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MSP432P401VTRGCR

Texas Instruments

MSP432P401VTRGCR by Texas Instruments

MSP432P401VTRGCR by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 128KB RAM, and 524288 ROM words. It features 14-Ch 16-Bit ADCs, 8 DMA channels, and PWM support. Ideal for industrial applications requiring low power consumption and high-speed processing up to 24 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,587 parts In-Stock

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6,587

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Digiode

USA . 4,135 parts In-Stock

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4,135

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Distributors (Availability)

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One Stop Electronics

USA . 1,416 parts In-Stock

1+ parts

$1.000

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1,416

$1.000

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AZTECH Wire

Italy . 369 parts In-Stock

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$11.919

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369

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Parana Technologies

USA . 2,243 parts In-Stock

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$16.713

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$16.968

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2,243

$16.713

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$16.968

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ChromeModa Solutions

Germany . 2,498 parts In-Stock

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$18.779

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$15.399

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2,498

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$15.399

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IDEA Electronic Components Group

UK . 2 parts In-Stock

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$18.779

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$17.840

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$16.901

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2

$18.779

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$16.901

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Component Stockers USA

USA . 483 parts In-Stock

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$99.990

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483

$99.990

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DigiPath Technology Company

USA . 2,261 parts In-Stock

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$16.931

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Microchip USA

USA . 491 parts In-Stock

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Corphita

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Overview

Enhance your projects with the Texas Instruments MSP432P401VTRGCR microcontroller, known for its superior quality and reliability. As a leader in the industry, Texas Instruments delivers innovative solutions that meet the demands of various applications. This microcontroller offers exceptional value to customers by providing integrated cache, advanced peripherals, and low power modes, making it ideal for a wide range of projects. Experience high performance and efficiency with the MSP432P401VTRGCR, a top choice for your next design challenge.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides good durability and protection to the microcontroller, ensuring longevity and reliability in various environments.

Integrated Cache: YES

Integrated cache helps in improving the performance by storing frequently accessed data and instructions, reducing access times and enhancing overall speed of the microcontroller.

Maximum Supply Voltage: 3.7 V

Higher maximum supply voltage allows for flexibility in powering the microcontroller with different power sources without risking damage, making it versatile and adaptable.

On Chip Data RAM Width: 8

8-bit data RAM width allows for efficient data processing and manipulation, enabling the microcontroller to handle various tasks effectively and quickly.

ADC Channels: YES

Presence of ADC channels enables analog to digital conversion, allowing the microcontroller to interface with analog sensors and input signals, expanding its capabilities.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller with multiple peripherals like comparators, timers, and DMA channels, it offers high performance and efficient processing for a wide range of applications.

Maximum Clock Frequency: 24 MHz

High clock frequency allows for swift execution of instructions, making the microcontroller suitable for applications requiring fast response times and real-time processing.

ROM Programmability: FLASH

Flash programmable ROM provides flexibility for updating and modifying firmware in-system, enabling easy maintenance and customization of the microcontroller's functionality.

Connectivity: I2C(3), IRDA(3), SPI(6), UART(3)

Multiple connectivity options such as I2C, IRDA, SPI, and UART allow for easy integration with various communication protocols and devices, enhancing the microcontroller's versatility and interoperability.

Technical Specifications

Microcontrollers MSP432P401VTRGCR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

8

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

RAM Bytes:

131072

RAM Words:

128

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

.88 mm

Speed:

24 rpm

Maximum Supply Voltage:

3.7 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(3), IRDA(3), SPI(6), UART(3)

Peripherals:

COMPARATOR(6), DMA(8), POR, RTC, TIMER(6), WDT

Analog To Digital Convertors:

14-Ch 16-Bit

Trade Compliance

MSP432P401VTRGCR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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