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MSP430G2312IPW20

Texas Instruments

MSP430G2312IPW20 by Texas Instruments

MSP430G2312IPW20 by Texas Instruments is a 16-bit microcontroller with 4096 ROM words and 256 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption and connectivity via I2C, SPI, USI interfaces.

Median Price

$1.494

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 76,470 parts In-Stock

1+ parts

$1.494

100+ parts

$1.234

1k+ parts

$0.667

10k+ parts

-

76,470

$1.494

$1.234

$0.667

-

DigiKey

USA . 477 parts In-Stock

1+ parts

$2.080

100+ parts

$1.283

1k+ parts

$1.171

10k+ parts

-

477

$2.080

$1.283

$1.171

-

Arrow

USA . 20,720 parts In-Stock

1+ parts

-

100+ parts

$0.890

1k+ parts

-

10k+ parts

-

20,720

-

$0.890

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,157 parts In-Stock

1+ parts

$1.330

100+ parts

-

1k+ parts

-

10k+ parts

-

2,157

$1.330

-

-

-

Vyrian

USA . 5,690 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,690

-

-

-

-

Bristol Electronics

USA . 210 parts In-Stock

1+ parts

-

100+ parts

$1.326

1k+ parts

$0.796

10k+ parts

-

210

-

$1.326

$0.796

-

Dan-Mar Components

USA . 210 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

210

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,924 parts In-Stock

1+ parts

$1.260

100+ parts

-

1k+ parts

-

10k+ parts

-

1,924

$1.260

-

-

-

Component Stockers USA

USA . 145,828 parts In-Stock

1+ parts

$1.950

100+ parts

$1.340

1k+ parts

$0.720

10k+ parts

$0.720

145,828

$1.950

$1.340

$0.720

$0.720

Parana Technologies

USA . 246 parts In-Stock

1+ parts

$37.188

100+ parts

-

1k+ parts

-

10k+ parts

-

246

$37.188

-

-

-

DigiPath Technology Company

USA . 97 parts In-Stock

1+ parts

$40.948

100+ parts

$37.672

1k+ parts

-

10k+ parts

-

97

$40.948

$37.672

-

-

ChromeModa Solutions

Germany . 4,798 parts In-Stock

1+ parts

$41.784

100+ parts

$34.263

1k+ parts

-

10k+ parts

-

4,798

$41.784

$34.263

-

-

IDEA Electronic Components Group

UK . 1,859 parts In-Stock

1+ parts

$41.784

100+ parts

$39.695

1k+ parts

$37.606

10k+ parts

-

1,859

$41.784

$39.695

$37.606

-

Perfect Parts

USA . 1,351 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,351

-

-

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,000

-

-

-

-

Overview

Unlock the power of innovation with the Texas Instruments MSP430G2312IPW20 microcontroller. Designed with precision and quality in mind, this versatile device is perfect for a wide range of applications in industries such as automotive, consumer electronics, and industrial automation. With its advanced technology and low power consumption, this microcontroller offers exceptional value and performance to customers looking to bring their projects to life. Discover endless possibilities with the MSP430G2312IPW20 and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for various environments.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with a wide range of systems.

CPU Family: MSP430

The MSP430 family is known for its low power consumption and high performance, making it a reliable choice for energy-efficient applications.

ADC Channels: YES

Integrated Analog-to-Digital Converter channels enable precise and accurate data conversion for sensor applications.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming of the microcontroller, providing flexibility for firmware updates and customization.

Connectivity: I2C, SPI, USI

Support for common communication protocols enables seamless integration with other devices and peripherals.

Low Power Mode: YES

Ability to operate in low power modes helps conserve energy and prolong battery life in battery-powered applications.

Technical Specifications

Microcontrollers MSP430G2312IPW20 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 6MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of I/O Lines:

16

No. of Serial I/Os:

0

No. of Terminals:

20

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.4 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, SPI, USI"

Peripherals:

"BOD, COMPARATOR(8), TIMER(4), WDT"

Trade Compliance

MSP430G2312IPW20 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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