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MSP430G2444IYFFR

Texas Instruments

MSP430G2444IYFFR by Texas Instruments

MSP430G2444IYFFR by Texas Instruments is a 16-bit microcontroller with 512 bytes of RAM and 8448 ROM words. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption and connectivity via I2C, IRDA, LIN, SPI(2), UART.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,492 parts In-Stock

1+ parts

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7,492

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Digiode

USA . 3,312 parts In-Stock

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3,312

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 843 parts In-Stock

1+ parts

$6.000

100+ parts

-

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843

$6.000

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AZTECH Wire

Italy . 288 parts In-Stock

1+ parts

$6.144

100+ parts

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288

$6.144

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Parana Technologies

USA . 743 parts In-Stock

1+ parts

$26.430

100+ parts

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$27.015

10k+ parts

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743

$26.430

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$27.015

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ChromeModa Solutions

Germany . 5,142 parts In-Stock

1+ parts

$29.697

100+ parts

$24.352

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5,142

$29.697

$24.352

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IDEA Electronic Components Group

UK . 564 parts In-Stock

1+ parts

$29.697

100+ parts

$28.212

1k+ parts

$26.727

10k+ parts

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564

$29.697

$28.212

$26.727

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Corphita

USA . 1,504 parts In-Stock

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1,504

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DigiPath Technology Company

USA . 1,101 parts In-Stock

1+ parts

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$26.775

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1,101

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$26.775

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Microchip USA

USA . 193 parts In-Stock

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193

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Overview

Discover the unparalleled quality and reliability of Texas Instruments with the MSP430G2444IYFFR microcontroller. Perfect for a wide range of applications, this product offers unmatched value and benefits to customers. With features like low power consumption, high performance, and a variety of connectivity options, the MSP430G2444IYFFR is the ideal choice for your next project. Trust in Texas Instruments for cutting-edge technology and superior products that deliver results.

Feature Benefit Bullets

Surface Mount YES

Surface mount technology allows for smaller and more compact designs, making it easier to integrate into various electronic devices.

Maximum Supply Voltage 3.6 V

High maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of applications.

Package Shape RECTANGULAR

Rectangular package shape makes it easy to handle and mount the microcontroller onto a PCB, simplifying the assembly process.

Bit Size 16

16-bit architecture provides sufficient processing power for a variety of tasks while still being cost-effective.

Power Supplies (V) 2/3.3

Support for multiple power supply voltages allows for compatibility with different power sources and systems, increasing versatility.

No. of Terminals 49

High number of terminals provides ample connectivity options for interfacing with external devices and peripherals.

Package Style (Meter) GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a thin profile and fine pitch enhances the product's overall reliability and performance in compact designs.

Minimum Supply Voltage 1.8 V

Low minimum supply voltage helps in reducing power consumption and extends battery life in portable devices.

Maximum Operating Temperature 85 °C

The high maximum operating temperature allows the microcontroller to function reliably in harsh environmental conditions.

CPU Family MSP430

Belonging to the MSP430 CPU family ensures compatibility with existing software tools and development environments, simplifying the design process.

Minimum Operating Temperature -40 °C

The low minimum operating temperature makes the microcontroller suitable for use in a wide range of environments, including industrial settings.

Terminal Finish TIN SILVER COPPER

The terminal finish provides excellent conductivity and corrosion resistance, ensuring a reliable connection with the PCB.

ADC Channels YES

The presence of Analog-to-Digital Converter (ADC) channels allows for analog signal processing, enabling the microcontroller to interface with analog sensors and devices.

Terminal Position BOTTOM

Bottom terminal position simplifies the PCB layout and routing, making the assembly process more efficient.

ROM Words 8448

The large ROM capacity allows for storing a significant amount of program code and data, enabling the microcontroller to handle complex tasks.

Maximum Seated Height 0.625 mm

Low maximum seated height enables the microcontroller to be used in slim and compact electronic devices without compromising space constraints.

Width 3.33 mm

Narrow width facilitates the integration of the microcontroller into space-constrained PCB designs, providing more flexibility in layout.

Peripherals BOD, TIMER(2), WDT

Integrated peripherals like Brown Out Detector (BOD), timers, and Watchdog Timer (WDT) enhance the microcontroller's functionality and performance.

Maximum Clock Frequency 16 MHz

High maximum clock frequency allows for fast processing and operation, making the microcontroller suitable for applications requiring real-time responsiveness.

Maximum Time At Peak Reflow Temperature (s) 30

The long maximum time at peak reflow temperature ensures proper soldering during assembly, contributing to the product's reliability and durability.

Peak Reflow Temperature °C 260

High peak reflow temperature supports lead-free soldering and ensures robust solder joints, enhancing the product's mechanical integrity.

Length 3.488 mm

Compact length facilitates the placement of the microcontroller in space-limited designs, optimizing the use of PCB real estate.

Temperature Grade INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments with wide temperature fluctuations, making the product suitable for industrial applications.

Peripheral IC Type MICROCONTROLLER, RISC

The microcontroller with Reduced Instruction Set Computing (RISC) architecture offers high performance, reduced power consumption, and efficient code execution.

RAM Bytes 512

Ample RAM capacity enables efficient data processing and temporary storage, enhancing the microcontroller's multitasking capabilities.

Technology CMOS

CMOS technology provides low power consumption, high speed, and compatibility with various digital systems, making the microcontroller energy-efficient and versatile.

Terminal Form BALL

Ball terminal form simplifies the soldering process and improves the reliability of electrical connections, ensuring a secure attachment to the PCB.

Analog To Digital Convertors 12-Ch 10-Bit

The 12-channel 10-bit Analog-to-Digital Converter (ADC) allows for accurate analog signal conversion and processing, expanding the microcontroller's input capabilities.

Maximum Supply Current 0.55 mA

Low maximum supply current helps in reducing power consumption and extending battery life in battery-powered applications.

Nominal Supply Voltage 3.3 V

The nominal supply voltage of 3.3 V ensures compatibility with standard power sources and electronic components, simplifying the design and integration process.

PWM Channels YES

The presence of Pulse Width Modulation (PWM) channels allows for precise control of analog devices, such as motors and LEDs, enhancing the microcontroller's versatility.

Connectivity I2C, IRDA, LIN, SPI(2), UART

Support for multiple communication interfaces (I2C, IRDA, LIN, SPI, UART) enables seamless connectivity with a wide range of external devices, sensors, and peripherals.

ROM Programmability FLASH

Flash ROM programmability facilitates easy code updates and modifications, allowing for firmware upgrades without the need for external programming tools.

Terminal Pitch 0.4 mm

Fine terminal pitch enables high-density mounting on PCBs, increasing the number of components that can be placed within a limited space.

Speed 16 rpm

High-speed processing at 16 rpm allows for efficient execution of tasks and operations, enhancing the microcontroller's overall performance.

On Chip Program ROM Width 8

The presence of an 8-bit on-chip program ROM width ensures compatibility with various software tools and development environments, simplifying the programming process.

No. of I/O Lines 32

High number of Input/Output (I/O) lines provides ample connectivity options for interfacing with external devices, sensors, and peripherals, making the microcontroller versatile in application.

Technical Specifications

Microcontrollers MSP430G2444IYFFR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-XBGA-B49

JESD-609 Code:

e1

Length:

3.488 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

32

No. of Terminals:

49

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA49,7X7,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

8448

ROM Programmability:

FLASH

Maximum Seated Height:

.625 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.33 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, LIN, SPI(2), UART

Peripherals:

BOD, TIMER(2), WDT

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

MSP430G2444IYFFR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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