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MSP430I2031TRHBR

Texas Instruments

MSP430I2031TRHBR by Texas Instruments

MSP430I2031TRHBR by Texas Instruments is a 16-bit microcontroller with 32 terminals, operating at up to 16.384 MHz. It features 3 ADC channels, 2 timers, and low power mode ideal for industrial applications requiring high-speed processing and connectivity via I2C, IRDA, SPI(2), UART interfaces.

Median Price

$2.497

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 14,190 parts In-Stock

1+ parts

$2.497

100+ parts

$2.188

1k+ parts

$1.236

10k+ parts

-

14,190

$2.497

$2.188

$1.236

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 808 parts In-Stock

1+ parts

$2.372

100+ parts

-

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-

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808

$2.372

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Vyrian

USA . 5,149 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

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5,149

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 120 parts In-Stock

1+ parts

$2.247

100+ parts

-

1k+ parts

-

10k+ parts

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120

$2.247

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-

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AZTECH Wire

Italy . 828 parts In-Stock

1+ parts

$13.620

100+ parts

-

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828

$13.620

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Parana Technologies

USA . 252 parts In-Stock

1+ parts

$68.632

100+ parts

-

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252

$68.632

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-

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DigiPath Technology Company

USA . 1,362 parts In-Stock

1+ parts

$75.573

100+ parts

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1,362

$75.573

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-

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ChromeModa Solutions

Germany . 6,093 parts In-Stock

1+ parts

$77.115

100+ parts

$63.234

1k+ parts

-

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6,093

$77.115

$63.234

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IDEA Electronic Components Group

UK . 1,524 parts In-Stock

1+ parts

$77.115

100+ parts

$73.259

1k+ parts

$69.404

10k+ parts

-

1,524

$77.115

$73.259

$69.404

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Overview

Unlock the potential of your designs with the Texas Instruments MSP430I2031TRHBR microcontroller. Built to the high-quality standards that TI is known for, this versatile chip offers a wide range of applications in various industries. With its low power mode and multiple peripherals like temperature sensors and timers, this microcontroller provides unmatched value and efficiency for your projects. Experience seamless connectivity with I2C, IRDA, SPI, and UART options, making it the perfect choice for your next innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product suitable for a wide range of applications.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with various voltage sources.

Minimum Operating Temperature: -40 °C

Can operate in extremely cold environments, making it suitable for industrial and outdoor applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the product energy-efficient and reliable.

ADC Channels: YES

Integrated ADC channels allow for analog sensor interfacing, enabling the product to gather real-world data accurately.

Connectivity: I2C, IRDA, SPI(2), UART

Multiple connectivity options provide flexibility for communication with other devices, enhancing the product's versatility.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers high performance and efficiency, making the product suitable for applications requiring fast processing.

Technical Specifications

Microcontrollers MSP430I2031TRHBR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

16

No. of Serial I/Os:

1

No. of Terminals:

32

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16.384 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Connectivity:

I2C, IRDA, SPI(2), UART

Peripherals:

BOD, TEMPERATURE SENSOR, TIMER(2), WDT

Analog To Digital Convertors:

3-Ch 24-Bit

Trade Compliance

MSP430I2031TRHBR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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