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MSP430G2744IRHA40T

Texas Instruments

MSP430G2744IRHA40T by Texas Instruments

MSP430G2744IRHA40T by Texas Instruments is a 16-bit microcontroller with 32 I/O lines, 1024 bytes of RAM, and 32768 ROM words. It operates at a max clock frequency of 16 MHz and features 12-Ch 10-Bit ADC channels for analog to digital conversion. Ideal for industrial applications requiring low power consumption and connectivity through USCI interface.

Median Price

$2.890

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 112 parts In-Stock

1+ parts

$1.880

100+ parts

$1.426

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-

10k+ parts

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112

$1.880

$1.426

-

-

Chip1Stop

Japan . 112 parts In-Stock

1+ parts

$2.100

100+ parts

$1.430

1k+ parts

-

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112

$2.100

$1.430

-

-

Mouser Electronics

USA . 29 parts In-Stock

1+ parts

$3.680

100+ parts

$2.550

1k+ parts

$2.010

10k+ parts

$1.980

29

$3.680

$2.550

$2.010

$1.980

DigiKey

USA . 46 parts In-Stock

1+ parts

$4.010

100+ parts

$2.784

1k+ parts

$2.293

10k+ parts

-

46

$4.010

$2.784

$2.293

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,633 parts In-Stock

1+ parts

$1.786

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-

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2,633

$1.786

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$1.994

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-

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50

$1.994

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Vyrian

USA . 6,053 parts In-Stock

1+ parts

-

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6,053

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Inventory MP

USA . 10 parts In-Stock

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10

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Bristol Electronics

USA . 10 parts In-Stock

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-

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10

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Distributors (Availability)

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Ampacity Inc.

Singapore . 75 parts In-Stock

1+ parts

$1.600

100+ parts

-

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75

$1.600

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Corphita

USA . 1,607 parts In-Stock

1+ parts

$1.692

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-

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1,607

$1.692

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$1.954

100+ parts

-

1k+ parts

$1.876

10k+ parts

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100

$1.954

-

$1.876

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Argo Parts USA

USA . 3,425 parts In-Stock

1+ parts

$1.994

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3,425

$1.994

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Continental Prestige Electronics

USA . 3,365 parts In-Stock

1+ parts

$1.994

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1k+ parts

-

10k+ parts

$1.954

3,365

$1.994

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-

$1.954

AZTECH Wire

Italy . 782 parts In-Stock

1+ parts

$11.001

100+ parts

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782

$11.001

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$57.106

100+ parts

$51.966

1k+ parts

$46.827

10k+ parts

-

1,000

$57.106

$51.966

$46.827

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Parana Technologies

USA . 233 parts In-Stock

1+ parts

$74.102

100+ parts

-

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233

$74.102

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DigiPath Technology Company

USA . 2,094 parts In-Stock

1+ parts

$81.596

100+ parts

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2,094

$81.596

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ChromeModa Solutions

Germany . 4,564 parts In-Stock

1+ parts

$83.261

100+ parts

$68.274

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4,564

$83.261

$68.274

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IDEA Electronic Components Group

UK . 1,273 parts In-Stock

1+ parts

$83.261

100+ parts

$79.098

1k+ parts

$74.935

10k+ parts

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1,273

$83.261

$79.098

$74.935

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Perfect Parts

USA . 241 parts In-Stock

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241

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Overview

Unlock the power of innovation with the Texas Instruments MSP430G2744IRHA40T microcontroller. Known for its superior quality and reliability, Texas Instruments leads the industry in microcontroller technology. Perfect for a wide range of applications, this microcontroller offers customers unparalleled value and benefits. From low power consumption to high performance, the MSP430G2744IRHA40T provides advanced features that set it apart from the competition. Experience the difference with Texas Instruments and unleash the full potential of your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ensuring protection for the microcontroller.

Surface Mount: YES

Surface mount capability allows for easy and efficient mounting on PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6V allows for compatibility with a wide range of power sources, increasing flexibility in design.

On Chip Data RAM Width: 8

8-bit width of on-chip data RAM enables efficient data processing and storage within the microcontroller.

Package Shape: SQUARE

Square package shape facilitates easier placement and alignment on PCBs, optimizing space utilization.

Bit Size: 16

16-bit processing capability provides enhanced performance and computational power for the microcontroller.

Power Supplies (V): 2/3.3

Support for dual power supply voltages (2V and 3.3V) allows for compatibility with different power sources, increasing versatility.

No. of Terminals: 40

40 terminals provide ample connectivity options for peripherals and external components, enabling robust system integration.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Variety of package styles including chip carrier, heat sink/slug, and very thin profile offers flexibility in design and thermal management.

Minimum Supply Voltage: 1.8 V

Support for a minimum supply voltage of 1.8V ensures efficient power consumption and operation in low-power applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C ensures reliable performance in harsh environmental conditions.

CPU Family: MSP430

Belonging to the MSP430 CPU family signifies high-quality and efficient processing capabilities for the microcontroller.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C ensures reliable operation in cold environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/Palladium/Gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

ADC Channels: YES

Integrated ADC channels enable analog-to-digital conversion, expanding the microcontroller's sensing and measurement capabilities.

Terminal Position: QUAD

Quad terminal position allows for easy and secure connection to external components, enhancing reliability in system integration.

ROM Words: 32768

Large ROM capacity of 32768 words allows for storing and executing complex program codes efficiently.

Maximum Seated Height: 1 mm

Low maximum seated height of 1mm saves space and ensures compatibility with compact electronic devices.

Width: 6 mm

Narrow width of 6mm enables easy integration into space-constrained designs.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the microcontroller during manufacturing and development stages.

Peripherals: BOD, POR, TIMER(2)

Integrated peripherals such as Brown-Out Detection, Power-On Reset, and 2 timers enhance system functionality and performance.

Maximum Clock Frequency: 16 MHz

High maximum clock frequency of 16MHz enables fast data processing and execution of operations, enhancing overall performance.

Peak Reflow Temperature °C: 260

Capability to withstand peak reflow temperature of 260°C ensures robust soldering and assembly reliability.

Length: 6 mm

Compact length of 6mm allows for easy placement and integration into small form factor devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in a wide range of environmental conditions, making it suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Integrated peripheral IC type as a microcontroller with RISC architecture ensures efficient processing and reduced power consumption.

No. of Timers: 2

Presence of 2 timers allows for precise timing control and synchronization of operations within the microcontroller.

RAM Bytes: 1024

Ample RAM capacity of 1024 bytes enables efficient data storage and processing within the microcontroller, supporting complex algorithms and applications.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliability for the microcontroller's operation.

Terminal Form: NO LEAD

No-lead terminal form simplifies soldering and assembly processes, reducing the risk of solder bridging and improving reliability.

Analog To Digital Convertors: 12-Ch 10-Bit

12-channel 10-bit ADC converters enable accurate conversion of analog signals to digital data, expanding the microcontroller's functionality.

Maximum Supply Current: 0.55 mA

Low maximum supply current consumption of 0.55mA ensures energy efficiency in operation, ideal for battery-powered applications.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3V provides stable and reliable power input for the microcontroller, ensuring consistent performance.

PWM Channels: YES

Support for PWM channels allows for precise control of motor speeds, LED brightness, and other analog output applications.

Connectivity: USCI

Integrated USCI connectivity provides versatile communication interfaces for connecting external devices and peripherals.

ROM Programmability: FLASH

Flash ROM programmability enables easy and flexible firmware updates and customization for the microcontroller.

Terminal Pitch: 0.5 mm

Narrow terminal pitch of 0.5mm allows for high-density mounting and space-saving design, suitable for compact electronic devices.

Format: FIXED POINT

Fixed-point format enhances numerical accuracy and efficiency in mathematical calculations and data processing tasks.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates moderate sensitivity to moisture, requiring proper handling and packaging during assembly and storage.

Speed: 16 rpm

Speed specification of 16 rpm reflects the microcontroller's processing speed and capability to execute instructions efficiently.

Low Power Mode: YES

Low power mode feature allows for energy-efficient operation, prolonging battery life and reducing overall power consumption.

On Chip Program ROM Width: 8

8-bit width of on-chip program ROM enables efficient storage and execution of program code within the microcontroller.

No. of I/O Lines: 32

32 I/O lines provide versatile interfacing options for connecting to external devices, sensors, and peripherals, enhancing system integration capabilities.

Technical Specifications

Microcontrollers MSP430G2744IRHA40T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

32

No. of Serial I/Os:

1

No. of Terminals:

40

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

RAM Words:

1

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

USCI

Peripherals:

BOD, POR, TIMER(2)

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

MSP430G2744IRHA40T Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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