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MSP430G2412IPW14R

Texas Instruments

MSP430G2412IPW14R by Texas Instruments

MSP430G2412IPW14R by Texas Instruments is a 16-bit microcontroller with 8192 ROM words and 256 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption. Features include 4 timers, I2C/SPI/USI connectivity, and peripherals like BOD and comparator.

Median Price

$1.586

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 11,180 parts In-Stock

1+ parts

$1.586

100+ parts

$1.310

1k+ parts

$0.708

10k+ parts

-

11,180

$1.586

$1.310

$0.708

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,941 parts In-Stock

1+ parts

$1.507

100+ parts

-

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-

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4,941

$1.507

-

-

-

Semtec, LLC

USA . 18,616 parts In-Stock

1+ parts

-

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-

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-

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18,616

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Vyrian

USA . 4,632 parts In-Stock

1+ parts

-

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4,632

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-

-

-

LIBRA Elektronik GmbH

Germany . 479 parts In-Stock

1+ parts

-

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-

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479

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,576 parts In-Stock

1+ parts

$1.427

100+ parts

-

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-

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4,576

$1.427

-

-

-

AZTECH Wire

Italy . 856 parts In-Stock

1+ parts

$20.890

100+ parts

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856

$20.890

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Parana Technologies

USA . 1,125 parts In-Stock

1+ parts

$44.668

100+ parts

-

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1,125

$44.668

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DigiPath Technology Company

USA . 1,759 parts In-Stock

1+ parts

$49.185

100+ parts

$45.250

1k+ parts

-

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1,759

$49.185

$45.250

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IDEA Electronic Components Group

UK . 1,180 parts In-Stock

1+ parts

$50.189

100+ parts

$47.680

1k+ parts

$45.170

10k+ parts

-

1,180

$50.189

$47.680

$45.170

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ChromeModa Solutions

Germany . 1,101 parts In-Stock

1+ parts

$50.189

100+ parts

$41.155

1k+ parts

-

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1,101

$50.189

$41.155

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QUARKTWIN TECHNOLOGY LTD

USA . 23,118 parts In-Stock

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23,118

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Microchip USA

USA . 3,613 parts In-Stock

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3,613

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Overview

Discover the cutting-edge technology of the Texas Instruments MSP430G2412IPW14R microcontroller, revolutionizing the industry with its top-notch quality and reliability. Designed for a wide range of applications, this powerful device offers unmatched value and benefits to customers seeking high performance and efficiency in their projects. With features such as low power mode, connectivity options, and peripherals like BOD and timers, this microcontroller is a must-have for any project requiring precision and speed. Trust in Texas Instruments to deliver excellence with the MSP430G2412IPW14R.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easy and compact integration of the microcontroller onto PCBs, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power input, increasing its versatility in different applications.

On Chip Data RAM Width: 8

Having a data RAM width of 8 allows for efficient data handling and processing within the microcontroller.

Bit Size: 16

The 16-bit size provides enhanced data processing capabilities and precision, making this microcontroller suitable for tasks that require higher computational accuracy.

Power Supplies (V): 2/3.3

The availability of multiple power supply options allows for flexibility in powering the microcontroller, depending on the specific requirements of the application.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This compact package style saves space on the PCB, making the microcontroller ideal for applications where board real estate is limited.

Minimum Supply Voltage: 2.2 V

The low minimum supply voltage ensures that the microcontroller can operate efficiently even in low power scenarios, prolonging battery life in portable devices.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to interface with analog sensors and signals, enabling a wider range of applications that require analog inputs.

Technical Specifications

Microcontrollers MSP430G2412IPW14R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 6MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of I/O Lines:

16

No. of Serial I/Os:

0

No. of Terminals:

14

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.4 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, SPI, USI"

Peripherals:

"BOD, COMPARATOR(8), TIMER(4), WDT"

Trade Compliance

MSP430G2412IPW14R Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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