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MSP430G2313IRHB32R

Texas Instruments

MSP430G2313IRHB32R by Texas Instruments

MSP430G2313IRHB32R by Texas Instruments is a 16-bit microcontroller with 4096 ROM words and 256 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption and connectivity via I2C, SPI, UART, and more. With DMA channels and PWM support, it offers versatile peripheral options for efficient data processing.

Median Price

$1.593

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,480 parts In-Stock

1+ parts

$1.593

100+ parts

$1.315

1k+ parts

$0.711

10k+ parts

-

5,480

$1.593

$1.315

$0.711

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,521 parts In-Stock

1+ parts

$1.513

100+ parts

-

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4,521

$1.513

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Vyrian

USA . 7,103 parts In-Stock

1+ parts

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7,103

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Prism Electronics

USA . 2,832 parts In-Stock

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2,832

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,982 parts In-Stock

1+ parts

$1.434

100+ parts

-

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1,982

$1.434

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Microchip USA

USA . 1,537 parts In-Stock

1+ parts

$6.301

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1,537

$6.301

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AZTECH Wire

Italy . 483 parts In-Stock

1+ parts

$20.140

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483

$20.140

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Parana Technologies

USA . 1,074 parts In-Stock

1+ parts

$21.793

100+ parts

-

1k+ parts

$22.261

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1,074

$21.793

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$22.261

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DigiPath Technology Company

USA . 1,203 parts In-Stock

1+ parts

$23.996

100+ parts

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1,203

$23.996

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ChromeModa Solutions

Germany . 6,388 parts In-Stock

1+ parts

$24.486

100+ parts

$20.079

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6,388

$24.486

$20.079

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IDEA Electronic Components Group

UK . 1,833 parts In-Stock

1+ parts

$24.486

100+ parts

$23.262

1k+ parts

$22.037

10k+ parts

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1,833

$24.486

$23.262

$22.037

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Component Stockers USA

USA . 5,344 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.770

10k+ parts

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5,344

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$0.770

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A-Z Elektronik GmbH

Germany . 5,232 parts In-Stock

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5,232

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Overview

Unlock the power of innovation with the MSP430G2313IRHB32R microcontroller from Texas Instruments. Designed for high-quality performance, this chip is perfect for a wide range of applications. With its low power consumption and advanced features such as DMA channels and boundary scan, this microcontroller offers exceptional value to customers looking to create cutting-edge solutions. Trust in Texas Instruments' reputation for excellence and elevate your project to new heights with the MSP430G2313IRHB32R.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and protection for the microcontroller, making it a reliable choice for various applications.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can handle various power requirements efficiently.

ROM Words: 4096

With a large ROM capacity of 4096 words, this microcontroller can store and execute complex programs seamlessly.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller ensures efficient and high-speed processing, suitable for applications requiring quick response times.

Connectivity: I2C, IRDA, LIN, SPI, UART, USCI(2)

Multiple connectivity options such as I2C, IRDA, LIN, SPI, UART, and USCI(2) enable easy integration with other devices and systems.

Low Power Mode: YES

The low power mode feature helps in conserving energy, making the microcontroller suitable for battery-powered or energy-efficient applications.

Technical Specifications

Microcontrollers MSP430G2313IRHB32R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES AT 1.8V AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

1

No. of I/O Lines:

24

No. of Serial I/Os:

1

No. of Terminals:

32

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.42 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI, UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR(8), DMA(1), TIMER(2), WDT"

Trade Compliance

MSP430G2313IRHB32R Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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