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MSP432P411VTPZR

Texas Instruments

MSP432P411VTPZR by Texas Instruments

MSP432P411VTPZR by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family, offering 128KB RAM and 524288 ROM words. It features 26-Ch 16-Bit ADC channels, 8 DMA channels, and PWM support. Ideal for industrial applications requiring low power consumption and high-speed processing up to 24 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,424 parts In-Stock

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Digiode

USA . 3,411 parts In-Stock

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3,411

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Distributors (Availability)

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AZTECH Wire

Italy . 422 parts In-Stock

1+ parts

$8.322

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422

$8.322

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One Stop Electronics

USA . 673 parts In-Stock

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$21.000

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673

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Parana Technologies

USA . 1,011 parts In-Stock

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$44.502

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$44.502

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ChromeModa Solutions

Germany . 4,173 parts In-Stock

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$50.002

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$41.002

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$50.002

$41.002

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IDEA Electronic Components Group

UK . 1,846 parts In-Stock

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$50.002

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$47.502

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$45.002

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1,846

$50.002

$47.502

$45.002

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Corphita

USA . 4,949 parts In-Stock

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DigiPath Technology Company

USA . 851 parts In-Stock

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$45.082

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Microchip USA

USA . 343 parts In-Stock

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Overview

Unlock the power of innovation with the Texas Instruments MSP432P411VTPZR microcontroller. Designed with precision and quality in mind, this device offers unparalleled performance for a wide range of applications. From industrial automation to consumer electronics, this product delivers reliability and efficiency like no other. With integrated cache, advanced peripherals, and low power mode capabilities, customers can trust in the value and benefits that this microcontroller brings to their projects. Trust in Texas Instruments for cutting-edge technology that pushes the boundaries of what's possible.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a lightweight and durable package for the microcontroller, making it suitable for a variety of applications.

Maximum Supply Voltage: 3.7 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with different voltage requirements.

ROM Words: 524288

With a large ROM capacity, this microcontroller can store a significant amount of program code, allowing for complex applications to be implemented.

Maximum Clock Frequency: 24 MHz

The high clock frequency enables fast processing speeds, making this microcontroller suitable for applications that require quick response times.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC (Reduced Instruction Set Computing) microcontroller ensures efficient execution of instructions, optimizing performance and power consumption.

Analog To Digital Convertors: 26-Ch 16-Bit

The multiple 16-bit ADC channels allow for accurate and high-resolution analog to digital conversion, making this microcontroller suitable for applications requiring precise sensor data acquisition.

Connectivity: I2C(4), IRDA(4), SPI(8), UART(4)

The variety of communication interfaces supported enables easy integration with other devices and systems, enhancing the microcontroller's versatility.

Low Power Mode: YES

The low power mode feature helps in minimizing power consumption during idle or low-demand periods, making this microcontroller energy-efficient.

Technical Specifications

Microcontrollers MSP432P411VTPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

8

No. of External Interrupts:

0

No. of I/O Lines:

84

No. of Serial I/Os:

2

No. of Terminals:

100

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

131072

RAM Words:

128

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Maximum Supply Voltage:

3.7 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(4), IRDA(4), SPI(8), UART(4)

Peripherals:

COMPARATOR(16), DMA(8), LCD, POR, RTC, TIMER(7), WDT

Analog To Digital Convertors:

26-Ch 16-Bit

Trade Compliance

MSP432P411VTPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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