 794 parts In-Stock

1+ parts

$1.154

100+ parts

$107.197

1k+ parts

$1.039

10k+ parts

-

794

$1.154

$107.197

$1.039

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DigiPath Technology Company

USA . 433 parts In-Stock

1+ parts

$1.271

100+ parts

-

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433

$1.271

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ChromeModa Solutions

Germany . 6,316 parts In-Stock

1+ parts

$1.297

100+ parts

$1.064

1k+ parts

-

10k+ parts

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6,316

$1.297

$1.064

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IDEA Electronic Components Group

UK . 2,270 parts In-Stock

1+ parts

$1.297

100+ parts

-

1k+ parts

$1.167

10k+ parts

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2,270

$1.297

-

$1.167

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One Stop Electronics

USA . 1,580 parts In-Stock

1+ parts

$3.410

100+ parts

-

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1,580

$3.410

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AZTECH Wire

Italy . 411 parts In-Stock

1+ parts

$11.744

100+ parts

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411

$11.744

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Microchip USA

USA . 1,457 parts In-Stock

1+ parts

$150.910

100+ parts

$148.280

1k+ parts

$146.970

10k+ parts

$145.660

1,457

$150.910

$148.280

$146.970

$145.660

Corphita

USA . 454 parts In-Stock

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454

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Overview

Experience superior performance and reliability with the OPA2348TDB1 operational amplifier from Texas Instruments. Known for their top-notch quality and innovative technology, Texas Instruments delivers advanced solutions that meet the needs of various applications. The OPA2348TDB1 offers exceptional value with its low input offset voltage and minimal bias current, making it ideal for precision instrumentation, sensor interfaces, and signal conditioning. Trust Texas Instruments to provide you with cutting-edge products that ensure optimal performance and efficiency in your designs.

Feature Benefit Bullets

Maximum Input Offset Voltage: 5000 uV

Low input offset voltage ensures accuracy in signal processing and output.

Maximum Average Bias Current (IIB): 0.00001 uA

Low bias current helps in maintaining stability and precision in amplification.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving in circuit design.

Nominal Common Mode Reject Ratio: 82 dB

High common mode rejection ratio helps in filtering out unwanted noise from input signals.

Nominal Unity Gain Bandwidth: 1000 kHz

High unity gain bandwidth allows for amplification of a wide range of frequencies effectively.

Technology: CMOS

CMOS technology offers low power consumption and high input impedance for efficient operation.

Amplifier Type: OPERATIONAL AMPLIFIER

Being an operational amplifier, this product is versatile and suitable for various signal processing applications.

Maximum Supply Current: 0.065 mA

Low supply current requirement helps in energy efficiency and reduces power consumption.

Technical Specifications

Operational Amplifiers (Op Amps) OPA2348TDB1 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

CMOS

Total Functions:

2

Sub-Category:

Operational Amplifiers

Performance Specifications

Nominal Unity Gain Bandwidth:

1 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

82 dB

Minimum Common Mode Rejection Ratio (CMRR ):

70 dB

Input Offset Voltage Limit:

5000 uV

Nominal Slew Rate:

0.5 V/us

Peak Bias Current:

10 pA

Operational Characteristics

Maximum Supply Current:

65 μA

Physical Characteristics

Length:

0.046 in (1.1668 mm)

Width:

0.02 in (0.5114 mm)

Total Terminals:

8

Terminal Position:

Upper

Terminal Form:

Surface Mount:

Yes

Standards

JESD-30 Code:

R-XUUC-N8

Packaging and Shipping

Packing Method:

Tube

Package Code:

DIE

Package Shape:

Package Style:

Uncased Chip

Trade Compliance

OPA2348TDB1 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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