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MSP430P325IPG

Texas Instruments

MSP430P325IPG by Texas Instruments

MSP430P325IPG by Texas Instruments is a 16-bit microcontroller with 64 terminals, 512 bytes of RAM, and 16384 ROM words. It operates at a max clock frequency of 3.3 MHz and has an industrial temperature grade. Ideal for applications requiring low power consumption and high performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,634 parts In-Stock

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8,634

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Digiode

USA . 2,138 parts In-Stock

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2,138

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ACDS - Activité Composants Distribution Service

France . 660 parts In-Stock

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660

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Holdelec - ElecDif-Pro

France . 660 parts In-Stock

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660

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Elcom Components

USA . 488 parts In-Stock

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488

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 286 parts In-Stock

1+ parts

$5.978

100+ parts

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286

$5.978

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One Stop Electronics

USA . 129 parts In-Stock

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$16.000

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129

$16.000

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Parana Technologies

USA . 2,055 parts In-Stock

1+ parts

$16.409

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$16.703

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2,055

$16.409

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$16.703

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DigiPath Technology Company

USA . 372 parts In-Stock

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$18.068

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372

$18.068

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ChromeModa Solutions

Germany . 5,162 parts In-Stock

1+ parts

$18.437

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$15.118

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5,162

$18.437

$15.118

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IDEA Electronic Components Group

UK . 1,816 parts In-Stock

1+ parts

$18.437

100+ parts

$17.515

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$16.593

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1,816

$18.437

$17.515

$16.593

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Corphita

USA . 1,149 parts In-Stock

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1,149

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Microchip USA

USA . 385 parts In-Stock

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385

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Overview

Unlock the power of innovation with the Texas Instruments MSP430P325IPG microcontroller. Crafted with precision and expertise, this versatile device is perfect for a wide range of applications. From consumer electronics to industrial automation, this 16-bit beauty offers unparalleled performance and reliability. With a compact design and advanced features, it's the ideal choice for your next project. Experience the quality, value, and efficiency that Texas Instruments brings to the table with the MSP430P325IPG. Elevate your creations and take your designs to new heights with this industry-leading microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.5 V

Can support a wide range of applications without the risk of damaging the device due to overvoltage.

Package Shape: RECTANGULAR

Fits well within standard PCB layouts, making it compatible with various existing designs.

Bit Size: 16

Offers a good balance between performance and power consumption for many embedded applications.

Power Supplies (V): 3/5

Provides flexibility in powering the microcontroller based on the specific requirements of the project.

No. of Terminals: 64

Offers ample connectivity options for interfacing with external components and peripherals.

Package Style (Meter): FLATPACK

Facilitates efficient heat dissipation, which is essential for maintaining optimal performance.

Minimum Supply Voltage: 2.7 V

Operates reliably even with lower input voltages, ensuring compatibility with different power sources.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications with harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Maintains functionality in cold environments, expanding the range of operating conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Ensures reliable electrical connections and corrosion resistance for long-term performance.

ADC Channels: YES

Enables analog-to-digital conversion functionality, essential for interfacing with analog sensors and signals.

Terminal Position: QUAD

Facilitates easy placement and soldering on the circuit board, simplifying the manufacturing process.

ROM Words: 16384

Provides ample memory for storing program instructions, data, and configuration settings.

Maximum Seated Height: 3.1 mm

Has a low profile design, ideal for space-constrained applications and compact electronic devices.

Width: 14 mm

Compact form factor allows for integration into small electronic devices and PCB layouts.

Maximum Clock Frequency: 3.3 MHz

Offers sufficient processing speed for real-time control and communication tasks in various applications.

Maximum Time At Peak Reflow Temperature (s): 30

Designed for reliable reflow soldering processes, ensuring secure mounting on the PCB.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures without compromising performance or reliability.

Length: 20 mm

Compact dimensions make it suitable for integration into small electronic enclosures and designs.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature ranges, making it suitable for rugged applications in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a RISC architecture for efficient and fast processing, ideal for embedded control applications.

RAM Bytes: 512

Offers sufficient random access memory for storing runtime data and variables during operation.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, enhancing overall efficiency.

Terminal Form: GULL WING

Enables secure soldering connections on the PCB, improving mechanical stability and reliability.

Nominal Supply Voltage: 5 V

Operates at a standard voltage level, ensuring compatibility with common power sources and peripherals.

ROM Programmability: OTPROM

Offers one-time programmable memory for secure and permanent storage of critical firmware and data.

Terminal Pitch: 1 mm

Optimal terminal spacing for easy soldering and efficient PCB layout, enhancing assembly and manufacturing processes.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate levels of moisture exposure, suitable for various environmental conditions.

Speed: 3.3 rpm

Provides stable and consistent processing speed for executing tasks and handling real-time data inputs.

No. of I/O Lines: 14

Offers sufficient input/output ports for interfacing with external devices and peripherals, enhancing connectivity options.

Technical Specifications

Microcontrollers MSP430P325IPG attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

3.3 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G64

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

14

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.7X.95,40

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

16384

ROM Programmability:

OTPROM

Maximum Seated Height:

3.1 mm

Speed:

3.3 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430P325IPG Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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