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MSP432P4111IPZR

Texas Instruments

MSP432P4111IPZR by Texas Instruments

MSP432P4111IPZR by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, offering 26-Ch 16-Bit ADC channels and 8 DMA channels. Ideal for industrial applications, it operates b/w -40 to 85 °C with a max clock frequency of 48 MHz. With low power mode and various peripherals like LCD and RTC, it provides efficient connectivity through I2C(4), IRDA(4), SPI(8), UART(4).

Median Price

$17.603

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Nova Conductors

Japan . 300 parts In-Stock

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Digiode

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Vyrian

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One Stop Electronics

USA . 928 parts In-Stock

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$1.000

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AZTECH Wire

Italy . 577 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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$17.251

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$16.561

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Continental Prestige Electronics

USA . 3,646 parts In-Stock

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Corohmni

South Africa . 118 parts In-Stock

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$27.740

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Ampacity Inc.

Singapore . 1,051 parts In-Stock

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Semicontronic

India . 794 parts In-Stock

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Parana Technologies

USA . 889 parts In-Stock

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IDEA Electronic Components Group

UK . 1,696 parts In-Stock

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$59.170

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ChromeModa Solutions

Germany . 101 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Lixinc

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Corphita

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Argo Parts USA

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Microchip USA

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Perfect Parts

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Futuretech Components

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Formix International (Excess)

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iodParts Technologies Inc.

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DigiPath Technology Company

USA . 359 parts In-Stock

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Advanced Electronics

New Zealand . 54 parts In-Stock

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Overview

Unleash the power of innovation with the Texas Instruments MSP432P4111IPZR microcontroller! Built by a trusted manufacturer, this device offers unparalleled quality and reliability for a wide range of applications. With its advanced features and cutting-edge technology, customers can experience seamless performance and enhanced functionality. Elevate your projects to new heights with the value and benefits that this product brings to the table. Choose the MSP432P4111IPZR for exceptional results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the components inside, making the product reliable in various conditions.

Maximum Supply Voltage: 3.7 V

Allows for a higher supply voltage which can support more power-demanding applications.

Minimum Operating Temperature: -40 °C

Capable of operating in very low temperatures, suitable for industrial or outdoor applications.

ADC Channels: YES

Includes Analog to Digital Converters which are essential for converting analog signals into digital values for processing.

Maximum Clock Frequency: 48 MHz

High clock frequency allows for faster processing speeds, ideal for applications requiring real-time response.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture allows for efficient processing and control of peripherals, maximizing performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient.

Analog To Digital Convertors: 26-Ch 16-Bit

Multiple high-resolution ADC channels enable accurate conversion of analog inputs, suitable for sensor applications.

No. of Serial I/Os: 8

Provides multiple serial communication interfaces for connecting to external devices, enhancing connectivity.

Technical Specifications

Microcontrollers MSP432P4111IPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

84

No. of Serial I/Os:

8

No. of Terminals:

100

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

262144

RAM Words:

256

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Maximum Supply Current:

8.2 mA

Maximum Supply Voltage:

3.7 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(4), IRDA(4), SPI(8), UART(4)

Peripherals:

COMPARATOR(16), DMA(8), LCD, POR, RTC, TIMER(7), WDT

Analog To Digital Convertors:

26-Ch 16-Bit

Trade Compliance

MSP432P4111IPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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