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MSP430P337IPJM

Texas Instruments

MSP430P337IPJM by Texas Instruments

MSP430P337IPJM by Texas Instruments is a 16-bit microcontroller with 3/5V power supplies, 1024 bytes RAM, and 32768 ROM words. Widely used in industrial applications for its 3.8 MHz clock frequency, PWM channels, and ADC capabilities. Package style: flatpack, suitable for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,874 parts In-Stock

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Digiode

USA . 3,152 parts In-Stock

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LWI Electronics Inc

India . 6 parts In-Stock

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One Stop Electronics

USA . 1,188 parts In-Stock

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$11.000

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$11.000

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AZTECH Wire

Italy . 312 parts In-Stock

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$16.762

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312

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Ampacity Inc.

Singapore . 222 parts In-Stock

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$22.000

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Parana Technologies

USA . 1,953 parts In-Stock

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$33.785

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$134.264

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$33.785

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ChromeModa Solutions

Germany . 3,015 parts In-Stock

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$37.961

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$31.128

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$37.961

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IDEA Electronic Components Group

UK . 1,939 parts In-Stock

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$37.961

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$36.063

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$34.165

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Corphita

USA . 1,765 parts In-Stock

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DigiPath Technology Company

USA . 420 parts In-Stock

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$34.226

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Microchip USA

USA . 369 parts In-Stock

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Assy Fe

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Overview

Unlock limitless possibilities with the Texas Instruments MSP430P337IPJM microcontroller. Boasting top-notch quality and reliability, this versatile device is perfect for a wide range of applications. Whether you're designing smart home devices, wearable technology, or industrial automation systems, this microcontroller offers unparalleled value, efficiency, and performance. Say goodbye to limitations and hello to innovation with the MSP430P337IPJM by Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and cost-effective, making the product reliable for long-term use.

Maximum Supply Voltage: 5.5 V

Higher maximum supply voltage allows for flexibility in power input options.

Bit Size: 16

16-bit processing capability provides sufficient computing power for various applications.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion, allowing for versatile input/output options.

ROM Words: 32768

Large ROM capacity of 32768 words allows for storing significant amounts of program data.

Width: 14 mm

Compact width of 14mm makes the microcontroller suitable for space-constrained designs.

Maximum Clock Frequency: 3.8 MHz

High maximum clock frequency of 3.8 MHz supports fast processing speeds for efficient operations.

RAM Bytes: 1024

With 1024 bytes of RAM, the microcontroller can efficiently store and access data during program execution.

Technical Specifications

Microcontrollers MSP430P337IPJM attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

3.8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G100

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

40

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.7X.9

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

OTPROM

Maximum Seated Height:

3.4 mm

Speed:

3.8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430P337IPJM Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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