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MSP430I2020TPWR

Texas Instruments

MSP430I2020TPWR by Texas Instruments

MSP430I2020TPWR by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 16384 ROM words. It operates at a max clock frequency of 16.384 MHz, suitable for industrial applications requiring low power consumption and connectivity via I2C, IRDA, SPI, and UART interfaces.

Median Price

$1.988

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,901 parts In-Stock

1+ parts

$1.988

100+ parts

$1.742

1k+ parts

$0.984

10k+ parts

-

8,901

$1.988

$1.742

$0.984

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,670 parts In-Stock

1+ parts

$1.889

100+ parts

-

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4,670

$1.889

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Vyrian

USA . 7,570 parts In-Stock

1+ parts

-

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-

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7,570

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,579 parts In-Stock

1+ parts

$1.789

100+ parts

-

1k+ parts

-

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1,579

$1.789

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AZTECH Wire

Italy . 1,135 parts In-Stock

1+ parts

$18.140

100+ parts

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1,135

$18.140

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Parana Technologies

USA . 1,609 parts In-Stock

1+ parts

$66.807

100+ parts

-

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1,609

$66.807

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ChromeModa Solutions

Germany . 6,954 parts In-Stock

1+ parts

$75.064

100+ parts

$61.552

1k+ parts

-

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6,954

$75.064

$61.552

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IDEA Electronic Components Group

UK . 303 parts In-Stock

1+ parts

$75.064

100+ parts

$71.311

1k+ parts

$67.558

10k+ parts

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303

$75.064

$71.311

$67.558

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QUARKTWIN TECHNOLOGY LTD

USA . 18,615 parts In-Stock

1+ parts

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18,615

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DigiPath Technology Company

USA . 611 parts In-Stock

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$67.678

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611

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$67.678

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Overview

Discover the Texas Instruments MSP430I2020TPWR, a powerful microcontroller perfect for a wide range of applications. With a reputation for high-quality products, Texas Instruments delivers reliability and innovation in every device. This microcontroller offers incredible value with features like low power consumption, multiple ADC channels, and connectivity options such as I2C and UART. Whether you're designing IoT devices, smart sensors, or industrial control systems, the MSP430I2020TPWR provides the performance and efficiency you need to bring your projects to life. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the microcontroller lightweight and durable, perfect for portable or rugged applications.

Surface Mount: YES

Surface mount technology allows for easy and compact integration of the microcontroller onto PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in powering the microcontroller, accommodating various voltage requirements of connected components.

On Chip Data RAM Width: 8

The 8-bit data RAM width enables efficient processing and storage of data, enhancing the overall performance of the microcontroller.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy placement and orientation of the microcontroller on the PCB, simplifying the assembly process.

Bit Size: 16

With a 16-bit architecture, this microcontroller can handle complex algorithms and calculations, making it suitable for a wide range of applications.

No. of Terminals: 28

The 28 terminals provide ample connectivity options for interfacing with external devices, expanding the functionality of the microcontroller.

Minimum Supply Voltage: 2.2 V

The low minimum supply voltage allows for efficient power consumption and operation in low-power modes, ideal for battery-powered devices.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures reliable performance in harsh environmental conditions, making it suitable for industrial applications.

CPU Family: MSP430

The MSP430 CPU family is known for its low-power consumption and high performance, making this microcontroller energy-efficient and reliable.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows the microcontroller to function effectively in extreme cold environments, enhancing its versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and performance.

Technical Specifications

Microcontrollers MSP430I2020TPWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

16

No. of Serial I/Os:

1

No. of Terminals:

28

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

1024

RAM Words:

1

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16.384 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, SPI(2), UART

Peripherals:

BOD, TEMPERATURE SENSOR, TIMER(2), WDT

Analog To Digital Convertors:

2-Ch 24-Bit

Trade Compliance

MSP430I2020TPWR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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