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MSP430G2413IPW28

Texas Instruments

MSP430G2413IPW28 by Texas Instruments

MSP430G2413IPW28 by Texas Instruments is a 16-bit microcontroller with 8192 ROM words and 512 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption. With peripherals like BOD, DMA, and timers, it offers connectivity options such as I2C, SPI, and UART for versatile system integration.

Median Price

$1.619

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,950 parts In-Stock

1+ parts

$2.065

100+ parts

$1.706

1k+ parts

$0.922

10k+ parts

-

2,950

$2.065

$1.706

$0.922

-

Rochester

USA . 350 parts In-Stock

1+ parts

-

100+ parts

$1.330

1k+ parts

$1.190

10k+ parts

$1.120

350

-

$1.330

$1.190

$1.120

DigiKey

USA . 350 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.750

10k+ parts

-

350

-

-

$1.750

-

Verical

USA . 350 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.488

10k+ parts

$1.400

350

-

-

$1.488

$1.400

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,652 parts In-Stock

1+ parts

$1.216

100+ parts

-

1k+ parts

-

10k+ parts

-

2,652

$1.216

-

-

-

Vyrian

USA . 5,716 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,716

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 353 parts In-Stock

1+ parts

$1.152

100+ parts

-

1k+ parts

-

10k+ parts

-

353

$1.152

-

-

-

Microchip USA

USA . 1,392 parts In-Stock

1+ parts

$8.645

100+ parts

-

1k+ parts

-

10k+ parts

-

1,392

$8.645

-

-

-

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$53.702

100+ parts

$48.869

1k+ parts

$44.036

10k+ parts

-

1,000

$53.702

$48.869

$44.036

-

Parana Technologies

USA . 918 parts In-Stock

1+ parts

$65.696

100+ parts

-

1k+ parts

-

10k+ parts

-

918

$65.696

-

-

-

DigiPath Technology Company

USA . 1,384 parts In-Stock

1+ parts

$72.340

100+ parts

-

1k+ parts

-

10k+ parts

-

1,384

$72.340

-

-

-

ChromeModa Solutions

Germany . 4,661 parts In-Stock

1+ parts

$73.816

100+ parts

$60.529

1k+ parts

-

10k+ parts

-

4,661

$73.816

$60.529

-

-

IDEA Electronic Components Group

UK . 616 parts In-Stock

1+ parts

$73.816

100+ parts

$70.125

1k+ parts

$66.434

10k+ parts

-

616

$73.816

$70.125

$66.434

-

Overview

Unlock the possibilities with the Texas Instruments MSP430G2413IPW28 microcontroller. Designed for industrial applications, this advanced technology offers a wide range of features including low power mode, multiple connectivity options, and on-chip peripherals like timers and DMA channels. With a maximum clock frequency of 16 MHz and flash ROM programmability, this compact device is perfect for projects that require high-speed performance and reliability. Trust in Texas Instruments' reputation for quality and innovation, and bring your designs to life with the MSP430G2413IPW28.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy mounting onto circuit boards, saving space and enabling compact designs.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage inputs, providing flexibility in power supply options.

On Chip Data RAM Width: 8

Offers sufficient memory for data storage and processing, enhancing performance.

Package Shape: RECTANGULAR

Facilitates easy integration into various electronic devices and systems.

Bit Size: 16

Allows for efficient processing and calculation of data, suitable for a wide range of applications.

Power Supplies (V): 2/3.3

Provides versatility in power input options, accommodating different voltage requirements.

No. of Terminals: 28

Offers ample connectivity options for interfacing with external devices.

Minimum Supply Voltage: 3.3 V

Supports lower voltage operations while maintaining stable performance.

Maximum Operating Temperature: 85 °C

Can operate effectively in high-temperature environments, suitable for industrial applications.

CPU Family: MSP430

Belongs to a renowned and reliable CPU family, ensuring dependable performance.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme low-temperature conditions, expanding its range of use.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides excellent conductivity and corrosion resistance for reliable terminal connections.

DMA Channels: YES

Supports Direct Memory Access for efficient data transfer and processing, enhancing performance.

Terminal Position: DUAL

Allows for improved signal integrity and connectivity for robust operation.

ROM Words: 8192

Ample read-only memory for storing program instructions and data.

Maximum Seated Height: 1.2 mm

Low profile design for compact and slim electronic devices.

RAM Words: 0.5

Provides sufficient random access memory for temporary storage and data manipulation.

Width: 4.4 mm

Compact size for versatile integration in a wide range of applications.

Boundary Scan: YES

Supports Boundary Scan testing for easier debugging and verification of connections.

Peripherals: 'BOD, COMPARATOR(8), DMA(1), TIMER(2), WDT'

Comes with a variety of peripheral features for enhanced functionality and usability.

Maximum Clock Frequency: 16 MHz

Offers high-speed processing capabilities suitable for demanding applications.

Peak Reflow Temperature °C: 260

Can withstand high-temperature reflow processes during manufacturing for reliable soldering.

Length: 9.7 mm

Compact form factor for space-constrained designs without compromising performance.

Temperature Grade: INDUSTRIAL

Designed to meet the rigor of industrial operating conditions for reliable performance.

Peripheral IC Type: MICROCONTROLLER, RISC

Employs Reduced Instruction Set Computing architecture for efficient processing and performance.

No. of Timers: 2

Includes multiple timer modules for time-based operations and control.

RAM Bytes: 512

Provides ample random access memory for data storage and manipulation.

Technology: CMOS

Utilizes Complementary Metal-Oxide-Semiconductor technology for low power consumption and high reliability.

Terminal Form: GULL WING

Gull-wing terminal configuration for secure and reliable soldering onto PCBs.

Maximum Supply Current: 0.42 mA

Operates at low power consumption levels for energy-efficient applications.

PWM Channels: YES

Supports Pulse-Width Modulation output for precise control of analog signals.

Connectivity: 'I2C, IRDA, LIN, SPI, UART, USCI(2)'

Offers a range of communication interfaces for seamless connectivity with other devices.

ROM Programmability: FLASH

Flash memory for easy reprogramming and updating of firmware in the field.

Terminal Pitch: 0.65 mm

Fine pitch terminals for compact design and precise soldering.

Format: FIXED POINT

Fixed-point arithmetic for efficient mathematical calculations and digital signal processing.

Speed: 16 rpm

Capable of processing data at a speed of 16 rotations per minute, suitable for real-time applications.

Low Power Mode: YES

Supports low power modes for energy-efficient operation and extended battery life.

On Chip Program ROM Width: 8

Provides built-in program memory for storing firmware and program instructions.

No. of I/O Lines: 24

Sufficient input/output lines for interfacing with external peripherals and sensors.

Technical Specifications

Microcontrollers MSP430G2413IPW28 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES AT 1.8V AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

1

No. of I/O Lines:

24

No. of Serial I/Os:

1

No. of Terminals:

28

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

512

RAM Words:

0.5

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.42 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI, UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR(8), DMA(1), TIMER(2), WDT"

Trade Compliance

MSP430G2413IPW28 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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