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OP37ALB

Texas Instruments

OP37ALB by Texas Instruments

The Texas Instruments OP37ALB is a military-grade operational amplifier with low-offset voltage of 60uV, high voltage gain of 250000, and fast slew rate of 11V/us. Ideal for applications requiring precise signal amplification in harsh environments due to its bipolar technology and wide temperature range from -55°C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,552 parts In-Stock

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4,552

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Digiode

USA . 638 parts In-Stock

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638

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 627 parts In-Stock

1+ parts

$2.410

100+ parts

-

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627

$2.410

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Parana Technologies

USA . 130 parts In-Stock

1+ parts

$5.792

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$6.582

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130

$5.792

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$6.582

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DigiPath Technology Company

USA . 2,151 parts In-Stock

1+ parts

$6.378

100+ parts

$5.868

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2,151

$6.378

$5.868

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ChromeModa Solutions

Germany . 4,189 parts In-Stock

1+ parts

$6.508

100+ parts

$5.337

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4,189

$6.508

$5.337

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IDEA Electronic Components Group

UK . 2,057 parts In-Stock

1+ parts

$6.508

100+ parts

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$5.857

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2,057

$6.508

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$5.857

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AZTECH Wire

Italy . 494 parts In-Stock

1+ parts

$7.657

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494

$7.657

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Corphita

USA . 1,455 parts In-Stock

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1,455

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Overview

Experience unparalleled precision and reliability with the OP37ALB operational amplifier by Texas Instruments. Crafted with top-tier materials and cutting-edge technology, this op amp guarantees optimal performance in a wide range of applications. From audio equipment to industrial controls, the OP37ALB delivers superior voltage amplification with minimal offset voltage for pristine signal integrity. Trust in Texas Instruments to provide you with the quality and value you need for your next project. Elevate your designs with the OP37ALB today!

Feature Benefit Bullets

Package Body Material: METAL

Metal package provides excellent heat dissipation, ensuring the operational amplifier remains cool even under heavy load conditions.

Maximum Input Offset Voltage: 60 uV

Low input offset voltage ensures accurate signal processing and minimizes errors in the output signal.

Nominal Supply Voltage / Vsup (V): 15

Stable nominal supply voltage of 15V ensures consistent performance and reliable operation.

Minimum Slew Rate: 11 V/us

Fast slew rate allows the operational amplifier to respond quickly to changes in input signals, making it suitable for high-speed applications.

Maximum Operating Temperature: 125 °C

Wide operating temperature range of up to 125°C allows the operational amplifier to be used in various environments without overheating.

Technical Specifications

Operational Amplifiers (Op Amps) OP37ALB attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±15 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Frequency Compensation:

YES (AVCL>=5)

Low-Offset:

Yes

Performance Specifications

Input Offset Voltage Limit:

60 uV

Minimum Voltage Gain:

250000

Minimum Slew Rate:

11 V/us

Maximum Bias Current (IIB) @25 °C:

40 nA

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Supply Voltage:

22 V

Maximum Negative Supply Voltage:

-15 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Physical Characteristics

Total Terminals:

8

Terminal Position:

Bottom

Terminal Form:

Package Body Material:

Metal

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Screening Level:

38535Q/M;38534H;883B

Standards

JESD-30 Code:

O-MBCY-W8

Packaging and Shipping

Package Shape:

Package Style:

Cylindrical

Package Equivalence Code:

CAN8,.2

Trade Compliance

OP37ALB Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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