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MSP430P325AIPG

Texas Instruments

MSP430P325AIPG by Texas Instruments

MSP430P325AIPG by Texas Instruments is a 16-bit microcontroller with 64 terminals, 512 bytes of RAM, and 16384 ROM words. It operates b/w -40 to 85°C and has a max clock frequency of 0.032 MHz. Ideal for industrial applications requiring low power consumption and high performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,670 parts In-Stock

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5,670

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ComSIT Distribution GmbH

Germany . 2,999 parts In-Stock

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2,999

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Digiode

USA . 2,212 parts In-Stock

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2,212

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Chip Stock

USA . 162 parts In-Stock

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162

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Distributors (Availability)

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One Stop Electronics

USA . 1,366 parts In-Stock

1+ parts

$9.000

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1,366

$9.000

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AZTECH Wire

Italy . 491 parts In-Stock

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$18.515

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491

$18.515

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Parana Technologies

USA . 1,501 parts In-Stock

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$55.369

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1,501

$55.369

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DigiPath Technology Company

USA . 525 parts In-Stock

1+ parts

$60.968

100+ parts

$56.090

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525

$60.968

$56.090

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ChromeModa Solutions

Germany . 4,868 parts In-Stock

1+ parts

$62.212

100+ parts

$51.014

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4,868

$62.212

$51.014

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IDEA Electronic Components Group

UK . 1,255 parts In-Stock

1+ parts

$62.212

100+ parts

$59.101

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$55.991

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1,255

$62.212

$59.101

$55.991

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Corphita

USA . 1,652 parts In-Stock

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1,652

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Microchip USA

USA . 480 parts In-Stock

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480

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Overview

Unleash the power of innovation with the Texas Instruments MSP430P325AIPG microcontroller. Crafted with precision and expertise, this cutting-edge device offers unparalleled performance and reliability for a wide range of applications. From IoT devices to industrial automation systems, this high-quality product delivers unmatched value and efficiency to customers seeking seamless integration and exceptional functionality. Elevate your projects to new heights with the Texas Instruments MSP430P325AIPG and experience the difference that superior technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good protection against environmental factors, making the microcontroller durable and reliable.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing production costs.

Maximum Supply Voltage: 5.5 V

A high maximum supply voltage allows for flexibility in power supply options, making the microcontroller versatile in various applications.

Package Shape: RECTANGULAR

Rectangular package shape ensures compatibility with standard PCB layouts and allows for easy integration into electronic systems.

Bit Size: 16

16-bit architecture offers good balance between performance and cost, suitable for many embedded applications.

Power Supplies (V): 3/5

Support for both 3V and 5V power supplies gives flexibility in design and compatibility with different components.

No. of Terminals: 64

Having 64 terminals provides ample I/O options for interfacing with external devices and sensors.

Minimum Supply Voltage: 2.5 V

Low minimum supply voltage ensures efficient power consumption and extended battery life in portable devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures reliable performance in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for use in both hot and cold environments without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold finish provides good conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

Built-in Analog-to-Digital Converter channels enable accurate and efficient conversion of analog signals, expanding the microcontroller's capabilities.

Terminal Position: QUAD

Quad terminal position facilitates easy soldering and PCB assembly, improving reliability and manufacturability.

ROM Words: 16384

Large ROM size allows for storing a significant amount of program code and data, making the microcontroller suitable for complex applications.

Maximum Seated Height: 3.1 mm

Low profile design with a maximum seated height of 3.1 mm saves space and allows for compact product designs.

Width: 14 mm

Narrow width of 14 mm enables the microcontroller to be used in space-constrained applications without sacrificing functionality.

Maximum Clock Frequency: 0.032 MHz

Decent maximum clock frequency of 0.032 MHz provides good processing speed for various applications.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum time of 30 seconds at peak reflow temperature ensures proper soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures reliable solder joints and overall product durability.

Length: 20 mm

Compact length of 20 mm allows for easy integration into small form factor devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in industrial settings with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient processing capabilities, making the microcontroller suitable for a wide range of applications.

RAM Bytes: 512

512 bytes of RAM provide sufficient memory for data storage and manipulation, supporting various computing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the microcontroller's efficiency and reliability.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and PCB mounting, ensuring secure connections and reliable operation.

Nominal Supply Voltage: 5 V

Nominal supply voltage of 5V is a common standard in many electronic systems, enabling easy integration with existing components.

ROM Programmability: OTPROM

One-Time Programmable ROM offers permanent storage of program code, enhancing security and protection against unauthorized access.

Terminal Pitch: 1 mm

Fine terminal pitch of 1 mm allows for high-density mounting on PCBs, saving space and accommodating compact designs.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates moderate sensitivity to moisture exposure, requiring standard handling and storage precautions.

Speed: 3.3 rpm

Operating speed of 3.3 rpm provides decent performance for various real-time applications and control tasks.

No. of I/O Lines: 14

Having 14 I/O lines allows for flexible interfacing with external devices and peripherals, enhancing the microcontroller's connectivity and functionality.

Technical Specifications

Microcontrollers MSP430P325AIPG attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G64

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

14

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.7X.95,40

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

16384

ROM Programmability:

OTPROM

Maximum Seated Height:

3.1 mm

Speed:

3.3 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430P325AIPG Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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