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MSP430I2020TRHBR

Texas Instruments

MSP430I2020TRHBR by Texas Instruments

MSP430I2020TRHBR by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 16384 ROM words. It operates at a max clock frequency of 16.384 MHz, suitable for industrial applications requiring low power consumption and connectivity via I2C, IRDA, SPI(2), UART interfaces.

Median Price

$1.988

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 42,083 parts In-Stock

1+ parts

$1.988

100+ parts

$1.742

1k+ parts

$0.984

10k+ parts

-

42,083

$1.988

$1.742

$0.984

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,918 parts In-Stock

1+ parts

$1.889

100+ parts

-

1k+ parts

-

10k+ parts

-

2,918

$1.889

-

-

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Vyrian

USA . 6,018 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,018

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,418 parts In-Stock

1+ parts

$1.789

100+ parts

-

1k+ parts

-

10k+ parts

-

4,418

$1.789

-

-

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AZTECH Wire

Italy . 56 parts In-Stock

1+ parts

$8.320

100+ parts

-

1k+ parts

-

10k+ parts

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56

$8.320

-

-

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Parana Technologies

USA . 359 parts In-Stock

1+ parts

$49.129

100+ parts

-

1k+ parts

-

10k+ parts

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359

$49.129

-

-

-

ChromeModa Solutions

Germany . 1,932 parts In-Stock

1+ parts

$55.201

100+ parts

$45.265

1k+ parts

-

10k+ parts

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1,932

$55.201

$45.265

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IDEA Electronic Components Group

UK . 573 parts In-Stock

1+ parts

$55.201

100+ parts

$52.441

1k+ parts

$49.681

10k+ parts

-

573

$55.201

$52.441

$49.681

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DigiPath Technology Company

USA . 2,321 parts In-Stock

1+ parts

-

100+ parts

$49.769

1k+ parts

-

10k+ parts

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2,321

-

$49.769

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Overview

Unlock endless possibilities with the MSP430I2020TRHBR by Texas Instruments. This high-quality microcontroller offers unparalleled benefits for a wide range of applications, from IoT devices to industrial automation. With cutting-edge technology and reliable performance, this product ensures optimal efficiency and functionality. Experience the value of advanced connectivity options, low power modes, and integrated peripherals that enhance your project's capabilities. Trust in Texas Instruments to deliver superior solutions that exceed expectations. Elevate your designs with the MSP430I2020TRHBR and revolutionize your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring longevity and reliability.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of power supply options, offering flexibility in different applications.

No. of Terminals: 32

Provides ample connectivity options for interfacing with external devices and peripherals.

CPU Family: MSP430

The MSP430 family is known for its low power consumption and high performance, making it an excellent choice for energy-efficient applications.

ROM Words: 16384

Large ROM capacity allows for storing a significant amount of program code, enabling complex algorithms to be implemented.

ADC Channels: YES

Built-in Analog to Digital Converters allow for accurate and efficient conversion of analog signals, essential for many sensor-based applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture typically offers high performance and efficiency, making it suitable for a wide range of applications.

Connectivity: I2C, IRDA, SPI(2), UART

Support for multiple communication protocols enables seamless integration with various devices and systems.

Technical Specifications

Microcontrollers MSP430I2020TRHBR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

16

No. of Serial I/Os:

1

No. of Terminals:

32

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

1024

RAM Words:

1

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16.384 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, SPI(2), UART

Peripherals:

BOD, TEMPERATURE SENSOR, TIMER(2), WDT

Analog To Digital Convertors:

2-Ch 24-Bit

Trade Compliance

MSP430I2020TRHBR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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