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MSP430G2353IRHB32R

Texas Instruments

MSP430G2353IRHB32R by Texas Instruments

MSP430G2353IRHB32R by Texas Instruments is a 16-bit microcontroller with 8KB Flash ROM, 256B RAM, and 8 ADC channels. It operates at up to 16MHz with low power mode support. Ideal for industrial applications requiring high-speed processing and multiple peripherals like UART, SPI, and I2C.

Median Price

$1.378

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 692,490 parts In-Stock

1+ parts

$1.378

100+ parts

$1.138

1k+ parts

$0.615

10k+ parts

-

692,490

$1.378

$1.138

$0.615

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 792 parts In-Stock

1+ parts

$1.309

100+ parts

-

1k+ parts

-

10k+ parts

-

792

$1.309

-

-

-

Vyrian

USA . 4,518 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,518

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,759 parts In-Stock

1+ parts

$1.240

100+ parts

-

1k+ parts

-

10k+ parts

-

3,759

$1.240

-

-

-

Microchip USA

USA . 1,364 parts In-Stock

1+ parts

$5.451

100+ parts

-

1k+ parts

-

10k+ parts

-

1,364

$5.451

-

-

-

AZTECH Wire

Italy . 921 parts In-Stock

1+ parts

$13.710

100+ parts

-

1k+ parts

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921

$13.710

-

-

-

Parana Technologies

USA . 770 parts In-Stock

1+ parts

$59.285

100+ parts

-

1k+ parts

-

10k+ parts

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770

$59.285

-

-

-

DigiPath Technology Company

USA . 2,255 parts In-Stock

1+ parts

$65.280

100+ parts

$60.057

1k+ parts

-

10k+ parts

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2,255

$65.280

$60.057

-

-

IDEA Electronic Components Group

UK . 1,969 parts In-Stock

1+ parts

$66.612

100+ parts

$63.281

1k+ parts

$59.951

10k+ parts

-

1,969

$66.612

$63.281

$59.951

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ChromeModa Solutions

Germany . 1,456 parts In-Stock

1+ parts

$66.612

100+ parts

$54.622

1k+ parts

-

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1,456

$66.612

$54.622

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A-Z Elektronik GmbH

Germany . 9,461 parts In-Stock

1+ parts

-

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9,461

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ChipstoGo Electronic ltd

UK . 9,130 parts In-Stock

1+ parts

-

100+ parts

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9,130

-

-

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Kepictronics

USA . 6,307 parts In-Stock

1+ parts

-

100+ parts

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6,307

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Overview

Unlock endless possibilities with the MSP430G2353IRHB32R by Texas Instruments, a top-tier microcontroller designed to revolutionize your projects. Crafted with precision and expertise, Texas Instruments delivers unmatched quality and reliability in every product. Ideal for a wide range of applications, this microcontroller offers customers unparalleled value, benefits, and advantages. Experience seamless connectivity, low power consumption, and high-performance features that will elevate your projects to new heights. Embrace innovation with the MSP430G2353IRHB32R and watch your ideas come to life like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in microcontrollers for its durability and resistance to moisture and temperature fluctuations.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options while maintaining a safe operating range for the microcontroller.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC (Reduced Instruction Set Computing) microcontroller, it offers high performance with simplified instructions, making it efficient for various applications.

On Chip Program ROM Width: 8

Having a wider ROM width enables the microcontroller to store more program instructions, increasing its capability to handle complex tasks.

Connectivity: I2C, IRDA, LIN, SPI, UART, USCI(2)

With multiple connectivity options, this microcontroller can easily interface with other devices, making it versatile for different projects.

Technical Specifications

Microcontrollers MSP430G2353IRHB32R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

1

No. of I/O Lines:

24

No. of Serial I/Os:

1

No. of Terminals:

32

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.42 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI, UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR(8), DMA(1), TIMER(2), WDT"

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430G2353IRHB32R Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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