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MSP430G2955IDA38

Texas Instruments

MSP430G2955IDA38 by Texas Instruments

MSP430G2955IDA38 by Texas Instruments is a 16-bit microcontroller with 57344 ROM words and 4 RAM words. It operates at a max clock frequency of 16 MHz, making it suitable for industrial applications requiring low power consumption and connectivity through I2C, LIN, SPI, and UART interfaces. With 12 ADC channels and 10-bit resolution, it offers precise analog to digital conversion capabilities.

Median Price

$4.360

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,565 parts In-Stock

1+ parts

$3.491

100+ parts

$3.059

1k+ parts

$1.728

10k+ parts

-

2,565

$3.491

$3.059

$1.728

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Mouser Electronics

USA . 376 parts In-Stock

1+ parts

$5.230

100+ parts

$3.550

1k+ parts

$2.910

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-

376

$5.230

$3.550

$2.910

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DigiKey

USA . 60 parts In-Stock

1+ parts

$5.230

100+ parts

$3.552

1k+ parts

$3.001

10k+ parts

$2.915

60

$5.230

$3.552

$3.001

$2.915

Arrow

USA . 400 parts In-Stock

1+ parts

-

100+ parts

$2.633

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-

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400

-

$2.633

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Distributors (In-Stock)

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DF Sales Co.

USA . 37 parts In-Stock

1+ parts

$2.000

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37

$2.000

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DF Sales Co.

USA . 37 parts In-Stock

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$2.000

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37

$2.000

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$2.540

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100

$2.540

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Digiode

USA . 3,584 parts In-Stock

1+ parts

$3.088

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-

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3,584

$3.088

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-

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TME

Poland . 14 parts In-Stock

1+ parts

$3.300

100+ parts

-

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14

$3.300

-

-

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Vyrian

USA . 7,417 parts In-Stock

1+ parts

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7,417

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Infinite Electronics LLP

India . 997 parts In-Stock

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997

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Distributors (Availability)

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Ampacity Inc.

Singapore . 979 parts In-Stock

1+ parts

$2.000

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-

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979

$2.000

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Corphita

USA . 4,943 parts In-Stock

1+ parts

$2.925

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4,943

$2.925

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Parana Technologies

USA . 1,825 parts In-Stock

1+ parts

$33.974

100+ parts

-

1k+ parts

$138.435

10k+ parts

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1,825

$33.974

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$138.435

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DigiPath Technology Company

USA . 1,472 parts In-Stock

1+ parts

$37.410

100+ parts

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1,472

$37.410

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ChromeModa Solutions

Germany . 3,538 parts In-Stock

1+ parts

$38.173

100+ parts

$31.302

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3,538

$38.173

$31.302

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IDEA Electronic Components Group

UK . 2,092 parts In-Stock

1+ parts

$38.173

100+ parts

$36.264

1k+ parts

$34.356

10k+ parts

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2,092

$38.173

$36.264

$34.356

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Lixinc

USA . 13,301 parts In-Stock

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13,301

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Perfect Parts

USA . 986 parts In-Stock

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986

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Overview

Unlock the potential of your next project with the Texas Instruments MSP430G2955IDA38 microcontroller. Designed with precision and reliability in mind, Texas Instruments is known for delivering top-quality products that exceed expectations. Ideal for a wide range of applications, this microcontroller offers unmatched value, benefits, and advantages to customers looking for efficient performance and versatility. Experience the power of innovation with the MSP430G2955IDA38 and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This lightweight and durable material ensures longevity and reliability of the product.

Surface Mount: YES

Allows for easy installation and space-saving on circuit boards.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power requirements for various applications.

On Chip Data RAM Width: 8

Offers fast access to data for efficient processing tasks.

Package Shape: RECTANGULAR

Fits well with standard design layouts for seamless integration.

Bit Size: 16

Provides sufficient processing power for a wide range of applications.

Power Supplies (V): 2/3.3

Supports multiple voltage options for enhanced compatibility.

No. of Terminals: 38

Offers ample connectivity options for external components.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Enables compact and space-efficient designs.

Minimum Supply Voltage: 3.3 V

Ensures stable operation even at lower voltage levels.

Maximum Operating Temperature: 85 °C

Can withstand high-temperature environments without compromising performance.

CPU Family: MSP430

Known for its energy efficiency and high-performance capabilities.

Minimum Operating Temperature: -40 °C

Suitable for use in extreme cold conditions without impact on functionality.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Ensures reliable electrical connections and corrosion resistance.

ADC Channels: YES

Allows for precise analog-to-digital conversion for sensor applications.

Terminal Position: DUAL

Facilitates secure mounting and connectivity in circuit layouts.

ROM Words: 57344

Sufficient memory capacity for storing program instructions and data.

Maximum Seated Height: 1.2 mm

Low-profile design for space-constrained applications.

RAM Words: 4

Provides quick access to temporary data storage for processing tasks.

Width: 6.1 mm

Compact size for fitting in tight spaces.

Boundary Scan: YES

Enables efficient testing and debugging during development and production phases.

Peripherals: BOR, COMPARATOR(8), POR, PWM, TIMER(3), WDT

Offers a wide range of integrated features for diverse functionality.

Maximum Clock Frequency: 16 MHz

Provides fast processing speeds for real-time applications.

Peak Reflow Temperature °C: 260

Withstands high-temperature soldering processes for assembly.

Length: 12.5 mm

Balanced size for compatibility with standard circuit board layouts.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes advanced RISC architecture for efficient performance.

No. of Timers: 3

Enables precise timing control for various operations.

RAM Bytes: 4096

Sufficient memory capacity for temporary data storage.

Technology: CMOS

Offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Secure and reliable terminal design for soldering connections.

Analog To Digital Convertors: 12-Ch 10-Bit

Allows for accurate conversion of analog signals for digital processing.

Maximum Supply Current: 0.45 mA

Energy-efficient operation for battery-powered applications.

PWM Channels: YES

Supports pulse-width modulation for precise control of outputs.

Connectivity: I2C, IRDA, LIN, SPI(2), UART

Extensive connectivity options for communication with external devices.

ROM Programmability: FLASH

Allows for reprogramming of memory for flexibility in application development.

Terminal Pitch: 0.65 mm

Standard pitch for compatibility with common connectors.

Format: FIXED POINT

Suitable for applications requiring fixed-point arithmetic computations.

Moisture Sensitivity Level (MSL): 2

Designed to withstand moderate moisture levels during operation.

Speed: 16 rpm

Capable of processing tasks at a high speed for quick response times.

Low Power Mode: YES

Offers energy-saving features for efficient power management.

On Chip Program ROM Width: 8

Enables fast access to program instructions for smooth operation.

No. of I/O Lines: 32

Sufficient input/output lines for connecting to external components and sensors.

Technical Specifications

Microcontrollers MSP430G2955IDA38 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8V SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

12.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

32

No. of Serial I/Os:

1

No. of Terminals:

38

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4

ROM Words:

57344

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.45 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.1 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, LIN, SPI(2), UART

Peripherals:

BOR, COMPARATOR(8), POR, PWM, TIMER(3), WDT

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

MSP430G2955IDA38 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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