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OPA2340TDF2

Texas Instruments

OPA2340TDF2 by Texas Instruments

OPA2340TDF2 by Texas Instruments is a CMOS operational amplifier with 500uV max input offset voltage, 5500kHz unity gain bandwidth, and 92dB nominal CMRR. Ideal for precision applications requiring low bias current and high common mode rejection such as sensor signal conditioning and instrumentation amplifiers.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,757 parts In-Stock

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8,757

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Digiode

USA . 559 parts In-Stock

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559

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Distributors (Availability)

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Parana Technologies

USA . 603 parts In-Stock

1+ parts

$3.022

100+ parts

-

1k+ parts

$3.532

10k+ parts

-

603

$3.022

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$3.532

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DigiPath Technology Company

USA . 1,781 parts In-Stock

1+ parts

$3.328

100+ parts

$3.062

1k+ parts

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1,781

$3.328

$3.062

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ChromeModa Solutions

Germany . 3,518 parts In-Stock

1+ parts

$3.396

100+ parts

$2.785

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3,518

$3.396

$2.785

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IDEA Electronic Components Group

UK . 162 parts In-Stock

1+ parts

$3.396

100+ parts

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$3.056

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162

$3.396

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$3.056

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One Stop Electronics

USA . 1,629 parts In-Stock

1+ parts

$3.410

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1,629

$3.410

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AZTECH Wire

Italy . 233 parts In-Stock

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$17.170

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233

$17.170

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Microchip USA

USA . 1,802 parts In-Stock

1+ parts

$53.810

100+ parts

$52.870

1k+ parts

$52.400

10k+ parts

$51.930

1,802

$53.810

$52.870

$52.400

$51.930

Corphita

USA . 3,335 parts In-Stock

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3,335

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Overview

Enhance your electronic designs with the OPA2340TDF2 from Texas Instruments, a top-tier manufacturer known for its quality and reliability. As a versatile operational amplifier, this product offers customers the perfect balance of precision, performance, and efficiency. Ideal for a wide range of applications, this Op Amp delivers exceptional value by providing low input offset voltage, high common mode rejection ratio, and minimal bias current. Trust Texas Instruments to bring you cutting-edge technology that exceeds expectations in every aspect. Elevate your projects with the OPA2340TDF2 and experience superior performance like never before.

Feature Benefit Bullets

Maximum Input Offset Voltage: 500 uV

Low input offset voltage ensures accuracy in signal processing, making this amplifier suitable for high precision applications.

Maximum Average Bias Current (IIB): 0.00001 uA

Very low bias current helps in minimizing errors and signal distortions, making this op amp ideal for applications requiring precise measurements.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and space in the design of electronic circuits.

Nominal Common Mode Reject Ratio: 92 dB

High common mode rejection ratio indicates the op amp's ability to reject unwanted noise signals, ensuring clean and accurate outputs in noisy environments.

Nominal Unity Gain Bandwidth: 5500 kHz

Wide unity-gain bandwidth allows for high frequency operation and fast response times, making this op amp suitable for applications requiring rapid signal processing.

Technology: CMOS

CMOS technology offers low power consumption and high input impedance, making this op amp energy-efficient and suitable for battery-powered devices.

Maximum Supply Current: 1.9 mA

Low supply current consumption is beneficial for applications where power efficiency is crucial, extending the battery life of portable devices.

Technical Specifications

Operational Amplifiers (Op Amps) OPA2340TDF2 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

CMOS

Total Functions:

2

Sub-Category:

Operational Amplifiers

Performance Specifications

Nominal Unity Gain Bandwidth:

5.5 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

92 dB

Minimum Common Mode Rejection Ratio (CMRR ):

80 dB

Input Offset Voltage Limit:

500 uV

Nominal Slew Rate:

6 V/us

Peak Bias Current:

10 pA

Maximum Bias Current (IIB) @25 °C:

10 pA

Operational Characteristics

Maximum Supply Current:

1.9 mA

Physical Characteristics

Length:

0.057 in (1.4436 mm)

Width:

0.056 in (1.4337 mm)

Total Terminals:

10

Terminal Position:

Upper

Terminal Form:

Surface Mount:

Yes

Standards

JESD-30 Code:

R-XUUC-N10

Packaging and Shipping

Packing Method:

Tube

Package Code:

DIE

Package Shape:

Package Style:

Uncased Chip

Trade Compliance

OPA2340TDF2 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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