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MSP430G2313IRHB32T

Texas Instruments

MSP430G2313IRHB32T by Texas Instruments

MSP430G2313IRHB32T by Texas Instruments is a 16-bit microcontroller with 4096 ROM words and 256 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption and connectivity via I2C, SPI, UART, and more. With DMA channels and PWM support, it offers efficient data handling and control capabilities in a compact chip carrier package.

Median Price

$1.817

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,000 parts In-Stock

1+ parts

$1.817

100+ parts

$1.500

1k+ parts

$0.811

10k+ parts

-

2,000

$1.817

$1.500

$0.811

-

DigiKey

USA . 440 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

440

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,339 parts In-Stock

1+ parts

$1.726

100+ parts

-

1k+ parts

-

10k+ parts

-

1,339

$1.726

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Vyrian

USA . 8,434 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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8,434

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,874 parts In-Stock

1+ parts

$1.635

100+ parts

-

1k+ parts

-

10k+ parts

-

2,874

$1.635

-

-

-

Microchip USA

USA . 1,778 parts In-Stock

1+ parts

$10.650

100+ parts

$10.580

1k+ parts

$10.550

10k+ parts

$10.520

1,778

$10.650

$10.580

$10.550

$10.520

Parana Technologies

USA . 831 parts In-Stock

1+ parts

$56.009

100+ parts

-

1k+ parts

-

10k+ parts

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831

$56.009

-

-

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DigiPath Technology Company

USA . 1,015 parts In-Stock

1+ parts

$61.672

100+ parts

-

1k+ parts

-

10k+ parts

-

1,015

$61.672

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-

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IDEA Electronic Components Group

UK . 1,865 parts In-Stock

1+ parts

$62.931

100+ parts

$59.784

1k+ parts

$56.638

10k+ parts

-

1,865

$62.931

$59.784

$56.638

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ChromeModa Solutions

Germany . 1,718 parts In-Stock

1+ parts

$62.931

100+ parts

$51.603

1k+ parts

-

10k+ parts

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1,718

$62.931

$51.603

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Overview

Unlock endless possibilities with the MSP430G2313IRHB32T by Texas Instruments, a high-quality microcontroller designed to meet your needs. From industrial automation to consumer electronics, this versatile chip offers unmatched performance and reliability. With its innovative features and low power consumption, this product provides value and benefits that will elevate your projects to the next level. Experience the advantages of Texas Instruments' expertise in microcontroller technology and take your designs to new heights with the MSP430G2313IRHB32T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material combination offers durability and reliability for the microcontroller package, making it suitable for various applications.

Maximum Supply Voltage: 3.6 V

Being able to handle a maximum supply voltage of 3.6 V allows for flexibility in power supply options and compatibility with different systems.

RAM Bytes: 256

With a generous amount of RAM, this microcontroller can efficiently handle data processing and storage requirements for complex tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller efficient and reliable for a wide range of applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of this microcontroller allows for high performance and efficient instruction execution, making it a powerful choice for applications requiring fast processing speeds.

Connectivity: I2C, IRDA, LIN, SPI, UART, USCI(2)

With multiple connectivity options, this microcontroller can easily communicate with a variety of devices and peripherals, enhancing its versatility for different applications.

Maximum Clock Frequency: 16 MHz

The high maximum clock frequency allows for fast processing speeds, making the microcontroller suitable for applications that require quick data processing and response times.

Low Power Mode: YES

The low power mode feature helps conserve energy, making the microcontroller suitable for battery-operated devices or applications requiring power efficiency.

Technical Specifications

Microcontrollers MSP430G2313IRHB32T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES AT 1.8V AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

1

No. of I/O Lines:

24

No. of Serial I/Os:

1

No. of Terminals:

32

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.42 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI, UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR(8), DMA(1), TIMER(2), WDT"

Trade Compliance

MSP430G2313IRHB32T Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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