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MSP430P313IDL

Texas Instruments

MSP430P313IDL by Texas Instruments

MSP430P313IDL by Texas Instruments is a 16-bit microcontroller with 256 bytes RAM, 8192 ROM words, and ADC channels. It operates at a max clock frequency of 3.3 MHz and has a temperature range of -40 to 85°C. Ideal for industrial applications requiring low power consumption and compact design.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 9,619 parts In-Stock

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Digiode

USA . 3,419 parts In-Stock

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ComSIT Distribution GmbH

Germany . 316 parts In-Stock

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316

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One Stop Electronics

USA . 701 parts In-Stock

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$7.000

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701

$7.000

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AZTECH Wire

Italy . 828 parts In-Stock

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$17.143

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828

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Parana Technologies

USA . 18 parts In-Stock

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$22.133

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$22.754

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DigiPath Technology Company

USA . 423 parts In-Stock

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$24.372

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$22.422

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423

$24.372

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ChromeModa Solutions

Germany . 518 parts In-Stock

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$24.869

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$20.393

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518

$24.869

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IDEA Electronic Components Group

UK . 81 parts In-Stock

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$24.869

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$23.626

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$22.382

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81

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$22.382

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Corphita

USA . 2,582 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Microchip USA

USA . 226 parts In-Stock

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Overview

Experience the cutting-edge technology of the Texas Instruments MSP430P313IDL microcontroller. This versatile device offers unparalleled performance and reliability, perfect for a wide range of applications. With its high-quality manufacturing and advanced features, this microcontroller is a game-changer in the industry. Unlock endless possibilities and streamline your projects with the MSP430P313IDL today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for a variety of environments.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.5 V

Supports a wide range of applications and ensures compatibility with different power sources.

Package Shape: RECTANGULAR

Facilitates easy integration into standard circuit board layouts and designs.

Bit Size: 16

Provides sufficient processing power for a variety of tasks and applications.

Power Supplies (V): 3/5

Offers flexibility in power requirements, allowing the microcontroller to operate in different voltage environments.

No. of Terminals: 56

Provides ample connection points for interfacing with other electronic components and peripherals.

Minimum Supply Voltage: 2.7 V

Ensures reliable operation even in low voltage conditions, enhancing the product's versatility.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications where higher temperatures may be encountered, ensuring reliable performance.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold conditions, making it suitable for a wide range of environments.

ADC Channels: YES

Allows the microcontroller to interface with analog sensors and devices, expanding its functionality.

Terminal Position: DUAL

Provides redundancy and flexibility in connecting external components, enhancing reliability.

ROM Words: 8192

Offers ample memory space for storing program instructions and data, supporting complex applications.

Maximum Seated Height: 2.79 mm

Compact size enables space-efficient designs and allows for installation in tight spaces.

Width: 7.49 mm

Narrow width facilitates integration into compact electronic devices and circuit layouts.

Maximum Clock Frequency: 3.3 MHz

High clock frequency enables fast processing speeds, essential for real-time applications.

Length: 18.415 mm

Optimal length for fitting into standard electronic enclosures and PCB designs.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliability and durability.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a RISC architecture for efficient and fast operation, suitable for a wide range of applications.

RAM Bytes: 256

Sufficient RAM capacity for temporary data storage and manipulation, supporting multitasking applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the microcontroller's efficiency.

Terminal Form: GULL WING

Gull wing terminals provide reliable solder connections and easy assembly on PCBs.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage for compatibility with a wide range of electronic components and power sources.

ROM Programmability: OTPROM

One-time programmability ensures secure and permanent storage of program code, preventing unauthorized access or modification.

Terminal Pitch: 0.635 mm

Fine terminal pitch enables high-density PCB layouts and compact designs.

Speed: 3.3 rpm

Operates at a high speed of 3.3 rotations per minute, supporting fast data processing and communication.

No. of I/O Lines: 14

Sufficient I/O lines for connecting to external devices and peripherals, expanding the microcontroller's functionality.

Technical Specifications

Microcontrollers MSP430P313IDL attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

3.3 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G56

Length:

18.415 mm

No. of I/O Lines:

14

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

8192

ROM Programmability:

OTPROM

Maximum Seated Height:

2.79 mm

Speed:

3.3 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.49 mm

Peripheral IC Type:

Trade Compliance

MSP430P313IDL Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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