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NE556N/P3

Texas Instruments

NE556N/P3 by Texas Instruments

NE556N/P3 by Texas Instruments is a dual terminal analog waveform generator with 14 terminals. It operates at temperatures from 0 to 70°C, powered by 5/15V supplies. This bipolar technology device in rectangular package is ideal for commercial applications requiring precise waveform generation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,547 parts In-Stock

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5,547

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Digiode

USA . 1,188 parts In-Stock

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1,188

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J & M Industries LLC

USA . 16 parts In-Stock

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16

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Inland Empire Components Inc.

USA . 16 parts In-Stock

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16

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,444 parts In-Stock

1+ parts

$4.500

100+ parts

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1,444

$4.500

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AZTECH Wire

Italy . 394 parts In-Stock

1+ parts

$12.962

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394

$12.962

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Parana Technologies

USA . 1,204 parts In-Stock

1+ parts

$14.985

100+ parts

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$15.411

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1,204

$14.985

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$15.411

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DigiPath Technology Company

USA . 628 parts In-Stock

1+ parts

$16.500

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628

$16.500

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ChromeModa Solutions

Germany . 3,855 parts In-Stock

1+ parts

$16.837

100+ parts

$13.806

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3,855

$16.837

$13.806

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IDEA Electronic Components Group

UK . 382 parts In-Stock

1+ parts

$16.837

100+ parts

$15.995

1k+ parts

$15.153

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382

$16.837

$15.995

$15.153

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Corphita

USA . 3,943 parts In-Stock

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3,943

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Overview

Experience superior quality and reliability with the NE556N/P3 by Texas Instruments. As a leader in analog waveform generation, Texas Instruments ensures top-notch performance for a wide range of applications. From precision timing circuits to voltage-controlled oscillators, this versatile product delivers unmatched value and benefits to customers. Trust in Texas Instruments for cutting-edge technology and innovative solutions that meet your needs. Elevate your projects with the NE556N/P3 and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures a lightweight and durable package, making the product suitable for portable and long-lasting applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy and efficient integration into existing systems or circuits.

Power Supplies (V): 5/15

The product can operate on a range of power supplies (5V or 15V), providing flexibility in various voltage requirements.

No. of Terminals: 14

With 14 terminals, the product offers a wide range of connection options for different signal generation needs.

Package Style (Meter): IN-LINE

The in-line package style allows for easy installation and connection in a linear manner, facilitating neat and organized setups.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the product can withstand relatively high temperatures, ensuring reliable performance in various environments.

Minimum Operating Temperature: 0 °C

The product can operate at temperatures as low as 0°C, making it suitable for use in a wide range of temperature conditions.

Terminal Position: DUAL

The dual terminal position provides redundancy and flexibility in connecting the product, enhancing its reliability in signal generation applications.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that the product is suitable for standard commercial applications, making it versatile for various industries.

Technology: BIPOLAR

The bipolar technology used in the product ensures accurate and stable signal generation, making it ideal for precision analog waveform applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form allows for secure and robust connections, preventing signal disruptions and ensuring consistent performance.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch provides compatibility with standard connectors and components, simplifying the integration of the product into existing systems.

Technical Specifications

Analog Waveform Generation NE556N/P3 attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T14

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5/15

Sub-Category:

Analog Waveform Generation Functions

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

NE556N/P3 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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