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MSP430G2313IPW20R

Texas Instruments

MSP430G2313IPW20R by Texas Instruments

MSP430G2313IPW20R by Texas Instruments is a 16-bit microcontroller with 4096 ROM words and 256 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption and connectivity via I2C, SPI, UART.

Median Price

$1.129

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,500 parts In-Stock

1+ parts

$1.129

100+ parts

$0.932

1k+ parts

$0.504

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3,500

$1.129

$0.932

$0.504

-

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Digiode

USA . 4,301 parts In-Stock

1+ parts

$1.073

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4,301

$1.073

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Vyrian

USA . 4,473 parts In-Stock

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4,473

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Chip Stock

USA . 3,500 parts In-Stock

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Corphita

USA . 2,319 parts In-Stock

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$1.016

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2,319

$1.016

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Microchip USA

USA . 2,524 parts In-Stock

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$4.467

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2,524

$4.467

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AZTECH Wire

Italy . 707 parts In-Stock

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$15.020

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707

$15.020

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Parana Technologies

USA . 2,033 parts In-Stock

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$55.220

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2,033

$55.220

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ChromeModa Solutions

Germany . 3,608 parts In-Stock

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$62.045

100+ parts

$50.877

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3,608

$62.045

$50.877

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IDEA Electronic Components Group

UK . 1,592 parts In-Stock

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$62.045

100+ parts

$58.943

1k+ parts

$55.840

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1,592

$62.045

$58.943

$55.840

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Component Stockers USA

USA . 15,048 parts In-Stock

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DigiPath Technology Company

USA . 2,163 parts In-Stock

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$55.940

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2,163

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$55.940

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Kepictronics

USA . 898 parts In-Stock

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Futuretech Components

Singapore . 825 parts In-Stock

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Overview

Unlock the power of innovation with the MSP430G2313IPW20R by Texas Instruments. As a leader in the microcontroller industry, Texas Instruments delivers top-quality products that exceed expectations. The MSP430G2313IPW20R is perfect for a wide range of applications due to its versatility and reliability. With features like low power mode, DMA channels, and connectivity options including I2C and SPI, this microcontroller offers unmatched value and performance. Experience seamless integration and enhanced functionality with the MSP430G2313IPW20R - the ultimate choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various environments and applications.

Surface Mount: YES

Surface mount technology allows for easy integration into circuit boards, saving space and making assembly more efficient.

Maximum Supply Voltage: 3.6 V

With a higher maximum supply voltage, this microcontroller can handle a wide range of power sources, increasing versatility.

On Chip Data RAM Width: 8

Having an 8-bit data RAM width allows for efficient handling of data within the microcontroller, improving performance.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easy to place and secure on a circuit board, optimizing space usage.

Bit Size: 16

A 16-bit microcontroller offers higher computational power and precision, making it suitable for complex applications.

Power Supplies (V): 2/3.3

Support for both 2V and 3.3V power supplies offers flexibility in voltage requirements for different components in a system.

No. of Terminals: 20

With 20 terminals, this microcontroller can connect to a variety of external devices and peripherals, enhancing functionality.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and slim design of the package saves space on the PCB and allows for efficient thermal management.

Minimum Supply Voltage: 3.3 V

A minimum supply voltage of 3.3V ensures reliable operation even under low power conditions, enhancing stability.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows this microcontroller to function in harsh industrial environments without overheating.

CPU Family: MSP430

Being part of the MSP430 family ensures compatibility with other MSP430 devices, facilitating development and integration.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range enables this microcontroller to operate in extreme cold conditions without performance degradation.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections for long-term use.

DMA Channels: YES

Having Direct Memory Access (DMA) channels improves data transfer speed and efficiency, enhancing overall system performance.

Terminal Position: DUAL

Dual terminal positions allow for more flexible PCB layout designs, accommodating different board shapes and sizes.

ROM Words: 4096

With 4096 ROM words, this microcontroller can store a large amount of program instructions, enabling complex applications to run smoothly.

Maximum Seated Height: 1.2 mm

The low seated height of 1.2mm makes this microcontroller suitable for compact electronic devices and applications with tight space constraints.

RAM Words: 0.25

0.25 RAM words offer sufficient memory capacity for data storage and processing in various applications, ensuring smooth operation.

Width: 4.4 mm

The narrow width of 4.4mm allows for high-density PCB designs and efficient use of space in electronic systems.

Boundary Scan: YES

Support for boundary scan testing allows for efficient debugging and testing of the microcontroller during development and production stages.

Peripherals: BOD, COMPARATOR(8), DMA(1), TIMER(2), WDT

The variety of peripherals like Brown-Out Detector (BOD), comparators, DMA, timers, and Watchdog Timer (WDT) enhance the capabilities of this microcontroller for diverse applications.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16MHz allows for fast processing and execution of instructions, improving the overall performance of the microcontroller.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature of 260°C, this microcontroller can endure the reflow soldering process without damage, ensuring reliable solder joints.

Length: 6.5 mm

The length of 6.5mm offers a compact form factor for the microcontroller, enabling integration into small electronic devices and systems.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures stable operation in harsh industrial environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller with various peripherals, it offers high performance, efficient processing, and flexibility for diverse applications.

No. of Timers: 2

Having two timers allows for precise timekeeping, event scheduling, and control in applications requiring timing functionality.

RAM Bytes: 256

With 256 bytes of RAM, this microcontroller provides ample memory for storing and processing data during program execution, enhancing efficiency.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with various digital systems, making this microcontroller energy-efficient and versatile.

Terminal Form: GULL WING

The Gull Wing terminal form ensures easy soldering and strong mechanical connections, improving reliability and durability in assembly processes.

Maximum Supply Current: 0.42 mA

With a low maximum supply current of 0.42mA, this microcontroller consumes minimal power, making it suitable for battery-powered devices and energy-efficient applications.

PWM Channels: YES

Support for Pulse Width Modulation (PWM) channels enables precise control of analog signals, making this microcontroller ideal for motor control, power management, and other applications requiring variable voltage levels.

Connectivity: I2C, IRDA, LIN, SPI, UART, USCI(2)

Offering multiple communication interfaces such as I2C, IRDA, LIN, SPI, UART, and USCI, this microcontroller provides versatile connectivity options for interfacing with various external devices and peripherals.

ROM Programmability: FLASH

Flash programmability allows for easy and quick reprogramming of the microcontroller's memory, enabling firmware updates, customization, and flexibility in application development.

Terminal Pitch: 0.65 mm

The fine terminal pitch of 0.65mm enables high-density packaging and precise connections on the PCB, contributing to efficient board layout and design.

Format: FIXED POINT

Being a fixed-point format microcontroller, it offers efficient arithmetic operations and memory usage for a wide range of numerical calculations and algorithms.

Speed: 16 rpm

With a speed of 16 rotations per minute (rpm), this microcontroller can handle tasks that require precise timing and control, such as motor speed regulation and automated systems.

Low Power Mode: YES

Support for low power mode enhances energy efficiency and prolongs battery life in portable devices or applications requiring standby operation.

On Chip Program ROM Width: 8

Having an 8-bit program ROM width allows for efficient storage and retrieval of program instructions within the microcontroller, enhancing program execution speed.

No. of I/O Lines: 16

Having 16 I/O lines provides sufficient interfaces for connecting to external devices, sensors, and peripherals, enabling versatile input/output capabilities in various applications.

Technical Specifications

Microcontrollers MSP430G2313IPW20R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES AT 1.8V AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

1

No. of I/O Lines:

16

No. of Serial I/Os:

1

No. of Terminals:

20

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.42 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI, UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR(8), DMA(1), TIMER(2), WDT"

Trade Compliance

MSP430G2313IPW20R Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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