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MSP430G2533IRHB32T

Texas Instruments

MSP430G2533IRHB32T by Texas Instruments

MSP430G2533IRHB32T by Texas Instruments is a 16-bit microcontroller with 8KB ROM and 512B RAM. It operates at up to 0.032 MHz, has 8 ADC channels, and supports peripherals like BOD, DMA(1), TIMER(6), WDT. Ideal for industrial applications requiring low power consumption and connectivity via I2C, IRDA, SPI(2), UART, USCI(2).

Median Price

$3.910

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,000 parts In-Stock

1+ parts

$2.535

100+ parts

$2.221

1k+ parts

$1.255

10k+ parts

-

4,000

$2.535

$2.221

$1.255

-

DigiKey

USA . 373 parts In-Stock

1+ parts

$3.910

100+ parts

$2.452

1k+ parts

$2.326

10k+ parts

-

373

$3.910

$2.452

$2.326

-

Mouser Electronics

USA . 160 parts In-Stock

1+ parts

$3.910

100+ parts

$2.460

1k+ parts

$2.230

10k+ parts

-

160

$3.910

$2.460

$2.230

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,480 parts In-Stock

1+ parts

$2.408

100+ parts

-

1k+ parts

-

10k+ parts

-

2,480

$2.408

-

-

-

NAC Semi

USA . 474 parts In-Stock

1+ parts

$12.650

100+ parts

-

1k+ parts

-

10k+ parts

-

474

$12.650

-

-

-

Chip Stock

USA . 29,290 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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29,290

-

-

-

-

Vyrian

USA . 2,512 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,512

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

250

-

-

-

-

Bristol Electronics

USA . 250 parts In-Stock

1+ parts

-

100+ parts

$1.264

1k+ parts

$1.174

10k+ parts

-

250

-

$1.264

$1.174

-

Dan-Mar Components

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

250

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,057 parts In-Stock

1+ parts

$2.282

100+ parts

-

1k+ parts

-

10k+ parts

-

3,057

$2.282

-

-

-

Microchip USA

USA . 1,152 parts In-Stock

1+ parts

$15.240

100+ parts

$15.150

1k+ parts

$15.100

10k+ parts

$15.050

1,152

$15.240

$15.150

$15.100

$15.050

Parana Technologies

USA . 153 parts In-Stock

1+ parts

$67.746

100+ parts

-

1k+ parts

-

10k+ parts

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153

$67.746

-

-

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DigiPath Technology Company

USA . 1,024 parts In-Stock

1+ parts

$74.597

100+ parts

-

1k+ parts

-

10k+ parts

-

1,024

$74.597

-

-

-

ChromeModa Solutions

Germany . 4,002 parts In-Stock

1+ parts

$76.119

100+ parts

$62.418

1k+ parts

-

10k+ parts

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4,002

$76.119

$62.418

-

-

IDEA Electronic Components Group

UK . 900 parts In-Stock

1+ parts

$76.119

100+ parts

$72.313

1k+ parts

$68.507

10k+ parts

-

900

$76.119

$72.313

$68.507

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Perfect Parts

USA . 3,985 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,985

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-

-

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,500

-

-

-

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A-Z Elektronik GmbH

Germany . 2,250 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,250

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-

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Overview

Unlock the potential of your electronic projects with the Texas Instruments MSP430G2533IRHB32T microcontroller. Manufactured by a trusted industry leader, this versatile chip offers high-quality performance for a wide range of applications. With low power consumption and advanced features like ADC and DMA channels, this microcontroller provides excellent value and flexibility for your designs. Experience the benefits of reliable connectivity, efficient power management, and robust peripherals, all in a compact and durable package. Choose Texas Instruments for cutting-edge technology that delivers results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good protection and durability for the microcontroller, ensuring reliability in various operating conditions.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power input options and compatibility with different voltage sources.

CPU Family: MSP430

MSP430 CPU family is known for low power consumption and high performance, making this microcontroller suitable for energy-efficient applications.

ADC Channels: YES

Analog to Digital Converters (ADC) enable the microcontroller to read analog signals from the environment, enhancing its sensor interface capabilities.

DMA Channels: YES

Direct Memory Access (DMA) channels allow for efficient data transfer without CPU intervention, improving overall system performance.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in the microcontroller ensures fast and streamlined execution of instructions, enhancing the processing speed of the device.

ROM Programmability: FLASH

Flash programmable ROM enables easy and flexible firmware updates, making the microcontroller adaptable to changing requirements.

Low Power Mode: YES

Low power mode functionality helps in conserving energy and prolonging battery life in portable or battery-powered applications.

Technical Specifications

Microcontrollers MSP430G2533IRHB32T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

1

No. of I/O Lines:

24

No. of Serial I/Os:

2

No. of Terminals:

32

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

512

RAM Words:

0.5

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.42 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SPI(2), UART, USCI(2)"

Peripherals:

"BOD, DMA(1), TIMER(6), WDT"

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430G2533IRHB32T Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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