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MSP430P325AIPM

Texas Instruments

MSP430P325AIPM by Texas Instruments

MSP430P325AIPM by Texas Instruments is a 16-bit microcontroller with 512 bytes of RAM and 16384 ROM words. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring low power consumption and high performance. With 14 I/O lines and ADC channels, it offers versatile connectivity options in a compact FLATPACK package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,318 parts In-Stock

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Digiode

USA . 2,700 parts In-Stock

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2,700

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LIBRA Elektronik GmbH

Germany . 2 parts In-Stock

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2

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Distributors (Availability)

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AZTECH Wire

Italy . 894 parts In-Stock

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$6.943

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894

$6.943

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Parana Technologies

USA . 1,535 parts In-Stock

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$13.578

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$14.082

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1,535

$13.578

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$14.082

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DigiPath Technology Company

USA . 158 parts In-Stock

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$14.951

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158

$14.951

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ChromeModa Solutions

Germany . 2,095 parts In-Stock

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$15.256

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$12.510

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2,095

$15.256

$12.510

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IDEA Electronic Components Group

UK . 384 parts In-Stock

1+ parts

$15.256

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$14.493

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$13.730

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384

$15.256

$14.493

$13.730

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One Stop Electronics

USA . 510 parts In-Stock

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$23.000

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510

$23.000

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Component Stockers USA

USA . 370 parts In-Stock

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$99.990

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370

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 16,192 parts In-Stock

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Corphita

USA . 4,516 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Microchip USA

USA . 210 parts In-Stock

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Overview

Unlock endless possibilities with the Texas Instruments MSP430P325AIPM microcontroller. Designed with precision and reliability in mind, this powerful device delivers superior performance for a wide range of applications. From industrial automation to consumer electronics, this microcontroller offers unmatched value, efficiency, and flexibility. Trust in Texas Instruments to provide top-notch quality and innovation, making your projects stand out from the rest. Elevate your designs with the MSP430P325AIPM and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the microcontroller, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy integration onto circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 5.5 V

Can operate at higher voltage levels, providing flexibility and compatibility with different power sources.

Package Shape: SQUARE

Square package shape is efficient for placement on PCBs and allows for easy organization in a circuit design.

Bit Size: 16

16-bit architecture provides higher processing power and precision compared to lower bit sizes, suitable for complex calculations and tasks.

Power Supplies (V): 3/5

Support for multiple supply voltages allows for versatility in powering the microcontroller based on different system requirements.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options for interfacing with other components and peripherals in a system.

ROM Words: 16384

Large ROM capacity allows for storing a significant amount of program data and instructions within the microcontroller.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller efficient and reliable in various applications.

RAM Bytes: 512

512 bytes of RAM provides sufficient memory space for temporary data storage and efficient processing of tasks.

Technical Specifications

Microcontrollers MSP430P325AIPM attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

14

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

16384

ROM Programmability:

OTPROM

Maximum Seated Height:

1.6 mm

Speed:

3.3 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

MSP430P325AIPM Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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