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MSP430G2433IPW28

Texas Instruments

MSP430G2433IPW28 by Texas Instruments

MSP430G2433IPW28 by Texas Instruments is a 16-bit microcontroller with 8KB ROM and 512B RAM. It operates at up to 0.032 MHz, has 8 ADC channels, and features low power mode. Ideal for industrial applications requiring high-speed processing and multiple peripherals like timers, UART, and SPI.

Median Price

$2.374

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 12,000 parts In-Stock

1+ parts

$2.374

100+ parts

$1.961

1k+ parts

$1.060

10k+ parts

-

12,000

$2.374

$1.961

$1.060

-

Mouser Electronics

USA . 133 parts In-Stock

1+ parts

$3.770

100+ parts

$2.320

1k+ parts

$1.670

10k+ parts

$1.630

133

$3.770

$2.320

$1.670

$1.630

Arrow

USA . 750 parts In-Stock

1+ parts

-

100+ parts

$1.438

1k+ parts

$1.415

10k+ parts

-

750

-

$1.438

$1.415

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,702 parts In-Stock

1+ parts

$2.255

100+ parts

-

1k+ parts

-

10k+ parts

-

2,702

$2.255

-

-

-

Chip Stock

USA . 23,620 parts In-Stock

1+ parts

-

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23,620

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-

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Vyrian

USA . 4,112 parts In-Stock

1+ parts

-

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4,112

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,024 parts In-Stock

1+ parts

$2.137

100+ parts

-

1k+ parts

-

10k+ parts

-

2,024

$2.137

-

-

-

Parana Technologies

USA . 41 parts In-Stock

1+ parts

$37.243

100+ parts

-

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-

10k+ parts

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41

$37.243

-

-

-

ChromeModa Solutions

Germany . 5,671 parts In-Stock

1+ parts

$41.846

100+ parts

$34.314

1k+ parts

-

10k+ parts

-

5,671

$41.846

$34.314

-

-

IDEA Electronic Components Group

UK . 260 parts In-Stock

1+ parts

$41.846

100+ parts

$39.754

1k+ parts

$37.661

10k+ parts

-

260

$41.846

$39.754

$37.661

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iodParts Technologies Inc.

India . 15,000 parts In-Stock

1+ parts

-

100+ parts

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15,000

-

-

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Epart123

USA . 12,000 parts In-Stock

1+ parts

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100+ parts

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12,000

-

-

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Lixinc

USA . 7,938 parts In-Stock

1+ parts

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7,938

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Perfect Parts

USA . 1,382 parts In-Stock

1+ parts

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1,382

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Futuretech Components

Singapore . 824 parts In-Stock

1+ parts

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824

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DigiPath Technology Company

USA . 183 parts In-Stock

1+ parts

-

100+ parts

$37.728

1k+ parts

-

10k+ parts

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183

-

$37.728

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-

Overview

Unleash the power of innovation with the Texas Instruments MSP430G2433IPW28 microcontroller. Designed with precision and reliability in mind, this cutting-edge device offers a wide range of applications in various industries. With its advanced features and high performance capabilities, customers can expect seamless operation and enhanced efficiency. Trust in Texas Instruments for quality products that deliver unparalleled value and benefits to meet all your technological needs. Experience the difference with the MSP430G2433IPW28 and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material : PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, providing good protection for the microcontroller.

Maximum Supply Voltage : 3.6 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of systems.

Package Shape : RECTANGULAR

The rectangular package shape is commonly used and makes it easy to integrate the microcontroller into various electronic devices.

CPU Family : MSP430

The MSP430 CPU family is known for its low power consumption and high performance, making this microcontroller a reliable choice for energy-efficient applications.

Analog To Digital Convertors : 8-Ch 10-Bit

Having multiple analog to digital converters with 10-bit resolution allows for accurate and efficient conversion of analog signals into digital data.

Connectivity : I2C, IRDA, SPI(2), UART, USCI(2)

The microcontroller's multiple connectivity options make it versatile and compatible with various communication protocols, enabling seamless integration into different systems.

Speed : 16 rpm

The 16 rpm speed capability ensures efficient processing and execution of tasks, making the microcontroller suitable for applications requiring high-speed operation.

Low Power Mode : YES

The low power mode feature enables power-saving operation, prolonging battery life and making the microcontroller suitable for portable and battery-powered devices.

Technical Specifications

Microcontrollers MSP430G2433IPW28 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

1

No. of I/O Lines:

24

No. of Serial I/Os:

2

No. of Terminals:

28

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

512

RAM Words:

0.5

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.42 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SPI(2), UART, USCI(2)"

Peripherals:

"BOD, DMA(1), TIMER(6), WDT"

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430G2433IPW28 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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