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MSP430I2041TPW

Texas Instruments

MSP430I2041TPW by Texas Instruments

MSP430I2041TPW by Texas Instruments is a 16-bit microcontroller with 32768 ROM words and 2048 RAM bytes. It operates at a max clock frequency of 16.384 MHz, suitable for industrial applications requiring low power consumption and connectivity via I2C, IRDA, SPI, and UART interfaces. With on-chip ADC channels and PWM capabilities, it offers versatile analog-to-digital conversion and pulse-width modulation functionalities.

Median Price

$3.679

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,788 parts In-Stock

1+ parts

$3.228

100+ parts

$2.828

1k+ parts

$1.598

10k+ parts

-

3,788

$3.228

$2.828

$1.598

-

DigiKey

USA . 406 parts In-Stock

1+ parts

$4.130

100+ parts

$2.599

1k+ parts

$2.323

10k+ parts

$2.254

406

$4.130

$2.599

$2.323

$2.254

Mouser Electronics

USA . 85 parts In-Stock

1+ parts

$4.130

100+ parts

$2.590

1k+ parts

$2.250

10k+ parts

-

85

$4.130

$2.590

$2.250

-

Arrow

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$2.245

1k+ parts

$1.970

10k+ parts

$1.922

500

-

$2.245

$1.970

$1.922

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 63 parts In-Stock

1+ parts

$2.349

100+ parts

-

1k+ parts

-

10k+ parts

-

63

$2.349

-

-

-

Digiode

USA . 1,904 parts In-Stock

1+ parts

$3.067

100+ parts

-

1k+ parts

-

10k+ parts

-

1,904

$3.067

-

-

-

Vyrian

USA . 8,627 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,627

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,323 parts In-Stock

1+ parts

$1.910

100+ parts

-

1k+ parts

-

10k+ parts

-

1,323

$1.910

-

-

-

Continental Prestige Electronics

USA . 3,802 parts In-Stock

1+ parts

$2.349

100+ parts

-

1k+ parts

-

10k+ parts

$2.302

3,802

$2.349

-

-

$2.302

Argo Parts USA

USA . 2,909 parts In-Stock

1+ parts

$2.349

100+ parts

-

1k+ parts

-

10k+ parts

-

2,909

$2.349

-

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$2.349

100+ parts

$2.302

1k+ parts

-

10k+ parts

-

1,000

$2.349

$2.302

-

-

Corphita

USA . 1,711 parts In-Stock

1+ parts

$2.905

100+ parts

-

1k+ parts

-

10k+ parts

-

1,711

$2.905

-

-

-

Microchip USA

USA . 2,251 parts In-Stock

1+ parts

$27.820

100+ parts

$27.650

1k+ parts

$27.560

10k+ parts

$27.480

2,251

$27.820

$27.650

$27.560

$27.480

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$49.428

100+ parts

$44.979

1k+ parts

$40.531

10k+ parts

-

2,000

$49.428

$44.979

$40.531

-

Parana Technologies

USA . 1,316 parts In-Stock

1+ parts

$56.130

100+ parts

-

1k+ parts

-

10k+ parts

-

1,316

$56.130

-

-

-

DigiPath Technology Company

USA . 406 parts In-Stock

1+ parts

$61.806

100+ parts

$56.861

1k+ parts

-

10k+ parts

-

406

$61.806

$56.861

-

-

ChromeModa Solutions

Germany . 5,875 parts In-Stock

1+ parts

$63.067

100+ parts

$51.715

1k+ parts

-

10k+ parts

-

5,875

$63.067

$51.715

-

-

IDEA Electronic Components Group

UK . 2,016 parts In-Stock

1+ parts

$63.067

100+ parts

$59.914

1k+ parts

$56.760

10k+ parts

-

2,016

$63.067

$59.914

$56.760

-

A-Z Elektronik GmbH

Germany . 4,959 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,959

-

-

-

-

Overview

Discover the unmatched quality and reliability of the Texas Instruments MSP430I2041TPW microcontroller, designed to meet the demands of a wide range of applications. With advanced technology and superior performance, this product offers unparalleled value to customers seeking innovative solutions. From IoT devices to industrial automation, the MSP430I2041TPW delivers efficiency, flexibility, and precision, making it the ideal choice for any project requiring cutting-edge microcontroller capabilities. Trust Texas Instruments for excellence in every design.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a cost-effective and lightweight solution for electronic assemblies.

Surface Mount: YES

Facilitates easy and efficient mounting on PCBs, reducing assembly time and cost.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with various components.

On Chip Data RAM Width: 8

Enhances data processing capabilities and allows for efficient storage and retrieval of information.

Package Shape: RECTANGULAR

Provides a standardized form factor for easy integration into existing designs and layouts.

Bit Size: 16

Offers sufficient computational power for a wide range of applications and tasks.

No. of Terminals: 28

Provides ample connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Enables compact and space-efficient PCB designs, ideal for applications with limited board real estate.

Minimum Supply Voltage: 2.2 V

Allows for operation in lower power scenarios, increasing energy efficiency and extending battery life.

Maximum Operating Temperature: 105 °C

Ensures reliable performance in harsh environmental conditions and industrial applications.

CPU Family: MSP430

Part of a well-established and versatile microcontroller family known for its low power consumption and high performance.

ADC Channels: YES

Enables analog-to-digital conversion for interfacing with sensors, transducers, and other analog devices.

Peripherals: BOD, TEMPERATURE SENSOR, TIMER(2), WDT

Offers a range of built-in features and functions to support diverse application requirements.

Maximum Clock Frequency: 16.384 MHz

Provides fast processing speeds for real-time control and data manipulation tasks.

ROM Words: 32768

Ample memory capacity for storing program instructions and data, supporting complex algorithms and applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Ensures reliable and durable electrical connections for long-term performance and reliability.

Technical Specifications

Microcontrollers MSP430I2041TPW attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

16

No. of Serial I/Os:

1

No. of Terminals:

28

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16.384 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Connectivity:

I2C, IRDA, SPI(2), UART

Peripherals:

BOD, TEMPERATURE SENSOR, TIMER(2), WDT

Analog To Digital Convertors:

4-Ch 24-Bit

Trade Compliance

MSP430I2041TPW Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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