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MSP430G2513IPW28

Texas Instruments

MSP430G2513IPW28 by Texas Instruments

MSP430G2513IPW28 by Texas Instruments is a 16-bit microcontroller with 2/3.3V power supplies, 16384 ROM words, and 512 RAM bytes. Ideal for industrial applications, it features peripherals like BOD, DMA(1), and operates at a max clock frequency of 16 MHz. With low power mode and connectivity options including I2C and UART, it offers versatile performance in a compact package.

Median Price

$3.088

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,850 parts In-Stock

1+ parts

$2.677

100+ parts

$2.211

1k+ parts

$1.195

10k+ parts

-

2,850

$2.677

$2.211

$1.195

-

DigiKey

USA . 271 parts In-Stock

1+ parts

$3.500

100+ parts

$2.176

1k+ parts

$2.063

10k+ parts

-

271

$3.500

$2.176

$2.063

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,826 parts In-Stock

1+ parts

$2.138

100+ parts

-

1k+ parts

-

10k+ parts

-

2,826

$2.138

-

-

-

Vyrian

USA . 4,856 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,856

-

-

-

-

Bristol Electronics

USA . 150 parts In-Stock

1+ parts

-

100+ parts

$1.338

1k+ parts

-

10k+ parts

-

150

-

$1.338

-

-

Dan-Mar Components

USA . 150 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

150

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,514 parts In-Stock

1+ parts

$2.025

100+ parts

-

1k+ parts

-

10k+ parts

-

2,514

$2.025

-

-

-

Microchip USA

USA . 1,450 parts In-Stock

1+ parts

$20.800

100+ parts

$20.670

1k+ parts

$20.610

10k+ parts

$20.540

1,450

$20.800

$20.670

$20.610

$20.540

Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$33.383

100+ parts

$30.379

1k+ parts

$27.374

10k+ parts

-

50

$33.383

$30.379

$27.374

-

Parana Technologies

USA . 1,965 parts In-Stock

1+ parts

$49.852

100+ parts

$4,629.557

1k+ parts

$44.867

10k+ parts

-

1,965

$49.852

$4,629.557

$44.867

-

DigiPath Technology Company

USA . 966 parts In-Stock

1+ parts

$54.894

100+ parts

-

1k+ parts

-

10k+ parts

-

966

$54.894

-

-

-

ChromeModa Solutions

Germany . 5,993 parts In-Stock

1+ parts

$56.014

100+ parts

$45.931

1k+ parts

-

10k+ parts

-

5,993

$56.014

$45.931

-

-

IDEA Electronic Components Group

UK . 1,823 parts In-Stock

1+ parts

$56.014

100+ parts

$53.213

1k+ parts

$50.413

10k+ parts

-

1,823

$56.014

$53.213

$50.413

-

Overview

Unlock the power of innovation with the MSP430G2513IPW28 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers that set the standard for excellence. Ideal for a wide range of applications, this device offers unmatched value with its high performance and reliability. Experience the benefits of seamless connectivity, low power consumption, and advanced features that cater to your specific needs. Trust Texas Instruments to provide cutting-edge solutions that drive your projects forward. Elevate your designs with the MSP430G2513IPW28 and stay ahead of the curve.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, ideal for portable applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage provides flexibility in power supply options and compatibility with various systems.

On Chip Data RAM Width: 8

Wider on-chip data RAM width allows for faster data processing and storage capabilities.

Package Shape: RECTANGULAR

Rectangular shape makes the package compact and space-efficient for integration in small devices.

Bit Size: 16

16-bit architecture enables efficient data processing and computation tasks.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages enhances compatibility with different power sources.

No. of Terminals: 28

Sufficient number of terminals provide ample connectivity options for interfacing with external devices.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style with thin profile saves space on the PCB and allows for high-density mounting.

Minimum Supply Voltage: 3.3 V

Relatively low minimum supply voltage reduces power consumption and extends battery life in portable devices.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures reliable performance in harsh environmental conditions.

CPU Family: MSP430

MSP430 CPU family is known for its low power consumption and high performance, making it suitable for battery-powered devices.

Minimum Operating Temperature: -40 °C

Wide temperature range allows the microcontroller to operate in extreme cold conditions without compromising performance.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel, palladium, and gold terminal finish ensures excellent conductivity and corrosion resistance for long-term reliability.

DMA Channels: YES

Direct Memory Access (DMA) support offloads data transfer tasks from the CPU, improving overall system efficiency.

Terminal Position: DUAL

Dual terminal position provides stability and reliable connections on the PCB, reducing the risk of signal interference.

ROM Words: 16384

Large ROM capacity enables storage of program instructions, data tables, and configuration settings for complex applications.

Maximum Seated Height: 1.2 mm

Low seated height allows for compact and slim device designs, perfect for space-constrained applications.

RAM Words: 0.5

Limited RAM capacity may restrict the microcontroller's ability to handle large datasets or perform complex calculations.

Width: 4.4 mm

Narrow width facilitates compact board layout and space-saving designs in small electronic devices.

Boundary Scan: YES

Boundary scan support simplifies testing and debugging of PCBs during manufacturing, enhancing overall product quality.

Peripherals: BOD, COMPARATOR(8), DMA(1), TIMER(2), WDT

Rich set of peripherals such as BOD, comparators, DMA, timers, and watchdog timer enhance the microcontroller's functionality for diverse applications.

Maximum Clock Frequency: 16 MHz

High maximum clock frequency allows for fast processing speeds and real-time operation in time-critical applications.

Peak Reflow Temperature °C: 260

High peak reflow temperature withstands the soldering process during PCB assembly, ensuring reliable solder joints.

Length: 9.7 mm

Moderate length provides a balance between compact size and ease of handling during PCB assembly and mounting.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures stable and reliable performance in demanding industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in a microcontroller design offers high computational efficiency and low power consumption for battery-operated devices.

No. of Timers: 2

Multiple timers allow for precise timing control and event management in time-sensitive applications.

RAM Bytes: 512

Generous RAM capacity enables efficient data storage and manipulation, supporting a wide range of application requirements.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and noise immunity, making the microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form provides reliable solder connections and easy automated assembly during PCB manufacturing.

Maximum Supply Current: 0.42 mA

Low maximum supply current consumption minimizes power usage and extends battery life in portable and battery-operated devices.

PWM Channels: YES

Pulse Width Modulation (PWM) support enables precise control of analog signals, essential for motor control and dimming applications.

Connectivity: I2C, IRDA, LIN, SPI, UART, USCI(2)

Versatile connectivity options such as I2C, IRDA, LIN, SPI, UART, and USCI facilitate interfacing with various external devices and communication protocols.

ROM Programmability: FLASH

Flash programmability allows for easy and fast reprogramming of the ROM, essential for firmware updates and customization.

Terminal Pitch: 0.65 mm

Narrow terminal pitch allows for high-density mounting on the PCB, saving space and enabling miniaturization of electronic devices.

Format: FIXED POINT

Fixed-point format simplifies numerical calculations and optimizes performance in arithmetic operations without the complexity of floating-point arithmetic.

Speed: 16 rpm

At 16 rotations per minute, the microcontroller delivers fast processing speeds for real-time applications, ensuring quick response times.

Low Power Mode: YES

Low power mode feature conserves energy by reducing power consumption during idle or low-activity periods, prolonging battery life.

On Chip Program ROM Width: 8

Wider on-chip program ROM width provides ample space for storing program instructions and firmware, enhancing the microcontroller's versatility.

No. of I/O Lines: 24

Sufficient I/O lines allow for robust interfacing with external sensors, actuators, and peripherals, expanding the microcontroller's applicability.

Technical Specifications

Microcontrollers MSP430G2513IPW28 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES AT 1.8V AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

1

No. of I/O Lines:

24

No. of Serial I/Os:

1

No. of Terminals:

28

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

512

RAM Words:

0.5

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.42 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI, UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR(8), DMA(1), TIMER(2), WDT"

Trade Compliance

MSP430G2513IPW28 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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