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MSP430P315IDL

Texas Instruments

MSP430P315IDL by Texas Instruments

MSP430P315IDL by Texas Instruments is a 16-bit microcontroller with 16384 ROM words and 512 bytes of RAM. Operating at a max frequency of 3.3 MHz, it features 14 I/O lines and ADC channels, making it ideal for industrial applications requiring low power consumption and high performance.

Median Price

$7.530

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 69 parts In-Stock

1+ parts

$7.530

100+ parts

$7.380

1k+ parts

$7.230

10k+ parts

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69

$7.530

$7.380

$7.230

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Distributors (In-Stock)

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Vyrian

USA . 4,178 parts In-Stock

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Digiode

USA . 1,350 parts In-Stock

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1,350

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LIBRA Elektronik GmbH

Germany . 60 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 13 parts In-Stock

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LWI Electronics Inc

India . 3 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 450 parts In-Stock

1+ parts

$5.413

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$5.413

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One Stop Electronics

USA . 885 parts In-Stock

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$23.000

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885

$23.000

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Parana Technologies

USA . 2,075 parts In-Stock

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$68.517

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2,075

$68.517

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DigiPath Technology Company

USA . 902 parts In-Stock

1+ parts

$75.445

100+ parts

$69.410

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902

$75.445

$69.410

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ChromeModa Solutions

Germany . 2,011 parts In-Stock

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$76.985

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$63.128

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2,011

$76.985

$63.128

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IDEA Electronic Components Group

UK . 1,183 parts In-Stock

1+ parts

$76.985

100+ parts

$73.136

1k+ parts

$69.286

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1,183

$76.985

$73.136

$69.286

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Corphita

USA . 3,039 parts In-Stock

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Microchip USA

USA . 103 parts In-Stock

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Kepictronics

USA . 48 parts In-Stock

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Assy Fe

Spain . 29 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 13 parts In-Stock

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Overview

Unleash the power of innovation with the Texas Instruments MSP430P315IDL microcontroller. Designed with precision and reliability in mind, this device offers seamless performance for a wide range of applications. Whether you're a seasoned professional or a hobbyist looking to take your projects to the next level, the MSP430P315IDL delivers exceptional value with its cutting-edge technology and versatile features. Trust in Texas Instruments to provide you with the tools you need to bring your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for packaging microcontrollers as it provides good protection while being cost-effective.

Surface Mount: YES

Surface mount technology allows for more compact designs and easier automated assembly processes.

Maximum Supply Voltage: 5.5 V

Allows for compatibility with a wide range of power sources.

Bit Size: 16

A 16-bit microcontroller can handle larger data sizes and perform more complex operations compared to an 8-bit microcontroller.

Power Supplies (V): 3/5

This microcontroller can operate on either 3V or 5V power supplies, offering flexibility in different applications.

No. of Terminals: 56

Provides a sufficient number of I/O options for connecting to external devices and peripherals.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme low-temperature environments.

ADC Channels: YES

The presence of analog-to-digital converter channels allows for interfacing with analog sensors and signals.

ROM Words: 16384

Large ROM capacity allows for storing a significant amount of program data.

Maximum Clock Frequency: 3.3 MHz

With a maximum clock frequency of 3.3 MHz, this microcontroller can execute instructions at a relatively high speed.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizing RISC architecture, this microcontroller offers efficient instruction execution and improved performance.

RAM Bytes: 512

With 512 bytes of RAM, this microcontroller can store and access variables efficiently during program execution.

Technology: CMOS

CMOS technology provides low power consumption and improved noise immunity, ideal for battery-operated devices.

ROM Programmability: OTPROM

One-time programmable ROM allows for permanent storage of program code, ensuring data integrity and security.

Technical Specifications

Microcontrollers MSP430P315IDL attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

3.3 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

18.415 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

14

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

16384

ROM Programmability:

OTPROM

Maximum Seated Height:

2.79 mm

Speed:

3.3 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.49 mm

Peripheral IC Type:

Trade Compliance

MSP430P315IDL Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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