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MSP432P401VIRGCT

Texas Instruments

MSP432P401VIRGCT by Texas Instruments

MSP432P401VIRGCT by Texas Instruments is a 32-bit microcontroller with a max clock frequency of 48 MHz, ideal for industrial applications. It features 128 words of RAM and 524288 ROM words, along with 14-Ch 16-Bit ADC channels for precise analog to digital conversion. With low power mode and multiple connectivity options like I2C, SPI, and UART, it offers versatile performance in a compact chip carrier package.

Median Price

$8.750

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 241 parts In-Stock

1+ parts

$7.310

100+ parts

$5.480

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241

$7.310

$5.480

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DigiKey

USA . 225 parts In-Stock

1+ parts

$10.190

100+ parts

$7.623

1k+ parts

-

10k+ parts

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225

$10.190

$7.623

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-

Distributors (In-Stock)

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Vyrian

USA . 3,079 parts In-Stock

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3,079

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Digiode

USA . 1,629 parts In-Stock

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1,629

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Distributors (Availability)

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AZTECH Wire

Italy . 554 parts In-Stock

1+ parts

$18.002

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554

$18.002

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One Stop Electronics

USA . 886 parts In-Stock

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$26.000

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886

$26.000

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Parana Technologies

USA . 2,122 parts In-Stock

1+ parts

$31.117

100+ parts

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$72.902

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2,122

$31.117

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$72.902

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DigiPath Technology Company

USA . 277 parts In-Stock

1+ parts

$34.264

100+ parts

$31.523

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277

$34.264

$31.523

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IDEA Electronic Components Group

UK . 1,559 parts In-Stock

1+ parts

$34.963

100+ parts

$33.215

1k+ parts

$31.467

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-

1,559

$34.963

$33.215

$31.467

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ChromeModa Solutions

Germany . 1,005 parts In-Stock

1+ parts

$34.963

100+ parts

$28.670

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1,005

$34.963

$28.670

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Microchip USA

USA . 313 parts In-Stock

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Corphita

USA . 271 parts In-Stock

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271

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Overview

Unlock the power of innovation with the Texas Instruments MSP432P401VIRGCT microcontroller. Designed with cutting-edge technology and precision engineering, this versatile chip offers endless possibilities for a wide range of applications. From IoT devices to industrial automation, this microcontroller delivers top-notch performance and reliability. Experience seamless connectivity, low power consumption, and advanced features that set this product apart from the rest. Trust in Texas Instruments to provide you with the tools you need to bring your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material ensures durability and protection for the microcontroller.

Maximum Supply Voltage: 3.7 V

The high maximum supply voltage allows for versatile power options and compatibility with a wide range of applications.

Bit Size: 32

A 32-bit architecture provides powerful processing capabilities and enhanced performance in complex tasks.

ADC Channels: YES

The presence of ADC channels enables analog to digital conversion, allowing the microcontroller to interface with various sensors and inputs.

DMA Channels: YES

DMA channels help streamline data transfer and improve efficiency in handling large volumes of data, making the microcontroller suitable for high-speed applications.

Maximum Clock Frequency: 48 MHz

A high maximum clock frequency of 48 MHz ensures fast processing speeds and responsiveness in real-time operations.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers efficient processing and reduced complexity, making it ideal for embedded systems and IoT applications.

Analog To Digital Convertors: 14-Ch 16-Bit

The 14 channels of 16-bit ADC provide precise and accurate conversion of analog signals, enabling the microcontroller to capture and process sensor data effectively.

Connectivity: I2C(3), IRDA(3), SPI(6), UART(3)

With multiple communication interfaces like I2C, IRDA, SPI, and UART, the microcontroller offers flexibility in connecting with other devices and peripherals.

Speed: 48 rpm

The speed of 48 rpm indicates the performance capabilities of the microcontroller in executing tasks efficiently and meeting timing requirements.

Technical Specifications

Microcontrollers MSP432P401VIRGCT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

8

No. of Terminals:

64

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

131072

RAM Words:

128

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

48 rpm

Maximum Supply Current:

8.2 mA

Maximum Supply Voltage:

3.7 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(3), IRDA(3), SPI(6), UART(3)

Peripherals:

COMPARATOR(6), DMA(8), POR, RTC, TIMER(6), WDT

Analog To Digital Convertors:

14-Ch 16-Bit

Trade Compliance

MSP432P401VIRGCT Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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