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MSP430TCH5EPWR

Texas Instruments

MSP430TCH5EPWR by Texas Instruments

MSP430TCH5EPWR by Texas Instruments is a 16-bit microcontroller with 512B RAM, 8-Ch 10-Bit ADC, and FLASH ROM. Ideal for industrial applications with -40 to 85 °C operating temp range. Features include I2C, LIN, SPI connectivity and low 0.42 mA supply current at max voltage of 3.6V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,675 parts In-Stock

1+ parts

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3,675

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Digiode

USA . 1,527 parts In-Stock

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1,527

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Distributors (Availability)

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AZTECH Wire

Italy . 725 parts In-Stock

1+ parts

$10.169

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725

$10.169

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Microchip USA

USA . 3,420 parts In-Stock

1+ parts

$13.013

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3,420

$13.013

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One Stop Electronics

USA . 1,453 parts In-Stock

1+ parts

$28.000

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1,453

$28.000

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Parana Technologies

USA . 670 parts In-Stock

1+ parts

$46.416

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670

$46.416

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ChromeModa Solutions

Germany . 6,238 parts In-Stock

1+ parts

$52.153

100+ parts

$42.765

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6,238

$52.153

$42.765

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IDEA Electronic Components Group

UK . 642 parts In-Stock

1+ parts

$52.153

100+ parts

$49.545

1k+ parts

$46.938

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642

$52.153

$49.545

$46.938

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Component Stockers USA

USA . 299 parts In-Stock

1+ parts

$99.990

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299

$99.990

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DigiPath Technology Company

USA . 1,862 parts In-Stock

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$47.021

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1,862

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$47.021

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Corphita

USA . 306 parts In-Stock

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306

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Overview

Unleash the power of innovation with the MSP430TCH5EPWR by Texas Instruments, a leading manufacturer in the industry. This Microcontroller offers endless possibilities for your projects, with a wide range of applications in various fields. With its high-quality design and advanced features, this product provides exceptional value and benefits to customers. Experience seamless connectivity, superior performance, and unmatched reliability with the MSP430TCH5EPWR. Elevate your projects to new heights with this top-of-the-line Microcontroller from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the microcontroller, ensuring its longevity in various operating conditions.

Bit Size: 16

16-bit processing allows for faster and more efficient operations, making the microcontroller suitable for a wide range of applications.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages offers flexibility in design and compatibility with different systems.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enables high performance and low power consumption, making the microcontroller ideal for energy-efficient applications.

Connectivity: I2C, IRDA, LIN, SCI, SPI, UART

Multiple connectivity options allow for easy integration with other devices and communication protocols, enhancing the functionality of the microcontroller.

Technical Specifications

Microcontrollers MSP430TCH5EPWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

24

No. of Terminals:

28

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.42 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, LIN, SCI, SPI, UART

Peripherals:

BOD, COMPARATOR(8), POR, PWM, TIMER(2), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430TCH5EPWR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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