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MSP432P401YTRGCR

Texas Instruments

MSP432P401YTRGCR by Texas Instruments

MSP432P401YTRGCR by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family, offering 14-Ch 16-Bit ADC channels and 8 DMA channels. It operates at a max clock frequency of 24 MHz, suitable for industrial applications requiring low power mode and peripherals like comparators, timers, and UART connectivity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,477 parts In-Stock

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Digiode

USA . 3,815 parts In-Stock

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3,815

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One Stop Electronics

USA . 245 parts In-Stock

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$3.000

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245

$3.000

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AZTECH Wire

Italy . 655 parts In-Stock

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$16.154

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Parana Technologies

USA . 566 parts In-Stock

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$76.419

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566

$76.419

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ChromeModa Solutions

Germany . 6,971 parts In-Stock

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$85.864

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$70.408

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6,971

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$70.408

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IDEA Electronic Components Group

UK . 2,156 parts In-Stock

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$85.864

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$81.571

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$77.278

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2,156

$85.864

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$77.278

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Corphita

USA . 3,547 parts In-Stock

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DigiPath Technology Company

USA . 2,244 parts In-Stock

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$77.415

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Microchip USA

USA . 331 parts In-Stock

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Overview

Unlock the potential of your electronic designs with the MSP432P401YTRGCR microcontroller from Texas Instruments. Boasting top-notch quality and reliability, this powerful device is perfect for a wide range of applications in the electronics industry. With advanced features like integrated cache, low power mode, and a variety of connectivity options, the MSP432P401YTRGCR offers unmatched value and performance to customers looking to take their projects to the next level. Trust Texas Instruments to deliver cutting-edge technology that will bring your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the microcontroller lightweight and durable, suitable for various applications.

Integrated Cache: YES

Having integrated cache helps in improving processing speed and efficiency by reducing the access time to frequently used data.

Maximum Supply Voltage: 3.7 V

The higher maximum supply voltage allows for flexibility in power supply options, accommodating a wider range of voltage inputs.

No. of Terminals: 64

Having a higher number of terminals provides more connectivity options, allowing for integration with a variety of external components and peripherals.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a microcontroller with Reduced Instruction Set Computing (RISC) architecture, it offers improved performance and efficiency in handling complex instructions and data processing tasks.

Maximum Clock Frequency: 24 MHz

The high maximum clock frequency enables fast data processing and operation, making it suitable for applications requiring real-time response and high-speed performance.

Technical Specifications

Microcontrollers MSP432P401YTRGCR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

8

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

RAM Bytes:

262144

RAM Words:

256

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

.88 mm

Speed:

24 rpm

Maximum Supply Voltage:

3.7 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(3), IRDA(3), SPI(6), UART(3)

Peripherals:

COMPARATOR(6), DMA(8), POR, RTC, TIMER(7), WDT

Analog To Digital Convertors:

14-Ch 16-Bit

Trade Compliance

MSP432P401YTRGCR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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