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MSP430G2333IPW28

Texas Instruments

MSP430G2333IPW28 by Texas Instruments

MSP430G2333IPW28 by Texas Instruments is a 16-bit microcontroller with 8KB Flash ROM and 256B RAM. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring low power consumption. Featuring 8 ADC channels and connectivity options like I2C and UART, it's ideal for embedded systems design.

Median Price

$1.772

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 11,510 parts In-Stock

1+ parts

$1.772

100+ parts

$1.463

1k+ parts

$0.791

10k+ parts

-

11,510

$1.772

$1.463

$0.791

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,835 parts In-Stock

1+ parts

$1.683

100+ parts

-

1k+ parts

-

10k+ parts

-

1,835

$1.683

-

-

-

Chip Stock

USA . 45,699 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

45,699

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Vyrian

USA . 2,017 parts In-Stock

1+ parts

-

100+ parts

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2,017

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,367 parts In-Stock

1+ parts

$1.595

100+ parts

-

1k+ parts

-

10k+ parts

-

1,367

$1.595

-

-

-

AZTECH Wire

Italy . 817 parts In-Stock

1+ parts

$11.950

100+ parts

-

1k+ parts

-

10k+ parts

-

817

$11.950

-

-

-

Microchip USA

USA . 1,515 parts In-Stock

1+ parts

$15.340

100+ parts

$15.250

1k+ parts

$15.200

10k+ parts

$15.150

1,515

$15.340

$15.250

$15.200

$15.150

Parana Technologies

USA . 2,352 parts In-Stock

1+ parts

$37.424

100+ parts

-

1k+ parts

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10k+ parts

-

2,352

$37.424

-

-

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ChromeModa Solutions

Germany . 4,008 parts In-Stock

1+ parts

$42.050

100+ parts

$34.481

1k+ parts

-

10k+ parts

-

4,008

$42.050

$34.481

-

-

IDEA Electronic Components Group

UK . 1,109 parts In-Stock

1+ parts

$42.050

100+ parts

$39.948

1k+ parts

$37.845

10k+ parts

-

1,109

$42.050

$39.948

$37.845

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Component Stockers USA

USA . 15,650 parts In-Stock

1+ parts

-

100+ parts

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15,650

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iodParts Technologies Inc.

India . 2,000 parts In-Stock

1+ parts

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100+ parts

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2,000

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Perfect Parts

USA . 616 parts In-Stock

1+ parts

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616

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DigiPath Technology Company

USA . 379 parts In-Stock

1+ parts

-

100+ parts

$37.912

1k+ parts

-

10k+ parts

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379

-

$37.912

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Overview

Unlock endless possibilities with the Texas Instruments MSP430G2333IPW28 microcontroller. Built by a trusted manufacturer, this cutting-edge device offers unparalleled quality and reliability. Ideal for a wide range of applications, this microcontroller provides value in its versatility and efficiency. Experience seamless connectivity and optimal performance with the MSP430G2333IPW28, your gateway to innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material offers good durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Surface mount capability makes for easier and more efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6V allows for flexibility in power input options for the microcontroller.

On Chip Data RAM Width: 8

Having a wide on-chip data RAM width of 8 bits enables faster data processing and storage capabilities.

Package Shape: RECTANGULAR

Rectangular package shape offers efficient use of space on the PCB and facilitates easy integration into the overall design.

Bit Size: 16

16-bit architecture provides enhanced processing power and performance for the microcontroller, suitable for complex algorithms and computations.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages (2V and 3.3V) allows for compatibility with different power sources and flexibility in design.

No. of Terminals: 28

Having 28 terminals offers ample connectivity options for interfacing with various external components and peripherals in the system.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style saves space on the PCB, making it ideal for compact and slim designs.

Minimum Supply Voltage: 1.8 V

Support for a minimum supply voltage of 1.8V allows for operation in low-power scenarios, extending the battery life of the device.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C ensures reliable performance in harsh environmental conditions without compromising functionality.

Technical Specifications

Microcontrollers MSP430G2333IPW28 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

1

No. of I/O Lines:

24

No. of Serial I/Os:

2

No. of Terminals:

28

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.42 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SPI(2), UART, USCI(2)"

Peripherals:

"BOD, DMA(1), TIMER(6), WDT"

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430G2333IPW28 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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