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MSP430G2432IPW20

Texas Instruments

MSP430G2432IPW20 by Texas Instruments

MSP430G2432IPW20 by Texas Instruments is a 16-bit microcontroller with 8KB ROM, 256B RAM, and 8 ADC channels. Ideal for industrial applications, it operates b/w -40 to 85°C with low power mode support. Features include 4 timers, I2C/SPI/USI connectivity, and boundary scan capability.

Median Price

$1.619

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 5 parts In-Stock

1+ parts

$1.420

100+ parts

$1.010

1k+ parts

$0.730

10k+ parts

$0.654

5

$1.420

$1.010

$0.730

$0.654

Texas Instruments

USA . 75,228 parts In-Stock

1+ parts

$2.054

100+ parts

$1.696

1k+ parts

$0.917

10k+ parts

-

75,228

$2.054

$1.696

$0.917

-

Mouser Electronics

USA . 323 parts In-Stock

1+ parts

$3.000

100+ parts

$1.810

1k+ parts

-

10k+ parts

$1.680

323

$3.000

$1.810

-

$1.680

Rochester

USA . 556 parts In-Stock

1+ parts

-

100+ parts

$1.330

1k+ parts

$1.190

10k+ parts

$1.120

556

-

$1.330

$1.190

$1.120

DigiKey

USA . 556 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.750

10k+ parts

-

556

-

-

$1.750

-

Verical

USA . 280 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.488

10k+ parts

$1.400

280

-

-

$1.488

$1.400

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,782 parts In-Stock

1+ parts

$1.206

100+ parts

-

1k+ parts

-

10k+ parts

-

1,782

$1.206

-

-

-

Vyrian

USA . 4,616 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,616

-

-

-

-

DigiKey Marketplace

USA . 556 parts In-Stock

1+ parts

-

100+ parts

$1.320

1k+ parts

-

10k+ parts

-

556

-

$1.320

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,510 parts In-Stock

1+ parts

$1.143

100+ parts

-

1k+ parts

-

10k+ parts

-

1,510

$1.143

-

-

-

Parana Technologies

USA . 2,088 parts In-Stock

1+ parts

$76.410

100+ parts

-

1k+ parts

-

10k+ parts

-

2,088

$76.410

-

-

-

DigiPath Technology Company

USA . 1,891 parts In-Stock

1+ parts

$84.137

100+ parts

$77.406

1k+ parts

-

10k+ parts

-

1,891

$84.137

$77.406

-

-

ChromeModa Solutions

Germany . 1,202 parts In-Stock

1+ parts

$85.854

100+ parts

$70.400

1k+ parts

-

10k+ parts

-

1,202

$85.854

$70.400

-

-

IDEA Electronic Components Group

UK . 490 parts In-Stock

1+ parts

$85.854

100+ parts

$81.561

1k+ parts

$77.269

10k+ parts

-

490

$85.854

$81.561

$77.269

-

Overview

Unleash the power of innovation with the Texas Instruments MSP430G2432IPW20 microcontroller. Built with precision and reliability, this small outline package offers a wide range of applications in various industries. From industrial automation to consumer electronics, this versatile device delivers high performance at a low cost, making it a valuable asset for any project. With advanced features like boundary scan and peripherals including DMA and timers, this microcontroller ensures seamless integration and optimal functionality. Elevate your design with the MSP430G2432IPW20 and experience the difference in quality and efficiency that Texas Instruments is renowned for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is cost-effective and durable, making the product suitable for various applications.

Maximum Supply Voltage: 3.6 V

Ability to handle high supply voltage ensures reliability and stability in operation.

Minimum Operating Temperature: -40 °C

Wide temperature range capability allows the product to be used in harsh environments.

ADC Channels: YES

Built-in ADC channels provide analog-to-digital conversion capabilities, increasing flexibility for sensor interfacing.

Peripherals: BOD, DMA(1), TIMER(4), WDT

Multiple peripherals offer additional functionality and control options for various applications.

Low Power Mode: YES

Low power mode enhances energy efficiency, extending battery life and reducing overall power consumption.

Technical Specifications

Microcontrollers MSP430G2432IPW20 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES 1.8 V MINIMUM SUPPLY AT 6 MHZ AND 2.7 V MINIMUM SUPPLY AT 12 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

1

No. of I/O Lines:

16

No. of Serial I/Os:

0

No. of Terminals:

20

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.4 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, SPI, USI"

Peripherals:

"BOD, DMA(1), TIMER(4), WDT"

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430G2432IPW20 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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