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MSP430G2453IPW8RQ1

Texas Instruments

MSP430G2453IPW8RQ1 by Texas Instruments

MSP430G2453IPW8RQ1 by Texas Instruments is a 16-bit microcontroller with 512 bytes of RAM, 8 ADC channels, and PWM support. Ideal for industrial applications, it operates b/w -40 to 85°C with a supply voltage range of 3.3-3.6V. Its compact design (9.7mm x 4.4mm) and low profile make it suitable for space-constrained projects requiring efficient power management and connectivity via USCI interface.

Median Price

$1.585

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 117 parts In-Stock

1+ parts

$0.973

100+ parts

$0.670

1k+ parts

-

10k+ parts

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117

$0.973

$0.670

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-

Arrow

USA . 117 parts In-Stock

1+ parts

$1.692

100+ parts

$1.585

1k+ parts

-

10k+ parts

-

117

$1.692

$1.585

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-

Texas Instruments

USA . 450 parts In-Stock

1+ parts

$2.610

100+ parts

-

1k+ parts

-

10k+ parts

-

450

$2.610

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-

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Verical

USA . 117 parts In-Stock

1+ parts

-

100+ parts

$1.585

1k+ parts

-

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117

-

$1.585

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Mouser Electronics

USA . 20 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.570

20

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-

$1.570

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 594 parts In-Stock

1+ parts

$0.670

100+ parts

-

1k+ parts

-

10k+ parts

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594

$0.670

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-

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Vyrian

USA . 6,623 parts In-Stock

1+ parts

-

100+ parts

-

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6,623

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 35 parts In-Stock

1+ parts

$0.570

100+ parts

-

1k+ parts

-

10k+ parts

-

35

$0.570

-

-

-

Corphita

USA . 4,435 parts In-Stock

1+ parts

$0.634

100+ parts

-

1k+ parts

-

10k+ parts

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4,435

$0.634

-

-

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Parana Technologies

USA . 407 parts In-Stock

1+ parts

$43.060

100+ parts

-

1k+ parts

-

10k+ parts

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407

$43.060

-

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Microchip USA

USA . 1,506 parts In-Stock

1+ parts

$45.190

100+ parts

$44.540

1k+ parts

$44.220

10k+ parts

$43.900

1,506

$45.190

$44.540

$44.220

$43.900

DigiPath Technology Company

USA . 126 parts In-Stock

1+ parts

$47.414

100+ parts

-

1k+ parts

-

10k+ parts

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126

$47.414

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-

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ChromeModa Solutions

Germany . 3,875 parts In-Stock

1+ parts

$48.382

100+ parts

$39.673

1k+ parts

-

10k+ parts

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3,875

$48.382

$39.673

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IDEA Electronic Components Group

UK . 139 parts In-Stock

1+ parts

$48.382

100+ parts

$45.963

1k+ parts

$43.544

10k+ parts

-

139

$48.382

$45.963

$43.544

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Overview

Unlock the power of innovation with the MSP430G2453IPW8RQ1 by Texas Instruments, a high-quality microcontroller designed to meet the demands of a wide range of applications. With advanced technology and reliable performance, Texas Instruments sets the standard for excellence in the industry. This versatile device offers customers value, benefits, and advantages that go beyond expectations. From automotive to industrial applications, the MSP430G2453IPW8RQ1 provides the perfect solution for your next project. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection for the microcontroller, making it suitable for various industrial applications.

Surface Mount: YES

Ease of assembly and compatibility with modern PCB manufacturing processes.

Maximum Supply Voltage: 3.6 V

Allows for a wide operating voltage range, increasing flexibility in design.

Screening Level: AEC-Q100

High reliability and quality assurance, ideal for automotive applications.

Bit Size: 16

Provides sufficient processing power for a wide range of embedded applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient performance and low power consumption, ideal for embedded systems.

RAM Bytes: 512

Adequate RAM for data storage and manipulation in embedded applications.

ADC Channels: YES

Ability to interface with analog sensors and signals for diverse applications.

DMA Channels: YES

Improves data transfer efficiency and offloads CPU for other tasks.

Connectivity: USCI

Flexible communication interface for connecting peripherals and external devices.

ROM Programmability: FLASH

Allows for easy reprogramming of firmware without removing the microcontroller from the circuit.

Technical Specifications

Microcontrollers MSP430G2453IPW8RQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

32768HZ NOMINAL CRYSTAL CLOCK AVAILABLE

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

24

No. of Terminals:

28

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

512

ROM Words:

0

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

USCI

Peripherals:

BOD, COMPARATOR(8), DMA, POR, TIMER(2), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430G2453IPW8RQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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