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MSP430G2332IRSA16T

Texas Instruments

MSP430G2332IRSA16T by Texas Instruments

MSP430G2332IRSA16T by Texas Instruments is a 16-bit microcontroller with 4096 ROM words and 256 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring low power consumption. Features include 8 ADC channels, 8 PWM channels, and connectivity options like I2C, SPI, USI for versatile integration.

Median Price

$1.714

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,000 parts In-Stock

1+ parts

$1.803

100+ parts

$1.489

1k+ parts

$0.805

10k+ parts

-

2,000

$1.803

$1.489

$0.805

-

Rochester

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$1.570

1k+ parts

$1.300

10k+ parts

$1.160

1,000

-

$1.570

$1.300

$1.160

DigiKey

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.960

10k+ parts

-

1,000

-

-

$1.960

-

Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.625

10k+ parts

$1.450

1,000

-

-

$1.625

$1.450

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,667 parts In-Stock

1+ parts

$1.064

100+ parts

-

1k+ parts

-

10k+ parts

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3,667

$1.064

-

-

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Vyrian

USA . 6,876 parts In-Stock

1+ parts

-

100+ parts

-

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6,876

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-

-

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DigiKey Marketplace

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$1.160

1k+ parts

-

10k+ parts

-

1,000

-

$1.160

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,221 parts In-Stock

1+ parts

$1.008

100+ parts

-

1k+ parts

-

10k+ parts

-

1,221

$1.008

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-

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Parana Technologies

USA . 1,513 parts In-Stock

1+ parts

$54.100

100+ parts

-

1k+ parts

-

10k+ parts

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1,513

$54.100

-

-

-

DigiPath Technology Company

USA . 1,950 parts In-Stock

1+ parts

$59.570

100+ parts

-

1k+ parts

-

10k+ parts

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1,950

$59.570

-

-

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ChromeModa Solutions

Germany . 4,509 parts In-Stock

1+ parts

$60.786

100+ parts

$49.845

1k+ parts

-

10k+ parts

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4,509

$60.786

$49.845

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-

IDEA Electronic Components Group

UK . 1,827 parts In-Stock

1+ parts

$60.786

100+ parts

$57.747

1k+ parts

$54.707

10k+ parts

-

1,827

$60.786

$57.747

$54.707

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QUARKTWIN TECHNOLOGY LTD

USA . 18,051 parts In-Stock

1+ parts

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100+ parts

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18,051

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Overview

Unlock endless possibilities with the Texas Instruments MSP430G2332IRSA16T microcontroller. Designed with precision and innovation, this powerful chip offers unparalleled performance in various applications. From industrial control systems to consumer electronics, this microcontroller is the perfect solution for your project. Experience the reliability, efficiency, and flexibility that Texas Instruments is known for, and take your designs to the next level with the MSP430G2332IRSA16T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for various environments.

Maximum Supply Voltage: 3.6 V

Allows for higher voltage applications and flexibility in power supply options.

Bit Size: 16

Provides a relatively large bit size, allowing for complex calculations and operations.

ADC Channels: YES

The presence of Analog to Digital Convertor channels enables the microcontroller to interface with analog sensors and devices.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizing a Reduced Instruction Set Computer (RISC) architecture for efficient and streamlined processing.

ROM Programmability: FLASH

Flash programmability allows for easy updating and reprogramming of the microcontroller's read-only memory.

Low Power Mode: YES

Enables the microcontroller to conserve energy and operate efficiently in battery-powered or low-power applications.

Technical Specifications

Microcontrollers MSP430G2332IRSA16T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES 1.8 V MINIMUM SUPPLY AT 6 MHZ AND 2.7 V MINIMUM SUPPLY AT 12 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

4 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

1

No. of I/O Lines:

10

No. of Serial I/Os:

0

No. of Terminals:

16

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.4 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, SPI, USI"

Peripherals:

"BOD, DMA(1), TIMER(4), WDT"

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430G2332IRSA16T Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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