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MSP430G2333IN20

Texas Instruments

MSP430G2333IN20 by Texas Instruments

MSP430G2333IN20 by Texas Instruments is a 16-bit microcontroller with 4096 ROM words and 256 RAM bytes. It features 8 ADC channels, 2/3.3 V power supplies, and operates in industrial temperature range (-40 to 85 °C). Ideal for low-power applications, it offers peripherals like BOD, DMA(1), TIMER(6), WDT and connectivity options such as I2C, IRDA, SPI(2), UART, USCI(2).

Median Price

$1.994

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,510 parts In-Stock

1+ parts

$1.579

100+ parts

$1.304

1k+ parts

$0.705

10k+ parts

-

5,510

$1.579

$1.304

$0.705

-

DigiKey

USA . 326 parts In-Stock

1+ parts

$2.410

100+ parts

$1.461

1k+ parts

$1.376

10k+ parts

-

326

$2.410

$1.461

$1.376

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,778 parts In-Stock

1+ parts

$1.500

100+ parts

-

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-

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2,778

$1.500

-

-

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Vyrian

USA . 6,085 parts In-Stock

1+ parts

-

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-

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6,085

-

-

-

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Bristol Electronics

USA . 418 parts In-Stock

1+ parts

-

100+ parts

$1.008

1k+ parts

$0.941

10k+ parts

-

418

-

$1.008

$0.941

-

Dan-Mar Components

USA . 418 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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418

-

-

-

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ACDS - Activité Composants Distribution Service

France . 160 parts In-Stock

1+ parts

-

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-

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160

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,924 parts In-Stock

1+ parts

$1.421

100+ parts

-

1k+ parts

-

10k+ parts

-

1,924

$1.421

-

-

-

Parana Technologies

USA . 331 parts In-Stock

1+ parts

$13.662

100+ parts

-

1k+ parts

$14.163

10k+ parts

-

331

$13.662

-

$14.163

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DigiPath Technology Company

USA . 1,465 parts In-Stock

1+ parts

$15.044

100+ parts

-

1k+ parts

-

10k+ parts

-

1,465

$15.044

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-

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ChromeModa Solutions

Germany . 4,083 parts In-Stock

1+ parts

$15.351

100+ parts

$12.588

1k+ parts

-

10k+ parts

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4,083

$15.351

$12.588

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-

IDEA Electronic Components Group

UK . 409 parts In-Stock

1+ parts

$15.351

100+ parts

$14.583

1k+ parts

$13.816

10k+ parts

-

409

$15.351

$14.583

$13.816

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Microchip USA

USA . 2,573 parts In-Stock

1+ parts

$16.120

100+ parts

$16.020

1k+ parts

$15.970

10k+ parts

$15.920

2,573

$16.120

$16.020

$15.970

$15.920

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$56.703

100+ parts

$51.600

1k+ parts

$46.496

10k+ parts

-

500

$56.703

$51.600

$46.496

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Perfect Parts

USA . 301 parts In-Stock

1+ parts

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301

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Overview

Unlock the power of innovation with the Texas Instruments MSP430G2333IN20 microcontroller. Designed with precision and reliability in mind, Texas Instruments sets the standard for quality in the industry. This versatile microcontroller is perfect for a wide range of applications, offering customers exceptional value and performance. With features such as low power mode, high-speed connectivity options, and a wide range of peripherals, the MSP430G2333IN20 is the ideal choice for your next project. Experience the difference that Texas Instruments can make in your designs today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for easy handling and protection of the microcontroller.

Maximum Supply Voltage: 3.6 V

Allows for a higher input voltage range, providing flexibility in power supply options.

On Chip Data RAM Width: 8

Sufficient data RAM width for storing and processing data efficiently.

Package Shape: RECTANGULAR

Common and convenient shape for easy integration into electronic designs.

Bit Size: 16

Higher bit size allows for more complex operations and calculations.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages for versatile applications.

No. of Terminals: 20

Sufficient number of terminals for connecting external components and peripherals.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage ensures efficient power usage and compatibility with various power sources.

ADC Channels: YES

Built-in Analog to Digital Converters for accurate and reliable analog signal processing.

DMA Channels: YES

Direct Memory Access channels for efficient data transfer and processing.

ROM Words: 4096

Sufficient Read-Only Memory capacity for storing program instructions and data.

RAM Words: 0.25

Adequate Random Access Memory for temporary storage of data during operation.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient and fast processing of instructions.

No. of Timers: 6

Multiple timer channels for precise timing control and event scheduling.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Analog To Digital Convertors: 8-Ch 10-Bit

Multiple ADC channels with 10-bit resolution for accurate analog signal conversion.

PWM Channels: YES

Pulse Width Modulation channels for precise control of analog outputs.

Connectivity: I2C, IRDA, SPI(2), UART, USCI(2)

Multiple communication interfaces for seamless connectivity with other devices and peripherals.

ROM Programmability: FLASH

Flash programmable ROM for easy firmware updates and flexibility in programming.

Low Power Mode: YES

Ability to operate in low power mode for energy-efficient applications.

Technical Specifications

Microcontrollers MSP430G2333IN20 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e4

Length:

24.33 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

1

No. of I/O Lines:

16

No. of Serial I/Os:

2

No. of Terminals:

20

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

4.57 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.42 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.35 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SPI(2), UART, USCI(2)"

Peripherals:

"BOD, DMA(1), TIMER(6), WDT"

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430G2333IN20 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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