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MSP432P401MIPZ

Texas Instruments

MSP432P401MIPZ by Texas Instruments

MSP432P401MIPZ by Texas Instruments is a 32-bit microcontroller with a max clock frequency of 48 MHz. It features 26-Ch 16-Bit ADC channels, 8 DMA channels, and peripherals like comparators, timers, and UART for industrial applications. With low power mode and floating-point format support, it offers high performance in a compact package suitable for various embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,831 parts In-Stock

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Vyrian

USA . 2,707 parts In-Stock

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2,707

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Distributors (Availability)

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AZTECH Wire

Italy . 652 parts In-Stock

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$12.165

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652

$12.165

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One Stop Electronics

USA . 1,522 parts In-Stock

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$20.000

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Parana Technologies

USA . 1,353 parts In-Stock

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$74.869

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1,353

$74.869

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DigiPath Technology Company

USA . 1,934 parts In-Stock

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$82.441

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$75.845

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1,934

$82.441

$75.845

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ChromeModa Solutions

Germany . 695 parts In-Stock

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$84.123

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$68.981

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695

$84.123

$68.981

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IDEA Electronic Components Group

UK . 137 parts In-Stock

1+ parts

$84.123

100+ parts

$79.917

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$75.711

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137

$84.123

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$75.711

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Corphita

USA . 2,510 parts In-Stock

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Microchip USA

USA . 372 parts In-Stock

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Overview

Unlock the potential of your next project with the MSP432P401MIPZ microcontroller from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that are reliable and efficient. Ideal for a wide range of applications, this microcontroller offers high performance and versatility. With advanced features like multiple ADC channels, DMA channels, and low power mode, this product provides exceptional value and benefits to customers looking to elevate their designs. Upgrade your projects today with the MSP432P401MIPZ and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protection for the microcontroller, ensuring a longer lifespan.

Maximum Supply Voltage: 3.7 V

Ability to handle a maximum supply voltage of 3.7V allows for flexibility in power supply options while ensuring safe operation.

ADC Channels: YES

Presence of Analog to Digital Converter (ADC) channels enables the microcontroller to convert analog signals to digital data for processing, making it suitable for applications requiring sensor interfacing.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a Microcontroller based on Reduced Instruction Set Computing (RISC) architecture, this product offers efficient processing capabilities with optimized instruction set for faster execution of tasks.

Maximum Clock Frequency: 48 MHz

High clock frequency of 48MHz allows for fast processing speeds, making it suitable for applications requiring real-time data processing and control.

ROM Programmability: FLASH

Flash programmable Read-Only Memory (ROM) allows for easy reprogramming of the microcontroller, enabling firmware updates and flexibility in software development.

Technical Specifications

Microcontrollers MSP432P401MIPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

8

No. of External Interrupts:

0

No. of I/O Lines:

84

No. of Serial I/Os:

4

No. of Terminals:

100

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.7 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(4), IRDA(4), SPI(8), UART(4)

Peripherals:

COMPARATOR(2), DMA(8), RTC, TIMER(6), WDT

Analog To Digital Convertors:

26-Ch 16-Bit

Trade Compliance

MSP432P401MIPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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