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MSP430I2031TPWR

Texas Instruments

MSP430I2031TPWR by Texas Instruments

MSP430I2031TPWR by Texas Instruments is a 16-bit microcontroller with 3.6V max supply voltage, 2.2V min supply voltage, and 16.384 MHz max clock frequency. Ideal for industrial applications requiring low power consumption, it features peripherals like BOD, temp sensor, and UART connectivity.

Median Price

$2.497

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,000 parts In-Stock

1+ parts

$2.497

100+ parts

$2.188

1k+ parts

$1.236

10k+ parts

-

4,000

$2.497

$2.188

$1.236

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 913 parts In-Stock

1+ parts

$2.372

100+ parts

-

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913

$2.372

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Vyrian

USA . 4,389 parts In-Stock

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4,389

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Distributors (Availability)

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Corphita

USA . 3,008 parts In-Stock

1+ parts

$2.247

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-

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3,008

$2.247

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Microchip USA

USA . 3,452 parts In-Stock

1+ parts

$11.248

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3,452

$11.248

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AZTECH Wire

Italy . 322 parts In-Stock

1+ parts

$12.410

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322

$12.410

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Parana Technologies

USA . 540 parts In-Stock

1+ parts

$34.763

100+ parts

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540

$34.763

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DigiPath Technology Company

USA . 540 parts In-Stock

1+ parts

$38.278

100+ parts

-

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540

$38.278

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ChromeModa Solutions

Germany . 1,387 parts In-Stock

1+ parts

$39.059

100+ parts

$32.028

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1,387

$39.059

$32.028

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IDEA Electronic Components Group

UK . 1,032 parts In-Stock

1+ parts

$39.059

100+ parts

$37.106

1k+ parts

$35.153

10k+ parts

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1,032

$39.059

$37.106

$35.153

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Perfect Parts

USA . 71,680 parts In-Stock

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71,680

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments MSP430I2031TPWR microcontroller. Designed to exceed industry standards, this compact device offers unparalleled performance and reliability for a wide range of applications. From IoT devices to automotive systems, this versatile microcontroller delivers optimal efficiency and functionality. Trust in Texas Instruments' reputation for quality and innovation, and experience the value and benefits that the MSP430I2031TPWR can bring to your products. Upgrade your designs with this superior solution today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and resistant to damage, enhancing the overall reliability of the microcontroller.

Maximum Clock Frequency: 16.384 MHz

High maximum clock frequency allows for fast processing speed, making the microcontroller suitable for applications that require quick response times.

Connectivity: I2C, IRDA, SPI(2), UART

Multiple connectivity options provide flexibility in connecting the microcontroller to various peripherals and devices, expanding its compatibility and usability.

ADC Channels: YES

Presence of Analog to Digital Converters allows the microcontroller to interface with analog sensors or signals, enabling it to process real-world data efficiently.

RAM Bytes: 2048

Sufficient RAM capacity enables the microcontroller to store and manipulate a considerable amount of data, supporting complex algorithms and computations.

ROM Programmability: FLASH

Flash programmable ROM enables easy reprogramming of the microcontroller's memory, facilitating updates and modifications to the software without requiring a complete hardware replacement.

Technical Specifications

Microcontrollers MSP430I2031TPWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

16

No. of Serial I/Os:

1

No. of Terminals:

28

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16.384 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Connectivity:

I2C, IRDA, SPI(2), UART

Peripherals:

BOD, TEMPERATURE SENSOR, TIMER(2), WDT

Analog To Digital Convertors:

3-Ch 24-Bit

Trade Compliance

MSP430I2031TPWR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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