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MSP430G2313IPW20

Texas Instruments

MSP430G2313IPW20 by Texas Instruments

MSP430G2313IPW20 by Texas Instruments is a 16-bit microcontroller with 4096 ROM words and 256 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption and connectivity via I2C, SPI, UART, and more. The package style is small outline with dual terminal position and boundary scan feature.

Median Price

$1.718

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 70 parts In-Stock

1+ parts

$0.760

100+ parts

$0.740

1k+ parts

$0.730

10k+ parts

-

70

$0.760

$0.740

$0.730

-

Texas Instruments

USA . 3,090 parts In-Stock

1+ parts

$1.355

100+ parts

$1.119

1k+ parts

$0.605

10k+ parts

-

3,090

$1.355

$1.119

$0.605

-

DigiKey

USA . 515 parts In-Stock

1+ parts

$2.080

100+ parts

$1.281

1k+ parts

$1.169

10k+ parts

-

515

$2.080

$1.281

$1.169

-

Mouser Electronics

USA . 419 parts In-Stock

1+ parts

$2.080

100+ parts

$1.210

1k+ parts

$1.160

10k+ parts

$1.090

419

$2.080

$1.210

$1.160

$1.090

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,232 parts In-Stock

1+ parts

$0.798

100+ parts

-

1k+ parts

-

10k+ parts

-

2,232

$0.798

-

-

-

Bristol Electronics

USA . 210 parts In-Stock

1+ parts

$1.978

100+ parts

$1.226

1k+ parts

$0.989

10k+ parts

-

210

$1.978

$1.226

$0.989

-

Vyrian

USA . 5,647 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,647

-

-

-

-

Chip Stock

USA . 5,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,200

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 210 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

210

-

-

-

-

ComSIT Distribution GmbH

Germany . 210 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

210

-

-

-

-

Dan-Mar Components

USA . 210 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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210

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,364 parts In-Stock

1+ parts

$0.756

100+ parts

-

1k+ parts

-

10k+ parts

-

2,364

$0.756

-

-

-

Microchip USA

USA . 2,282 parts In-Stock

1+ parts

$11.700

100+ parts

$11.630

1k+ parts

$11.590

10k+ parts

$11.560

2,282

$11.700

$11.630

$11.590

$11.560

Parana Technologies

USA . 1,491 parts In-Stock

1+ parts

$43.152

100+ parts

-

1k+ parts

-

10k+ parts

-

1,491

$43.152

-

-

-

DigiPath Technology Company

USA . 1,680 parts In-Stock

1+ parts

$47.515

100+ parts

-

1k+ parts

-

10k+ parts

-

1,680

$47.515

-

-

-

ChromeModa Solutions

Germany . 2,060 parts In-Stock

1+ parts

$48.485

100+ parts

$39.758

1k+ parts

-

10k+ parts

-

2,060

$48.485

$39.758

-

-

IDEA Electronic Components Group

UK . 2,023 parts In-Stock

1+ parts

$48.485

100+ parts

$46.061

1k+ parts

$43.636

10k+ parts

-

2,023

$48.485

$46.061

$43.636

-

Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

Overview

Unlock the possibilities with the Texas Instruments MSP430G2313IPW20 microcontroller. Crafted with precision and expertise, this small yet powerful device offers unparalleled performance in a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers efficiency and reliability like no other. With its advanced features and low power consumption, the MSP430G2313IPW20 is the perfect choice for your next project. Experience the quality and innovation that only Texas Instruments can provide, and take your designs to the next level with this exceptional microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and helps in protecting the microcontroller from external elements, making it long-lasting.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of peripherals.

CPU Family: MSP430

MSP430 family is known for its low power consumption and high performance, making this microcontroller energy-efficient and reliable for various applications.

ROM Programmability: FLASH

Flash programmability enables easy reprogramming of the microcontroller, allowing for quick updates and enhancements without replacing the hardware.

Connectivity: I2C, IRDA, LIN, SPI, UART, USCI(2)

Multiple connectivity options make it easier to interface the microcontroller with other devices, expanding its functionality and usability.

Maximum Clock Frequency: 16 MHz

High clock frequency allows for fast processing speed, making this microcontroller suitable for applications that require quick response times.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides simplicity and efficiency in processing instructions, leading to high performance and reduced power consumption.

Technical Specifications

Microcontrollers MSP430G2313IPW20 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES AT 1.8V AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

1

No. of I/O Lines:

16

No. of Serial I/Os:

1

No. of Terminals:

20

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.42 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI, UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR(8), DMA(1), TIMER(2), WDT"

Trade Compliance

MSP430G2313IPW20 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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