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MSP430G2332IN20

Texas Instruments

MSP430G2332IN20 by Texas Instruments

MSP430G2332IN20 by Texas Instruments is a 16-bit microcontroller with 8KB Flash ROM and 256B RAM. It operates at a max frequency of 32kHz, suitable for low-power applications in industrial settings. Featuring 8 ADC channels, DMA support, and connectivity options like I2C and SPI, it's ideal for embedded systems requiring efficient data processing.

Median Price

$1.580

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,570 parts In-Stock

1+ parts

$1.716

100+ parts

$1.417

1k+ parts

$0.766

10k+ parts

-

9,570

$1.716

$1.417

$0.766

-

Mouser Electronics

USA . 181 parts In-Stock

1+ parts

$2.860

100+ parts

$1.750

1k+ parts

$1.540

10k+ parts

$1.460

181

$2.860

$1.750

$1.540

$1.460

Rochester

USA . 17,896 parts In-Stock

1+ parts

-

100+ parts

$1.200

1k+ parts

$1.070

10k+ parts

$1.010

17,896

-

$1.200

$1.070

$1.010

DigiKey

USA . 17,896 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.580

10k+ parts

-

17,896

-

-

$1.580

-

Verical

USA . 17,360 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.337

10k+ parts

$1.262

17,360

-

-

$1.337

$1.262

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,699 parts In-Stock

1+ parts

$1.102

100+ parts

-

1k+ parts

-

10k+ parts

-

3,699

$1.102

-

-

-

Bristol Electronics

USA . 170 parts In-Stock

1+ parts

$2.664

100+ parts

$1.652

1k+ parts

$1.332

10k+ parts

-

170

$2.664

$1.652

$1.332

-

Vyrian

USA . 6,633 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,633

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 170 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

170

-

-

-

-

Dan-Mar Components

USA . 170 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

170

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,492 parts In-Stock

1+ parts

$1.044

100+ parts

-

1k+ parts

-

10k+ parts

-

3,492

$1.044

-

-

-

Parana Technologies

USA . 116 parts In-Stock

1+ parts

$44.356

100+ parts

-

1k+ parts

-

10k+ parts

-

116

$44.356

-

-

-

IDEA Electronic Components Group

UK . 2,308 parts In-Stock

1+ parts

$49.838

100+ parts

$47.346

1k+ parts

$44.854

10k+ parts

-

2,308

$49.838

$47.346

$44.854

-

ChromeModa Solutions

Germany . 51 parts In-Stock

1+ parts

$49.838

100+ parts

$40.867

1k+ parts

-

10k+ parts

-

51

$49.838

$40.867

-

-

DigiPath Technology Company

USA . 1,795 parts In-Stock

1+ parts

-

100+ parts

$44.934

1k+ parts

-

10k+ parts

-

1,795

-

$44.934

-

-

Perfect Parts

USA . 802 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

802

-

-

-

-

Overview

Enhance your projects with the MSP430G2332IN20 by Texas Instruments, a top-quality microcontroller offering unparalleled performance and reliability. With advanced features like ADC channels, DMA channels, and multiple timers, this device is perfect for a wide range of applications. Texas Instruments' reputation for excellence ensures that you are getting a product that delivers exceptional value and benefits. Upgrade your designs and experience the advantages of this cutting-edge microcontroller today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the microcontroller, making it suitable for a variety of applications.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of systems.

ADC Channels: YES

The presence of analog to digital converters allows for efficient conversion of analog signals, enabling the microcontroller to accurately process sensor data.

Connectivity: I2C, SPI, USI

Multiple connectivity options like I2C, SPI, and USI provide flexibility in interfacing with other devices, expanding the potential applications of the microcontroller.

Low Power Mode: YES

The low power mode feature helps in conserving energy and extending battery life, making the microcontroller suitable for battery-powered applications.

Technical Specifications

Microcontrollers MSP430G2332IN20 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES 1.8 V MINIMUM SUPPLY AT 6 MHZ AND 2.7 V MINIMUM SUPPLY AT 12 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e4

Length:

24.33 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

1

No. of I/O Lines:

16

No. of Serial I/Os:

0

No. of Terminals:

20

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

5.08 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.4 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.35 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, SPI, USI"

Peripherals:

"BOD, DMA(1), TIMER(4), WDT"

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430G2332IN20 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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