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MSP432P401RIRGCT

Texas Instruments

MSP432P401RIRGCT by Texas Instruments

MSP432P401RIRGCT by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family, offering 262144 ROM words and 64 RAM words. It features 14-Ch 16-Bit ADC channels, 8 DMA channels, and peripherals like comparators, timers, and UARTs. Ideal for industrial applications requiring low power consumption and high-speed processing up to 48 MHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 10,310 parts In-Stock

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Digiode

USA . 3,141 parts In-Stock

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Vyrian

USA . 2,084 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Ampacity Inc.

Singapore . 1,438 parts In-Stock

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$11.000

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$11.000

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AZTECH Wire

Italy . 809 parts In-Stock

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$16.586

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809

$16.586

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Semicontronic

India . 460 parts In-Stock

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$18.000

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$17.550

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$17.460

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460

$18.000

$17.550

$17.460

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One Stop Electronics

USA . 837 parts In-Stock

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$29.000

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837

$29.000

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Parana Technologies

USA . 1,950 parts In-Stock

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$63.483

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DigiPath Technology Company

USA . 200 parts In-Stock

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$69.902

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$69.902

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IDEA Electronic Components Group

UK . 1,091 parts In-Stock

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$71.329

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$67.763

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$64.196

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$71.329

$67.763

$64.196

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ChromeModa Solutions

Germany . 39 parts In-Stock

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$71.329

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$58.490

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Corohmni

South Africa . 833 parts In-Stock

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$73.649

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Continental Prestige Electronics

USA . 6,224 parts In-Stock

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Microchip USA

USA . 3,314 parts In-Stock

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Argo Parts USA

USA . 2,560 parts In-Stock

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Corphita

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Bastille Electronics

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments MSP432P401RIRGCT microcontroller. Designed for industrial-grade applications, this chip offers unparalleled performance and reliability. With a wide range of peripherals including comparators, DMA, RTC, timers, and watchdog timers, this microcontroller is perfect for a variety of projects. Whether you're working on automation, IoT, or robotics, the MSP432P401RIRGCT provides the speed, connectivity, and low-power modes you need to bring your ideas to life. Trust in Texas Instruments for quality you can count on.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material ensures durability and protection for the microcontroller, making it suitable for various applications.

Maximum Supply Voltage: 3.7 V

Supports a higher voltage range, providing flexibility in power supply options for the device.

Bit Size: 32

32-bit architecture allows for enhanced performance and processing capabilities.

CPU Family: CORTEX-M4F

Utilizes the Cortex-M4F architecture, known for its high-performance and energy-efficient features.

ADC Channels: YES

Integrated Analog-to-Digital Converters enable the microcontroller to interface with analog sensors and signals.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC-based microcontroller design offers improved efficiency and performance for various embedded applications.

ROM Programmability: FLASH

Flash programmable ROM allows for easy and flexible firmware updates and modifications.

Connectivity: I2C(3), IRDA(3), SPI(6), UART(3)

Multiple communication interfaces provide versatile connectivity options for connecting to other devices and peripherals.

Speed: 48 rpm

Capable of operating at a speed of 48 rpm, making it suitable for applications requiring real-time processing and control.

Technical Specifications

Microcontrollers MSP432P401RIRGCT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

8

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

4

No. of Terminals:

64

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

65536

RAM Words:

64

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.7 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(3), IRDA(3), SPI(6), UART(3)

Peripherals:

COMPARATOR(2), DMA(8), RTC, TIMER(6), WDT

Analog To Digital Convertors:

14-Ch 16-Bit

Trade Compliance

MSP432P401RIRGCT Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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