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MSP430G2303IRHB32R

Texas Instruments

MSP430G2303IRHB32R by Texas Instruments

MSP430G2303IRHB32R by Texas Instruments is a 16-bit microcontroller with 4096 ROM words and 256 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring low power consumption and connectivity via I2C, IRDA, SPI(2), UART, USCI(2).

Median Price

$1.241

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 13,850 parts In-Stock

1+ parts

$1.241

100+ parts

$1.025

1k+ parts

$0.554

10k+ parts

-

13,850

$1.241

$1.025

$0.554

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,707 parts In-Stock

1+ parts

$1.179

100+ parts

-

1k+ parts

-

10k+ parts

-

4,707

$1.179

-

-

-

Vyrian

USA . 6,370 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,370

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,994 parts In-Stock

1+ parts

$1.117

100+ parts

-

1k+ parts

-

10k+ parts

-

1,994

$1.117

-

-

-

Microchip USA

USA . 2,399 parts In-Stock

1+ parts

$4.910

100+ parts

-

1k+ parts

-

10k+ parts

-

2,399

$4.910

-

-

-

AZTECH Wire

Italy . 419 parts In-Stock

1+ parts

$10.530

100+ parts

-

1k+ parts

-

10k+ parts

-

419

$10.530

-

-

-

Parana Technologies

USA . 250 parts In-Stock

1+ parts

$32.626

100+ parts

-

1k+ parts

$110.022

10k+ parts

-

250

$32.626

-

$110.022

-

ChromeModa Solutions

Germany . 3,939 parts In-Stock

1+ parts

$36.658

100+ parts

$30.060

1k+ parts

-

10k+ parts

-

3,939

$36.658

$30.060

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IDEA Electronic Components Group

UK . 53 parts In-Stock

1+ parts

$36.658

100+ parts

$34.825

1k+ parts

$32.992

10k+ parts

-

53

$36.658

$34.825

$32.992

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DigiPath Technology Company

USA . 96 parts In-Stock

1+ parts

-

100+ parts

$33.051

1k+ parts

-

10k+ parts

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96

-

$33.051

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-

Overview

Unlock endless possibilities with the MSP430G2303IRHB32R by Texas Instruments, a high-quality microcontroller designed for industrial applications. With its advanced technology and low power consumption, this compact chip offers unmatched performance and efficiency. From controlling sensors to managing power systems, this versatile device provides the reliability and precision you need to streamline your operations. Trust in Texas Instruments to deliver cutting-edge solutions that elevate your projects to new heights. Experience the difference with the MSP430G2303IRHB32R and revolutionize your designs today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for various applications and environments.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of systems.

Minimum Operating Temperature: -40 °C

Ability to operate in extreme low temperatures makes this microcontroller suitable for harsh environments or outdoor applications.

ROM Programmability: FLASH

Flash ROM programmability enables easy and flexible updates to the microcontroller's firmware, allowing for customization and future-proofing.

Connectivity: I2C, IRDA, SPI(2), UART, USCI(2)

Versatile connectivity options enable seamless integration with various communication protocols and devices, enhancing the microcontroller's usability.

Technical Specifications

Microcontrollers MSP430G2303IRHB32R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of I/O Lines:

24

No. of Serial I/Os:

2

No. of Terminals:

32

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.42 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SPI(2), UART, USCI(2)"

Peripherals:

"BOD, TIMER(6), WDT"

Trade Compliance

MSP430G2303IRHB32R Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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