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MSP430G2402IPW14

Texas Instruments

MSP430G2402IPW14 by Texas Instruments

MSP430G2402IPW14 by Texas Instruments is a 16-bit microcontroller with 8192 ROM words and 256 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring low power consumption and connectivity via I2C, SPI, and USI interfaces.

Median Price

$2.748

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 70,920 parts In-Stock

1+ parts

$1.935

100+ parts

$1.598

1k+ parts

$0.864

10k+ parts

-

70,920

$1.935

$1.598

$0.864

-

Mouser Electronics

USA . 345 parts In-Stock

1+ parts

$3.560

100+ parts

$2.100

1k+ parts

$1.650

10k+ parts

$1.540

345

$3.560

$2.100

$1.650

$1.540

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,491 parts In-Stock

1+ parts

$1.838

100+ parts

-

1k+ parts

-

10k+ parts

-

4,491

$1.838

-

-

-

Vyrian

USA . 9,855 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,855

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,820 parts In-Stock

1+ parts

$1.742

100+ parts

-

1k+ parts

-

10k+ parts

-

3,820

$1.742

-

-

-

Parana Technologies

USA . 882 parts In-Stock

1+ parts

$60.444

100+ parts

-

1k+ parts

-

10k+ parts

-

882

$60.444

-

-

-

DigiPath Technology Company

USA . 1,795 parts In-Stock

1+ parts

$66.557

100+ parts

$61.232

1k+ parts

-

10k+ parts

-

1,795

$66.557

$61.232

-

-

ChromeModa Solutions

Germany . 2,377 parts In-Stock

1+ parts

$67.915

100+ parts

$55.690

1k+ parts

-

10k+ parts

-

2,377

$67.915

$55.690

-

-

IDEA Electronic Components Group

UK . 1,095 parts In-Stock

1+ parts

$67.915

100+ parts

$64.519

1k+ parts

$61.124

10k+ parts

-

1,095

$67.915

$64.519

$61.124

-

Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,000

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Overview

Unlock the power of innovation with the Texas Instruments MSP430G2402IPW14 microcontroller. Built with precision and expertise, Texas Instruments leads the industry in quality and reliability. This versatile microcontroller is perfect for a wide range of applications, offering customers unmatched value and performance. Experience seamless connectivity and efficient operation with features like PWM channels, DMA support, and low-power modes. Elevate your projects and bring your ideas to life with the MSP430G2402IPW14 from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good durability and protection for the microcontroller, making it suitable for various environmental conditions.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this microcontroller can withstand heat stress and operate reliably in demanding applications.

ROM Programmability: FLASH

The Flash ROM programmability allows for easy updating and reprogramming of the microcontroller, enhancing flexibility and versatility in design.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers efficient and high-speed processing, making it ideal for applications requiring quick data processing and response.

Connectivity: I2C, SPI, USI

Multiple connectivity options such as I2C, SPI, and USI enable seamless integration with other devices and peripherals, expanding the functionality of the microcontroller.

Low Power Mode: YES

The low power mode feature helps in conserving energy and extending battery life, making the microcontroller suitable for battery-powered applications or devices requiring energy efficiency.

Technical Specifications

Microcontrollers MSP430G2402IPW14 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES 1.8 V MINIMUM SUPPLY AT 6 MHZ AND 2.7 V MINIMUM SUPPLY AT 12 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

1

No. of I/O Lines:

10

No. of Serial I/Os:

0

No. of Terminals:

14

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.4 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, SPI, USI"

Peripherals:

"BOD, DMA(1), TIMER(4), WDT"

Trade Compliance

MSP430G2402IPW14 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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