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MSP430G2444IDA38

Texas Instruments

MSP430G2444IDA38 by Texas Instruments

MSP430G2444IDA38 by Texas Instruments is a 16-bit microcontroller with 32 I/O lines, 12-Ch 10-Bit ADC channels, and 2 timers. It operates at a max clock frequency of 16 MHz and has low power mode. Ideal for industrial applications requiring high-speed processing and connectivity via USCI interface.

Median Price

$4.230

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,110 parts In-Stock

1+ parts

$3.141

100+ parts

$2.752

1k+ parts

$1.555

10k+ parts

-

4,110

$3.141

$2.752

$1.555

-

Mouser Electronics

USA . 1 parts In-Stock

1+ parts

$5.320

100+ parts

$2.980

1k+ parts

$2.430

10k+ parts

-

1

$5.320

$2.980

$2.430

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,457 parts In-Stock

1+ parts

$2.984

100+ parts

-

1k+ parts

-

10k+ parts

-

3,457

$2.984

-

-

-

Vyrian

USA . 2,306 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,306

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,089 parts In-Stock

1+ parts

$2.827

100+ parts

-

1k+ parts

-

10k+ parts

-

4,089

$2.827

-

-

-

Parana Technologies

USA . 876 parts In-Stock

1+ parts

$14.860

100+ parts

-

1k+ parts

$15.293

10k+ parts

-

876

$14.860

-

$15.293

-

ChromeModa Solutions

Germany . 5,000 parts In-Stock

1+ parts

$16.697

100+ parts

$13.692

1k+ parts

-

10k+ parts

-

5,000

$16.697

$13.692

-

-

IDEA Electronic Components Group

UK . 1,701 parts In-Stock

1+ parts

$16.697

100+ parts

$15.862

1k+ parts

$15.027

10k+ parts

-

1,701

$16.697

$15.862

$15.027

-

Microchip USA

USA . 2,983 parts In-Stock

1+ parts

$27.040

100+ parts

$26.870

1k+ parts

$26.790

10k+ parts

$26.710

2,983

$27.040

$26.870

$26.790

$26.710

DigiPath Technology Company

USA . 878 parts In-Stock

1+ parts

-

100+ parts

$15.054

1k+ parts

-

10k+ parts

-

878

-

$15.054

-

-

Overview

Unlock the potential of your electronic projects with the MSP430G2444IDA38 from Texas Instruments. This cutting-edge microcontroller boasts high-quality manufacturing and a wide range of applications in various industries. With its low power consumption, advanced peripherals, and flexible connectivity options, this product offers unmatched value to customers looking to streamline their designs and improve efficiency. Trust in Texas Instruments for top-notch performance and reliability in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and resistant to external elements, ensuring the longevity of the microcontroller.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during the manufacturing process.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6V makes the microcontroller versatile and compatible with different power sources.

On Chip Data RAM Width: 8

Having an on-chip data RAM width of 8 enables efficient data processing and storage capabilities for the microcontroller.

Package Shape: RECTANGULAR

Rectangular package shape makes it easy to integrate the microcontroller into various electronic devices and PCB layouts.

Bit Size: 16

With a 16-bit architecture, the microcontroller can handle complex calculations and data operations effectively, suitable for a wide range of applications.

Power Supplies (V): 2/3.3

Support for multiple power supply options (2V and 3.3V) provides flexibility in power management and compatibility with different power sources.

No. of Terminals: 38

Having 38 terminals allows for connectivity to various external components and peripherals, enhancing the functionality of the microcontroller.

Minimum Supply Voltage: 1.8 V

The ability to operate at a minimum supply voltage of 1.8V ensures efficient power consumption and extended battery life in low-power applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C makes the microcontroller suitable for industrial environments with varying temperature conditions.

Technical Specifications

Microcontrollers MSP430G2444IDA38 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

12.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

32

No. of Serial I/Os:

1

No. of Terminals:

38

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

512

RAM Words:

0.5

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

USCI

Peripherals:

BOD, POR, TIMER(2)

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

MSP430G2444IDA38 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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