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MSP430I2040TRHBT

Texas Instruments

MSP430I2040TRHBT by Texas Instruments

MSP430I2040TRHBT by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 16384 ROM words. It operates at a max clock frequency of 16.384 MHz, suitable for industrial applications requiring low power consumption and connectivity via I2C, IRDA, SPI, and UART interfaces.

Median Price

$4.170

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,250 parts In-Stock

1+ parts

$2.937

100+ parts

$2.574

1k+ parts

$1.454

10k+ parts

-

7,250

$2.937

$2.574

$1.454

-

DigiKey

USA . 377 parts In-Stock

1+ parts

$4.170

100+ parts

$2.626

1k+ parts

$2.493

10k+ parts

-

377

$4.170

$2.626

$2.493

-

Mouser Electronics

USA . 161 parts In-Stock

1+ parts

$4.170

100+ parts

$2.630

1k+ parts

$2.420

10k+ parts

-

161

$4.170

$2.630

$2.420

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,103 parts In-Stock

1+ parts

$2.790

100+ parts

-

1k+ parts

-

10k+ parts

-

2,103

$2.790

-

-

-

Vyrian

USA . 5,874 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,874

-

-

-

-

Schukat

Germany . 200 parts In-Stock

1+ parts

-

100+ parts

$2.478

1k+ parts

$2.378

10k+ parts

-

200

-

$2.478

$2.378

-

Bristol Electronics

USA . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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10

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,006 parts In-Stock

1+ parts

$2.643

100+ parts

-

1k+ parts

-

10k+ parts

-

4,006

$2.643

-

-

-

Parana Technologies

USA . 726 parts In-Stock

1+ parts

$22.141

100+ parts

-

1k+ parts

$22.761

10k+ parts

-

726

$22.141

-

$22.761

-

DigiPath Technology Company

USA . 39 parts In-Stock

1+ parts

$24.379

100+ parts

$22.429

1k+ parts

-

10k+ parts

-

39

$24.379

$22.429

-

-

ChromeModa Solutions

Germany . 3,005 parts In-Stock

1+ parts

$24.877

100+ parts

$20.399

1k+ parts

-

10k+ parts

-

3,005

$24.877

$20.399

-

-

IDEA Electronic Components Group

UK . 1,898 parts In-Stock

1+ parts

$24.877

100+ parts

$23.633

1k+ parts

$22.389

10k+ parts

-

1,898

$24.877

$23.633

$22.389

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,500

-

-

-

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Overview

Unlock the power of innovation with the Texas Instruments MSP430I2040TRHBT microcontroller. Designed for industrial-grade applications, this high-quality chip offers customers a reliable and efficient solution for their projects. With features like low power mode, on-chip program ROM, and multiple connectivity options, this microcontroller provides unmatched value and performance. Trust in Texas Instruments' reputation for excellence and choose the MSP430I2040TRHBT for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring long-term reliability.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options while maintaining safe operating conditions.

CPU Family: MSP430

The MSP430 family is known for its low power consumption and high performance, making it a popular choice for battery-powered applications.

Analog To Digital Convertors: 4-Ch 24-Bit

Provides high resolution and accuracy for analog inputs, ensuring precise data conversion.

Connectivity: I2C, IRDA, SPI(2), UART

Offers multiple communication options, allowing for easy integration with various peripherals and devices.

ROM Programmability: FLASH

The flash memory allows for easy reprogramming of the microcontroller, making it versatile and adaptable to different applications.

Technical Specifications

Microcontrollers MSP430I2040TRHBT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

16

No. of Serial I/Os:

1

No. of Terminals:

32

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

1024

RAM Words:

1

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16.384 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, SPI(2), UART

Peripherals:

BOD, TEMPERATURE SENSOR, TIMER(2), WDT

Analog To Digital Convertors:

4-Ch 24-Bit

Trade Compliance

MSP430I2040TRHBT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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